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    • 31. 发明公开
    • 반도체 장치와 그 제조 방법
    • 半导体器件及其制造方法
    • KR1020050085196A
    • 2005-08-29
    • KR1020057009649
    • 2003-04-10
    • 후지쯔 가부시끼가이샤
    • 에마다이지고지마히데유키아네자키도루
    • H01L27/088H01L29/78
    • Multiple kinds of transistors exhibiting desired characteristics are manufactured in fewer process steps. A semiconductor device includes an element isolation region reaching a first depth, first and second wells of first conductivity type, a first transistor formed in the first well and having a gate isolation film of a first thickness, source/drain regions of second conductivity type and a gate electrode, and a second transistor formed in the second well and having a gate isolation film of a second thickness less than the first thickness, source/drain regions of the second conductivity type and a gate electrode. The first well has a first impunity concentration distribution which shows a maximum value only at the depth equal to or greater than the first depth. The second well has a second impurity concentration distribution which shows a maximum value also at the second depth. The second impurity concentration distribution is superposition of an impurity concentration distribution which shows a maximum value at a second depth less than the first depth on the first impurity concentration distribution.
    • 具有期望特性的多种晶体管以较少的工艺步骤制造。 半导体器件包括到达第一深度的元件隔离区域,第一导电类型的第一和第二阱,形成在第一阱中的第一晶体管,并具有第一厚度的栅极隔离膜,第二导电类型的源极/漏极区域,以及 栅电极和形成在第二阱中的第二晶体管,并且具有第二厚度小于第一厚度的栅极隔离膜,第二导电类型的源/漏区和栅电极。 第一口井有第一个有罪不罚的浓度分布,仅在深度等于或大于第一深度的深度处显示最大值。 第二阱具有第二杂质浓度分布,其也在第二深度处显示最大值。 第二杂质浓度分布是杂质浓度分布的叠加,其在比第一杂质浓度分布上的第一深度小的第二深度处显示最大值。