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    • 32. 发明公开
    • 유기 발광 표시 장치 및 그 제조 방법
    • 有机发光显示装置及其制造方法
    • KR1020080063539A
    • 2008-07-07
    • KR1020070000055
    • 2007-01-02
    • 삼성전자주식회사
    • 이동원추창웅이정수
    • H05B33/22
    • H01L27/3246H01L51/0003H01L51/5088H01L51/56
    • An organic light emitting diode device and a method for manufacturing the same are provided to obtain a hole injection layer with high flatness by forming the hole injection layer by a spin coating method not an ink-jet printing method by using an insulating member. A substrate(101) has a plurality of pixel regions. A switch thin film transistor(T1) is formed on each of the pixel regions. A drive thin film transistor(T2) is connected to the switch thin film transistor. An organic film is formed on upper parts of the switch thin film transistor and the driving thin film transistor and includes contact holes(128,129) to expose drain electrodes(115,125) of the drive thin film transistor. An anode(130) is formed on the organic film and connected to the drain electrodes of the drive thin film transistor through the contact holes. A hole injection layer(135) is coated on an entire surface of the organic film. An organic light emitting layer(134) is formed on the hole injection layer. A cathode(136) is formed on the organic light emitting layer. An insulating member(137) is positioned between the anode and the cathode and covers a portion adjacent to the contact holes.
    • 提供了一种有机发光二极管装置及其制造方法,通过使用绝缘构件的喷墨印刷方法,通过旋涂方法形成空穴注入层来获得高平坦度的空穴注入层。 衬底(101)具有多个像素区域。 在每个像素区域上形成开关薄膜晶体管(T1)。 驱动薄膜晶体管(T2)连接到开关薄膜晶体管。 在开关薄膜晶体管和驱动薄膜晶体管的上部形成有机膜,并且包括用于露出驱动薄膜晶体管的漏电极(115,125)的接触孔(128,129)。 阳极(130)形成在有机膜上,并通过接触孔与驱动薄膜晶体管的漏电极连接。 空穴注入层(135)被涂覆在有机膜的整个表面上。 在空穴注入层上形成有机发光层(134)。 在有机发光层上形成阴极(136)。 绝缘构件(137)位于阳极和阴极之间并且覆盖与接触孔相邻的部分。
    • 33. 发明授权
    • 표시장치의 제조방법, 이에 의한 표시장치 및 이에사용되는 제조장치
    • 用户名,密码以及注册用户名和密码不能重复使用
    • KR100676813B1
    • 2007-02-01
    • KR1020050118601
    • 2005-12-07
    • 삼성전자주식회사
    • 이동원정진구이정수
    • H05B33/10
    • A method for manufacturing a display device, a display device by the same and a manufacturing apparatus therefor are provided to prevent a deformation of a hole injection layer due to a sub jetting area by drying second inks placed on a center and a circumference of the sub jetting area respectively in a similar condition. A method for manufacturing a display device includes the steps of: forming a thin film transistor on an upper face of an insulation substrate(110); forming an electrode connected to the thin film transistor electrically; forming a partition(141) surrounding the electrode; supplying a first solvent(155) to a surface of the electrode which is surrounded by the partition(141); and supplying an ink including an organic material and a second solvent to the surface of the electrode to which the first solvent(155) is supplied already.
    • 本发明提供一种显示装置的制造方法及其显示装置及其制造装置,其通过干燥配置在该子显示装置的中心及周围的第二油墨来防止由于副喷射区域引起的空穴注入层的变形 喷射区域分别处于相似的状态。 一种用于制造显示装置的方法包括以下步骤:在绝缘衬底(110)的上表面上形成薄膜晶体管; 形成电连接到所述薄膜晶体管的电极; 形成围绕电极的隔板(141); 将第一溶剂(155)供应至由所述隔板(141)围绕的所述电极的表面; 并且将包括有机材料和第二溶剂的墨供应到已经供应第一溶剂(155)的电极的表面。
    • 34. 发明公开
    • 시스템 클럭 신호 변경 회로
    • 转换系统时钟信号电路
    • KR1020010106635A
    • 2001-12-07
    • KR1020000027475
    • 2000-05-22
    • 삼성전자주식회사
    • 이정수
    • G06F1/06
    • 본 발명은 제 1 클럭 신호와 제 2 클럭 신호 가운데 하나를 시스템 클럭 신호로 사용하기 위한 시스템 클럭 신호 선택 회로에 관한 것으로, 상기 선택 회로는, 상기 제 1 클럭 신호와 제 2 클럭 신호가 서로 동기될 때 펄스 신호를 출력하는 동기 수단, 상기 동기 회로로부터 출력되는 펄스 신호에 동기되어 상기 선택 신호를 출력 신호로 출력하는 래치 수단, 상기 래치 수단으로부터 출력되는 신호의 반전된 신호와 상기 선택 신호를 받아들여 낸드 연산하는 낸드 게이트, 상기 래치 수단으로부터 출력되는 신호와 상기 제 2 클럭 신호를 받아들여 앤드 연산하는 제 1 앤드 게이트, 상기 래치 수단으로부터 출력되는 신호의 반전된 신호, 상기 낸드 게이트로부터 출력되는 신호 그리고 상기 제 1 클럭 신호를 받아들여 앤드 연산하는 제 2 앤드 게이트, 그리고 상 기 제 1 및 제 2 앤드 게이트들의 출력 신호들을 받아들여 오아 연산하는 오아 게이트를 포함한다.
    • 35. 发明公开
    • 반도체 소자의 듀얼 게이트 절연막 형성방법
    • 用于制造半导体器件双栅绝缘膜的方法
    • KR1020010073706A
    • 2001-08-01
    • KR1020000002486
    • 2000-01-19
    • 삼성전자주식회사
    • 유재윤이정수이내인
    • H01L21/31
    • PURPOSE: A method for creating the dual gate insulating film of a semiconductor device is provided to prevent a gate insulating film damaging by performing a rinsing process after a nitrifying process. CONSTITUTION: The first gate insulating film(42) is formed on a substrate(40). A mask pattern covering the first region is formed on the first gate insulating film(42). The first gate insulating film(42) is etched to expose the substrate(40), so that the second region of the substrate(40) is exposed. A nitride film(46) is formed on the first gate insulating film(42) and the substrate(40), and a rinsing process is preformed. The second insulating film(48) is formed between the first gate insulating film(42) of the first region and the substrate(40) and between the nitride film(46) of the second region and the substrate(40). The second gate insulating film(48) is formed by oxidizing the structure on which the nitride film(46) is formed.
    • 目的:提供一种用于制造半导体器件的双栅极绝缘膜的方法,以在硝化过程之后通过执行漂洗处理来防止栅极绝缘膜损坏。 构成:第一栅极绝缘膜(42)形成在基板(40)上。 在第一栅极绝缘膜(42)上形成覆盖第一区域的掩模图案。 蚀刻第一栅极绝缘膜(42)以暴露衬底(40),使得衬底(40)的第二区域被暴露。 在第一栅极绝缘膜(42)和基板(40)上形成氮化物膜(46),进行漂洗处理。 第二绝缘膜(48)形成在第一区域的第一栅极绝缘膜(42)和基板(40)之间以及第二区域的氮化物膜(46)和基板(40)之间。 通过氧化形成有氮化膜(46)的结构,形成第二栅极绝缘膜(48)。
    • 36. 发明授权
    • 반도체 장치
    • 半导体器件
    • KR100254564B1
    • 2000-05-01
    • KR1019970071283
    • 1997-12-20
    • 삼성전자주식회사
    • 이정수
    • H01L23/52
    • H01L23/525H01L2924/0002H01L2924/00
    • PURPOSE: A semiconductor device is provided to selectively connect between pads and ports of a main circuit part. CONSTITUTION: The semiconductor device comprises a plurality of pads(PAD #0¯ PAD #i) formed in a chip, a main circuit part(100) having a plurality of I/O ports, a plurality of first interconnections(A0¯Ai), a plurality of second interconnections(B0¯Bi), a plurality of third interconnections(C0¯Ci), and a plurality of contact regions for selectively connecting the interconnections each other. One ends of the second interconnections(B0¯Bi) are connected to the pads, respectively. One ends of the third interconnections(C0¯Ci) are connected to the I/O ports, and the other ends of the third interconnections(Co¯Ci) are connected to the first interconnections, respectively.
    • 目的:提供半导体器件以选择性地连接主电路部分的焊盘和端口。 构成:半导体器件包括形成在芯片中的多个焊盘(PAD#0〜PAD #i),具有多个I / O端口的主电路部分(100),多个第一互连(A0Ai) ,多个第二互连(B0〜Bi),多个第三互连(C0〜Ci)以及用于选择性地将互连连接的多个接触区域。 第二互连(B0〜Bi)的一端分别连接到焊盘。 第三互连(C0〜Ci)的一端连接到I / O端口,第三互连(Co¯Ci)的另一端分别连接到第一互连。
    • 37. 发明公开
    • 반도체 제조 장치 및 이를 이용한 절연막 제조방법
    • 用于制造半导体的器件和形成绝缘膜的方法
    • KR1020000020011A
    • 2000-04-15
    • KR1019980038409
    • 1998-09-17
    • 삼성전자주식회사
    • 이동근이정수
    • H01L21/31
    • PURPOSE: A device for manufacturing semiconductor and method for forming insulation film is provided to reduce the temperature of a wafer by injecting source gas into a reaction chamber after thermal decomposition process. CONSTITUTION: A device for manufacturing semiconductor comprises a chamber(100)containing wafers to be loaded, a main heater(104) for heating the chamber, a reaction gas injector(110) for injecting gas into the chamber, a source gas injector(108) for injecting source gas into the chamber, and a sub heater(114) positioned in outside of the chamber. The sub heater performs the thermal decomposition process to the source gas. The source gas is used to form an insulation film on the surface of the wafer.
    • 目的:提供一种用于制造半导体的器件和用于形成绝缘膜的方法,用于通过在热分解处理之后将源气体注入反应室来降低晶片的温度。 构成:半导体制造装置包括容纳待加载晶片的腔室(100),用于加热腔室的主加热器(104),用于将气体注入腔室的反应气体喷射器(110),源气体喷射器(108) ),用于将源气体注入到所述室中,以及位于所述室外部的副加热器(114)。 副加热器对源气进行热分解处理。 源气体用于在晶片的表面上形成绝缘膜。