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21. 发明公开

KR1020140084415A 비할로겐계 속경화 접착제 조성물과 이를 이용한 커버레이 필름 审中-实审
标题翻译：高速固化无卤胶粘组合物和覆膜
公开(公告)号：KR1020140084415A
公开(公告)日：2014-07-07
申请号：KR1020120153016
申请日：2012-12-26
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 엄태수 , 차세영 , 신금식
IPC分类号： C09J163/00 , C09J11/04 , C09J7/02
CPC分类号： C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/04 , C09J2201/61 , C09J2203/30
摘要： The present invention relates a high speed curing halogen-free adhesive composition and a coverlay film using the same. The high speed curing halogen-free adhesive composition is a halogen-free adhesive composition which is characterized by comprising 40-100 parts by weight of a thermoplastic resin, 5-20 parts by weight of a curing agent, 10-50 parts by weight of a phosphoric flame retardant; 10-50 parts by weight of an inorganic filling agent, for 100 parts by weight of a halogen-free epoxy resin. The high speed curing halogen-free adhesive composition does not comprise halogen not to generate a harmful gas for a human during combustion, has excellent adhesive force durability even at a low curing temperature and in a short curing time, to reduce the manufacturing costs by such as simplification of the manufacturing process and improvement of the productivity in an FPCB process when a coverlay film applying the adhesive composition is applied.
摘要翻译：本发明涉及一种高速固化无卤素粘合剂组合物和使用其的覆盖膜。高速固化无卤素粘合剂组合物是无卤素粘合剂组合物，其特征在于包含40-100重量份的热塑性树脂，5-20重量份的固化剂，10-50重量份的磷酸阻燃剂; 对于100重量份的无卤环氧树脂，为10-50重量份的无机填充剂。高速固化无卤素粘合剂组合物不包含在燃烧期间不产生人的有害气体的卤素，即使在低固化温度和短的固化时间下也具有优异的粘合力耐久性，以降低制造成本作为施加粘合剂组合物的覆盖层膜时的FPCB方法的制造过程的简化和生产率的提高。

22. 发明公开

KR1020060035285A 전자부품용 접착테이프 조성물 有权
标题翻译：电子零件用胶带组成
公开(公告)号：KR1020060035285A
公开(公告)日：2006-04-26
申请号：KR1020040084712
申请日：2004-10-22
申请人： 도레이첨단소재 주식회사
发明人： 김상필 , 전해상 , 김우석 , 차세영
IPC分类号： C09J163/00
CPC分类号： C08L13/00 , C08L61/06 , C08L63/00 , C08L2666/04 , C09J163/00 , Y10T428/1476 , Y10T428/266 , Y10T428/31721 , Y10T428/31938 , C08L2666/02
摘要： The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.
摘要翻译：另外，本发明涉及对用于构成半导体装置的电子部件，并且在电可靠性特别优异的接合电子元件，和粘合性，胶带可加工性，如铅，散热器，半导体芯片，芯片焊盘的胶带组合物具有优异性能的胶带组合物。

23. 发明公开

KR1020150069156A 반도체 다이 본딩용 양면접착 테이프 审中-实审
标题翻译：双面粘合胶带用于SIMICONDUCTOR DIE BONDING
公开(公告)号：KR1020150069156A
公开(公告)日：2015-06-23
申请号：KR1020130155242
申请日：2013-12-13
申请人： 도레이첨단소재 주식회사
发明人： 신재한 , 차세영 , 이병국 , 서기봉
IPC分类号： C09J7/02 , C09J163/00 , C09J109/00
CPC分类号： C09J7/22 , C09J7/38 , C09J109/00 , C09J163/00 , C09J2201/128
摘要： 본발명에서는폴리이미드재질의기재필름, 상기기재필름의양면에형성된접착제층, 및상기접착제층의적어도일면에형성된보호필름을포함하는다이(Die) 간결합을위한반도체다이본딩용양면접착테이프로서, 상기보호필름이 TESA7475 테이프와의박리력이 5 내지 20gf/25mm인것을특징으로하는양면접착테이프를제공한다. 본발명에따르는양면접착테이프는내열성과접착력을유지하면서도테이프풀림시보호필름과접착층이붙어테이프가늘어지거나접착층이보호필름일부에전사되는불량이발생하지않는다.
摘要翻译：本发明提供了一种用于半导体芯片接合的双面胶带，用于模具之间的接合，其中模具包含聚酰胺材料的基材膜，形成在基材膜两侧的粘合剂层和至少形成的保护膜粘合剂层的一个表面，其中保护膜相对于TESA7475胶带提供5至20gf / 25mm的剥离力。本发明的双面胶带保持耐热性和粘合强度，并且不会产生诸如带被松动的缺陷，并且当带被退绕时保护膜和粘合剂层粘合在一起; 或粘合剂层被转移到保护膜的一部分。

24. 发明公开

KR1020140080866A 반도체 다이 본딩용 양면 접착 필름 및 그 제조방법 审中-实审
标题翻译：粘合胶片和其制备方法
公开(公告)号：KR1020140080866A
公开(公告)日：2014-07-01
申请号：KR1020120149398
申请日：2012-12-20
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 엄태수 , 차세영 , 신재한
IPC分类号： H01L21/301 , H01L21/58
CPC分类号： H01L24/29 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a double-sided adhesive film capable of preventing the adhesion and electrical interference between laminated dies and ensuring a wire space. The present invention relates to a thermosetting double-sided adhesive film used in a lamination chip scale package (CSP) and a method of fabricating the same, capable of representing superior feeding properties in a film cutting work, superior heat resistance and superior adhesive strength resulting from taping and die-adhesion and preventing the failure of die cracks and the delamination of the interfacial surface resulting from moisture absorption of an internal package under high-temperature work. The double-sided adhesive film according to the present invention is used to bond dies including a polyimide film coated with an adhesive layer on both sides thereof. The adhesive layer includes an NBR containing a carboxyl group, an epoxy resin, a phenol resin, and a curing agent. A protective film is laminated on the top surface of the adhesive layer. The total thickness of the adhesive layer is 10 to 30% of the whole thickness, except for the thickness of the protective film. According the double-sided adhesive film for bonding the semiconductor die according to the present invention, the superior feeding properties according to the film supply can be represented in the state that the heat resistance and the adhesive strength of the double-sided adhesive film are maintained at the same level as that of the conventional double-sided adhesive film.
摘要翻译：本发明涉及一种能够防止层压模具之间的粘合和电干扰并确保电线空间的双面粘合膜。本发明涉及层压芯片级封装（CSP）中使用的热固性双面粘合膜及其制造方法，能够在薄膜切割作业中表现出优异的进给性能，优异的耐热性和优异的粘合强度，从胶带和模具粘合，防止模具裂纹的故障和由高温作业下的内部包装的吸湿引起的界面表面的分层。根据本发明的双面粘合膜用于在其两侧粘合包含涂覆有粘合剂层的聚酰亚胺膜的模具。粘合剂层包括含有羧基的NBR，环氧树脂，酚醛树脂和固化剂。在粘合剂层的顶表面上层压保护膜。除了保护膜的厚度之外，粘合剂层的总厚度为整个厚度的10-30％。根据本发明的半导体模具接合用双面粘合膜，可以在保持双面粘合膜的耐热性和粘合强度的状态下表示根据膜供给的良好的供给特性与常规双面粘合膜的水平相同。

25. 发明公开

KR1020130074955A 비할로겐계 접착제와 폴리에틸렌나프탈레이트 필름을 이용한 동박적층판 및 커버레이 필름 无效
标题翻译：使用非卤化物粘合剂的铜箔层压板和覆盖膜
公开(公告)号：KR1020130074955A
公开(公告)日：2013-07-05
申请号：KR1020110143100
申请日：2011-12-27
申请人： 도레이첨단소재 주식회사
发明人： 전해상 , 엄태수 , 차세영
IPC分类号： B32B15/08 , B32B7/12 , C09J163/00 , C08J5/18
摘要： PURPOSE: A copper-clad laminate and a coverlay film, which use a non-halogen type adhesive and a polyethylene naphthalate film, are provided to prevent the generation of a gas harmful to a human body during combustion by using an adhesive layer not containing halogen, to reduce manufacturing costs, and to obtain a copper-clad laminate and a coverlay film, which can be applied to a process, etc. requiring ultraviolet (UV) hardening, etc. CONSTITUTION: An electric insulation film, an adhesive composition spread on the film, and a copper foil are successively laminated for a copper-clad laminate using a non-halogen type adhesive and a polyethylene naphthalate film. The adhesive composition is made of a non-halogen type epoxy resin. An electric insulation film, an adhesive composition spread on the film, and a protection film capable of being selectively peeled off are successively laminated for a coverlay film. The adhesive composition is made of a non-halogen type epoxy resin.
摘要翻译：目的：提供使用非卤素型粘合剂和聚萘二甲酸乙二醇酯膜的覆铜层压板和覆盖膜，以防止在燃烧期间通过使用不含卤素的粘合剂层产生对人体有害的气体，以降低制造成本，并获得可应用于需要紫外（UV）硬化等的工艺等的覆铜层压板和覆盖膜。构成：电绝缘膜，粘合剂组合物铺展在使用非卤素型粘合剂和聚萘二甲酸乙二醇酯膜对覆铜层压板依次层压膜和铜箔。粘合剂组合物由非卤素型环氧树脂制成。依次层叠电绝缘膜，涂覆在膜上的粘合剂组合物和能够选择性剥离的保护膜。粘合剂组合物由非卤素型环氧树脂制成。

26. 发明公开

KR1020130060582A 내열성이 우수한 연성인쇄회로기판 포장용 점착필름 无效
标题翻译：用于包装具有优异耐热性的柔性印刷电路板的粘合膜
公开(公告)号：KR1020130060582A
公开(公告)日：2013-06-10
申请号：KR1020110126716
申请日：2011-11-30
申请人： 도레이첨단소재 주식회사
发明人： 전해상 , 엄태수 , 차세영 , 조영호
IPC分类号： H05K3/28 , C09J7/02 , B32B27/00
CPC分类号： H05K3/281 , B32B27/00 , C09J7/22 , C09J7/385 , C09J2201/606 , C09J2203/318 , H05K3/285
摘要： PURPOSE: An adhesive film for packing a flexible printed circuit board is provided to minimize failure of a flexible printed circuit board due to an adhesive film by improving heat resistance of an adhesive by properly mixing soft and hard type monomers. CONSTITUTION: An adhesive film consists of a base film(1), an adhesive layer(2) and a release film(3). The adhesive layer is manufactured with a copolymer including from 1 to 48 parts by weight of a hard acrylic group monomer and from 1 to 10 parts by weight of crosslinking monomer with respect to soft acrylic group monomer from 50 to 90 parts by weight. The weight-average molecular weight of the adhesive layer is from 100,000 to 3,000,000. A glass transition temperature of the adhesive layer is from -35 degrees to -15 degrees. The thickness of the base film is from 10 micrometer to 200 micrometer.
摘要翻译：目的：提供用于包装柔性印刷电路板的粘合膜，以通过适当地混合软和硬型单体来改善粘合剂的耐热性，从而通过粘合剂膜来最小化柔性印刷电路板的故障。构成：粘合膜由基膜（1），粘合剂层（2）和剥离膜（3）组成。粘合剂层使用共聚物制造，该共聚物包含1至48重量份的硬质丙烯酸类单体和1至10重量份的交联单体相对于50至90重量份的软质丙烯酸类单体。粘合剂层的重均分子量为100,000〜3,000,000。粘合剂层的玻璃化转变温度为-35度至-15度。基膜的厚度为10微米至200微米。

27. 发明授权

KR101164654B1 백색 커버레이 필름의 제조방법 有权
标题翻译：制造白色覆膜的方法
公开(公告)号：KR101164654B1
公开(公告)日：2012-07-11
申请号：KR1020100119559
申请日：2010-11-29
申请人： 도레이첨단소재 주식회사
发明人： 이정우 , 전해상 , 엄태수 , 차세영
IPC分类号： G02B5/08 , B32B7/02
摘要： 본 발명은 백색 커버레이 필름의 제조방법에 관한 것으로서, 보다 상세하게는 절연성 기재필름의 일면에 일정한 반사율과 전광선 투과율을 갖는 백색 반사층과 상기 백색 반사층을 보호하는 보호필름을 백색 반사층 상부면에 합지하며, 그 이면에 접착제층 및 보호기재를 갖도록 하여 일정한 수준의 반사율과 높은 차폐성을 나타내어 백라이트의 휘도를 높일 수 있으며, 복잡한 잉크 인쇄 단계 공정을 생략할 수 있어 불량율을 줄이고 제조 시간과 인력을 줄여 원가 절감이 가능한 백색 커버레이 필름의 제조방법에 관한 것이다.

28. 发明公开

KR1020120057977A 백색 커버레이 필름의 제조방법 有权
标题翻译：白色膜片及其制造方法
公开(公告)号：KR1020120057977A
公开(公告)日：2012-06-07
申请号：KR1020100119559
申请日：2010-11-29
申请人： 도레이첨단소재 주식회사
发明人： 이정우 , 전해상 , 엄태수 , 차세영
IPC分类号： G02B5/08 , B32B7/02
CPC分类号： G02B5/08 , B29D7/01 , B32B7/02 , B32B7/12 , G02B1/14 , H05K2201/05
摘要： PURPOSE: A method for manufacturing a white cover-lay film raises reflectivity and a shielding property without an ink printing process of a flexible printed circuit board manufacturing process. CONSTITUTION: A composite for a white reflection layer is spread on a surface of an insulating base film so that the white reflection layer is formed. An inflammable adhesive is spread on the other surface of the insulating base film so that an adhesive layer is formed. A release base is laminated on an adhesive spread surface of the adhesive layer. An acrylic adhesive having heat resistance is spread on a side of the insulating base film so that a protective film is manufactured. The protective film is laminated with the white reflection layer.
摘要翻译：目的：制造白色覆盖膜的方法提高了反射率和屏蔽性，而不需要柔性印刷电路板制造工艺的油墨印刷工艺。构成：将白色反射层用复合体铺展在绝缘基膜的表面上，形成白色反射层。在绝缘基膜的另一面上涂布易燃粘合剂，形成粘合剂层。将剥离基层压在粘合剂层的粘合剂铺展表面上。具有耐热性的丙烯酸类粘合剂在绝缘性基膜的一面上扩散，从而制造保护膜。保护膜与白色反射层层叠。

29. 发明公开

KR1020110101550A 다이싱 다이본드 일체형 필름 无效
标题翻译：一体化贴膜
公开(公告)号：KR1020110101550A
公开(公告)日：2011-09-16
申请号：KR1020100020616
申请日：2010-03-09
申请人： 도레이첨단소재 주식회사
发明人： 차세영 , 이경석 , 이병국 , 원동호
IPC分类号： H01L21/78 , H01L21/58 , C09J7/02
CPC分类号： H01L21/7806 , C09J7/22 , C09J7/38 , C09J7/40 , C09J2201/606 , C09J2201/622 , C09J2203/326 , H01L21/67132 , H01L21/6836 , H01L2221/68327
摘要： 본 발명은 다이싱 다이본드 일체형 필름에 관한 것으로서, 보다 상세하게는 반도체 제조공정에서 웨이퍼와 부착시 박리불량이 발생되지 않고 UV 조사 없이도 우수한 픽업성을 가지는 다이싱 다이본드 일체형 필름에 관한 것이다. 이를 위해 본 발명에 따른 다이싱 다이본드 일체형 필름은 기재필름(5)상에 적층된 다이싱 점착제(4)와 접착제 보호필름(1)이 적층된 다이본딩 접착제(2) 사이에 지지체(3)가 사용되는 다이싱 다이본드 일체형 필름에 있어서, 상기 지지체(3)의 외경은 웨이퍼의 외경보다는 크고 상기 다이본딩 접착제(2)의 외경 보다는 작은 것을 특징으로 한다.

30. 发明公开

KR1020110072763A 반사 커버레이 필름 및 그 제조방법 无效
标题翻译：薄膜覆膜及其制备方法
公开(公告)号：KR1020110072763A
公开(公告)日：2011-06-29
申请号：KR1020090129839
申请日：2009-12-23
申请人： 도레이첨단소재 주식회사
发明人： 이경석 , 이병국 , 원동호 , 이정우 , 차세영
IPC分类号： H05K3/28 , C08G73/10
摘要： PURPOSE: A reflective coverlay film and a manufacturing method thereof are provided to improve the reflection efficiency of a light source by laminating an adhesive layer and a release layer member on the surface of an insulation base film. CONSTITUTION: A metal deposition layer is formed on one side of a base film. The metal deposition layer is formed with a vacuum deposition method and has an optical density over 0.6. A coating layer is coated on the metal deposition layer to protect the metal deposition layer. An adhesive and a protection member are successively formed on the other side of the base film.
摘要翻译：目的：提供一种反射性覆盖膜及其制造方法，以通过在绝缘基底膜的表面上层压粘合层和剥离层构件来提高光源的反射效率。构成：金属沉积层形成在基膜的一侧。金属沉积层由真空沉积法形成，光密度超过0.6。在金属沉积层上涂覆涂层以保护金属沉积层。粘合剂和保护构件依次形成在基膜的另一侧上。

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