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11. 发明公开

KR1020110048300A 백라이트 유닛용 브라켓 일체형 방열 ＰＣＢ와 그 제조방법 有权
标题翻译：背光单元的散热印刷电路板的统一支架及其制造方法
公开(公告)号：KR1020110048300A
公开(公告)日：2011-05-11
申请号：KR1020090105043
申请日：2009-11-02
申请人： 엘지이노텍 주식회사
发明人： 박현규 , 박재만 , 김은진 , 이혁수 , 이해형 , 이정호 , 조인희
IPC分类号： G02F1/13357 , G02F1/1333
CPC分类号： G02B6/0085 , G02B6/0083 , G02F1/133308 , G02F1/133615 , G02F2001/133628 , H05K1/0201
摘要： PURPOSE: A bracket-integrated heat radiating printed circuit for a backlight unit and a method for manufacturing the same are provided to reduce the fabrication costs thereof and simplify the fabrication process thereof. CONSTITUTION: A circuit pattern unit(140) includes a chip mounting unit and an electrodes for supplying power to the chip mounting unit. A curved portion includes at least one electrode line(130) for connecting the chip mounting unit to the electrode. A gap is formed at the curved portion. An upper portion of the curved portion is fixed to the lateral side of a chassis(170).
摘要翻译：目的：提供一种用于背光单元的支架集成散热印刷电路及其制造方法，以降低其制造成本并简化其制造工艺。构成：电路图案单元（140）包括芯片安装单元和用于向芯片安装单元供电的电极。弯曲部分包括用于将芯片安装单元连接到电极的至少一个电极线（130）。在弯曲部分形成间隙。弯曲部分的上部固定到底架（170）的侧面。

12. 发明授权

KR101028341B1 브라켓 일체형 방열 ＰＣＢ와 이를 구비한 구조물 및 이들의 제조방법 有权
标题翻译：散热印刷电路板统一的支架和底板结构及其生产工艺
公开(公告)号：KR101028341B1
公开(公告)日：2011-04-11
申请号：KR1020090101766
申请日：2009-10-26
申请人： 엘지이노텍 주식회사
发明人： 박현규 , 박재만 , 김은진 , 이혁수 , 이정호 , 이해형 , 조인희
IPC分类号： H05K3/00 , H05K7/20
摘要： PURPOSE: A heat radiating printed circuit board integrated with a bracket, structure with the heat radiating printed circuit board, and method for manufacturing the same are provided to integrate a heat radiating PCB with a bracket for fixing the heat radiating PCB to prevent a heat transferring rate from being lowered due to TIM, thereby maximally radiating heat. CONSTITUTION: An insulating layer and a metal layer are successively formed on a metal board. A circuit pattern part is formed on a non bending area except for a bending area. A gap is formed in a bending part to form at least one bending area on the metal board. A heat radiating PCB successively bonds an insulating layer(320) with a metal layer on the metal board.
摘要翻译：目的：提供一体化散热印刷电路板，与支架结合，散热印刷电路板结构及其制造方法，将热辐射PCB与用于固定散热PCB的支架相结合，防止热传导速率由于TIM而降低，从而最大限度地散热。构成：在金属板上依次形成绝缘层和金属层。电路图形部分形成在除了弯曲区域之外的非弯曲区域上。在弯曲部分中形成间隙以在金属板上形成至少一个弯曲区域。散热PCB在金属板上依次将绝缘层（320）与金属层接合。

13. 发明授权

KR101025543B1 백라이트 유닛 및 이를 포함하는 디스플레이 장치 有权
标题翻译：背光单元和显示单元，包括它们
公开(公告)号：KR101025543B1
公开(公告)日：2011-04-04
申请号：KR1020100041398
申请日：2010-05-03
申请人： 엘지이노텍 주식회사
发明人： 이해형 , 이상훈
IPC分类号： G02F1/13357
CPC分类号： G02B6/0085 , G02B6/0068 , G02B6/0073 , G02F1/133615 , G02F2001/133628
摘要： PURPOSE: A backlight unit of a display unit is provided to prevent a malfunction due to a bent of a frame by emitting heat to outside. CONSTITUTION: A display device including a backlight unit includes a light source array with a plurality of light sources. A light guide plate is arranged in one side of the light source array. A frame(210) supports the light source array and the light guide plate. A plurality of heat radiating members are arranged along the lighting direction. The space of the heat radiating member in the center area is larger than those of surroundings. area.
摘要翻译：目的：提供显示单元的背光单元，以通过向外部发热来防止由于框架的弯曲引起的故障。构成：包括背光单元的显示装置包括具有多个光源的光源阵列。导光板配置在光源阵列的一侧。框架（210）支撑光源阵列和导光板。沿着照明方向布置多个散热构件。中心区域的散热构件的空间大于环境空间。区。

14. 发明授权

KR101797594B1 표시 장치 有权
公开(公告)号：KR101797594B1
公开(公告)日：2017-11-15
申请号：KR1020100075788
申请日：2010-08-06
申请人： 엘지이노텍 주식회사
发明人： 김방건 , 이해형
IPC分类号： G02F1/1335 , G02F1/1333 , G02F1/1345
摘要： 본발명은백라이트유닛과이를구비하는표시장치에관한것이다. 상기백라이트유닛은, 상부벽과측벽을구비하는프레임; 상기프레임의상부벽의아래에위치하고, 하부벽과측벽을구비하는커버; 를포함하고, 상기프레임과상기커버는서로결합되어백라이트어셈블리를수납하는공간을형성하고, 상기프레임에는화상표시부재와연결되는회로기판을가이드하기위한가이드부가다수개 형성된것을특징으로한다. 이러한구성에따르면, 상기프레임에는화상표시부재와연결되는회로기판을가이드하기위한가이드부가다수개 형성되므로, 화상표시부재와연결되는회로기판을외력에대한영향없이안전하게가이드할수 있다.

15. 发明授权

KR101786071B1 백라이트 유닛 및 이를 구비한 표시 장치 有权
标题翻译：背光单元和具有该背光单元的显示装置
公开(公告)号：KR101786071B1
公开(公告)日：2017-10-16
申请号：KR1020100055577
申请日：2010-06-11
申请人： 엘지이노텍 주식회사
发明人： 오남석 , 이해형 , 이정호
IPC分类号： G02F1/1335 , F21V8/00
摘要： 실시예에따른백라이트유닛은, 바닥면부, 상기바닥면부에대해수직한제1측면부, 및상기제1측면부의반대측제2측면부를포함하는바텀커버; 상기바텀커버의바닥면부위에도광판; 상기바텀커버의제1측면부내측에탑재되며상기도광판의제1측면과대응되는복수의제1발광다이오드; 및상기도광판위에광학시트를포함한다.
摘要翻译：根据该实施例，底表面的背光单元，底盖包括一第一侧，所述第一侧表面的垂直于相对的第二侧部，所述底表面; 底盖的底面部分上的导光板; 多个第一发光二极管，其安装在底盖的第一侧表面内且与导光板的第一侧表面对应; 并在导光板上安装光学片。

16. 发明公开

KR1020110135704A 백라이트 유닛 및 이를 구비한 표시 장치 有权
标题翻译：背光单元和显示装置
公开(公告)号：KR1020110135704A
公开(公告)日：2011-12-19
申请号：KR1020100055577
申请日：2010-06-11
申请人： 엘지이노텍 주식회사
发明人： 오남석 , 이해형 , 이정호
IPC分类号： G02F1/1335 , F21V8/00
CPC分类号： G02F1/133606 , G02B6/0046 , G02B6/0055 , G02B6/0083 , G02F1/133524 , G02F1/1336 , G02F1/133603 , G02F1/133605 , G02F1/133608 , G02F1/133615
摘要： PURPOSE: A backlight unit is provided to removed a reflection sheet from the backlight unit. CONSTITUTION: A bottom cover(40) includes a bottom unit(41C), a first side unit(40A) which is vertical to the bottom surface unit, and a second surface unit(40B) of the first side surface unit. A light guiding plate(70) is located on the bottom surface unit of the bottom cover. A plurality of first LEDs(31,32) is mounted inside the first side surface unit of the bottom cover. The first light emitting diode corresponds to the first side surface of the light guiding plate. An optical sheet(60) is located on the light guiding plate.
摘要翻译：目的：提供背光单元以从背光单元去除反射片。构成：底盖（40）包括底部单元（41C），垂直于底面单元的第一侧单元（40A）和第一侧面单元的第二表面单元（40B）。导光板（70）位于底盖的底面单元上。多个第一LED（31,32）安装在底盖的第一侧面单元的内部。第一发光二极管对应于导光板的第一侧面。光学片（60）位于导光板上。

17. 发明公开

KR1020110135553A 백라이트 유닛 및 이를 포함하는 디스플레이 장치 无效
标题翻译：背光单元和包括其的显示装置
公开(公告)号：KR1020110135553A
公开(公告)日：2011-12-19
申请号：KR1020100055343
申请日：2010-06-11
申请人： 엘지이노텍 주식회사
发明人： 이해형 , 이상훈
IPC分类号： G02F1/13357
CPC分类号： G02B6/0085 , G02B6/0073 , G02F1/133615 , G02F2001/133628
摘要： PURPOSE: A backlight unit is provided to improve the heat dissipation. CONSTITUTION: A backlight unit includes a light emitting module(100) and a heat transfer member(220). A light emitting device is prepared in the light emitting module. The heat transfer member emits the heat of the light emitting module. The heat transfer member includes a heat absorbing unit and heat transfer unit. The heat absorbing unit is even with the light emitting module. The heat transfer unit connects the heat emitting unit and the heat absorbing unit.
摘要翻译：目的：提供背光单元以改善散热。构成：背光单元包括发光模块（100）和传热构件（220）。在发光模块中制备发光器件。传热部件发射发光模块的热量。传热构件包括吸热单元和传热单元。吸热单元与发光模块是均匀的。传热单元连接发热单元和吸热单元。

18. 发明公开

KR1020110133847A 표시 장치 有权
标题翻译：背光单元和显示装置
公开(公告)号：KR1020110133847A
公开(公告)日：2011-12-14
申请号：KR1020100053474
申请日：2010-06-07
申请人： 엘지이노텍 주식회사
发明人： 이해형 , 이정호
IPC分类号： G02F1/1335 , G02F1/1339
CPC分类号： G02F1/133608 , G02F1/133524 , G02F1/133553 , G02F1/133603 , G02F1/133605 , G02F1/133615 , G02F1/1339
摘要： PURPOSE: A backlight unit and a display device including the same are provided to protect an edge type light emitting diode. CONSTITUTION: A light guide plate(22) is arranged on a bottom cover(40). A plurality of light emitting diodes(34) correspond to at least one side of the light guide plate. A light emitting module(30) includes a plurality of light emitting diodes and a module substrate(32). A first plate(36) is combined with the rear of the module substrate. A plurality of first spacers(71) are more protrusive than the light emitting diode between the light guide plate and the module substrate.
摘要翻译：目的：提供一种背光单元和包括该背光单元的显示装置以保护边缘型发光二极管。构成：导光板（22）布置在底盖（40）上。多个发光二极管（34）对应于导光板的至少一侧。发光模块（30）包括多个发光二极管和模块基板（32）。第一板（36）与模块基板的后部组合。多个第一间隔件（71）比导光板和模块基板之间的发光二极管更突出。

19. 发明公开

KR1020110051718A 백라이트 유닛용 브라켓 일체형 방열 ＰＣＢ와 이를 구비한 샤시구조물 및 그 제조방법 无效
标题翻译：散热印刷电路板统一的支架和底板结构及其生产工艺
公开(公告)号：KR1020110051718A
公开(公告)日：2011-05-18
申请号：KR1020090108446
申请日：2009-11-11
申请人： 엘지이노텍 주식회사
发明人： 박재만 , 박현규 , 김은진 , 이혁수 , 이해형 , 이정호 , 조인희
IPC分类号： G02F1/13357 , G02F1/1333
CPC分类号： G02B6/0085 , G02B6/0083 , G02F1/133308 , G02F1/133615 , G02F2001/133628
摘要： PURPOSE: A bracket integrated heat dissipation PCB for a backlight unit, a chassis structure including the same and manufacturing method thereof are provided to reduce a material cost, to simplify process/structure, and to maximize heat dissipation characteristic by unifying the heat dissipation PCB and a bracket. CONSTITUTION: A heat dissipation PCB mounting inside the chassis structure providing light guiding path of a backlight unit includes a metal substrate(150) and a circuit layer. The metal substrate has at least one bending area and a non bending area. The circuit layer forms a circuit pattern by patterning the metal layer and laminating a metal layer on the insulating layer. The insulating layer exists only in non bending area among the metal substrate by welding the circuit layer to the non bending area.
摘要翻译：目的：提供一种用于背光单元的支架集成散热PCB，包括其的底盘结构及其制造方法，以减少材料成本，简化工艺/结构，并通过统一散热PCB和一个支架构成：提供背光单元的导光路径的底盘结构内的散热PCB安装包括金属基板（150）和电路层。金属基板具有至少一个弯曲区域和非弯曲区域。电路层通过图案化金属层并在绝缘层上层叠金属层而形成电路图案。通过将电路层焊接到非弯曲区域，绝缘层仅存在于金属基板之间的非弯曲区域中。

20. 发明公开

KR1020110048301A 백라이트 유닛용 브라켓 일체형 방열 ＰＣＢ와 이를 구비한 샤시구조물 无效
标题翻译：散热印版电路板背光单元统一支架及其相同的底板结构
公开(公告)号：KR1020110048301A
公开(公告)日：2011-05-11
申请号：KR1020090105044
申请日：2009-11-02
申请人： 엘지이노텍 주식회사
发明人： 김은진 , 박재만 , 박현규 , 이해형 , 이정호 , 이혁수 , 조인희
IPC分类号： G02F1/13357 , G02F1/1333
CPC分类号： G02B6/0085 , G02B6/0083 , G02F1/133308 , G02F1/133615 , G02F2001/133628
摘要： PURPOSE: A bracket-integrated heat radiating printed circuit board for a backlight unit and a chassis structure having the same are provided to simplify the fabrication process thereof and reduce the fabrication costs thereof. CONSTITUTION: A circuit pattern unit includes a chip mounting unit(180) and an electrode for supplying power to the chip mounting unit. A curved portion includes an electrode wire unit(140), and at least one curved portion is formed at the boundary of the circuit pattern unit and the curved portion. A connection unit connects the electrode unit to the chip mounting unit.
摘要翻译：目的：提供一种用于背光单元的支架集成散热印刷电路板和具有该散热用印刷电路板的底盘结构，以简化其制造工艺并降低其制造成本。构成：电路图案单元包括芯片安装单元（180）和用于向芯片安装单元供电的电极。弯曲部分包括电极线单元（140），并且在电路图案单元和弯曲部分的边界处形成至少一个弯曲部分。连接单元将电极单元连接到芯片安装单元。

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