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11. 发明公开

KR1020150112263A 다중 사용자 지원을 위한 빔포밍 방법 및 장치 审中-实审
标题翻译：用于服务多个用户的方法和装置
公开(公告)号：KR1020150112263A
公开(公告)日：2015-10-07
申请号：KR1020140036033
申请日：2014-03-27
申请人： 삼성전자주식회사 , 한국과학기술원
发明人： 곽세민 , 김용훈 , 양희성 , 최상혁 , 전주환
IPC分类号： H04B7/02
CPC分类号： H04B7/0617 , H04B7/0695
摘要： 다중사용자지원을위한빔포밍방법및 장치를개시한다. 상기방법은, 복수의사용자단말들로부터피드백된채널정보를기반으로상기사용자단말들을위한서로다른빔들을결정하는과정과, 상기빔들에대한상기사용자단말들의빔 품질들을예측하는과정과, 상기빔 품질들이상기사용자단말들에대한서비스품질(QoS)을만족하는지를판단하는과정과, 상기빔들중 적어도하나의제1 빔의빔 품질이상기 QoS를만족하지못하는경우, 상기제1 빔에대해간섭으로작용하는부엽을가지는제2 빔에와이드널링을적용하는과정과, 상기제2 빔대신상기와이드널링빔을포함하는상기빔들에대한빔 품질들을예측하는과정과, 상기제2 빔대신상기와이드널링빔을포함하는상기빔들에대한빔 품질들이상기 QoS를만족하는경우, 상기제2 빔대신상기와이드널링빔을포함하는상기빔들을통해상기사용자단말들과동시에통신하는과정을포함한다.
摘要翻译：公开了用于多用户支持的波束成形的方法和装置。该方法可以包括以下步骤：基于多个用户终端对信道信息的反馈来确定用户终端的不同波束; 预测用户终端相对于光束的光束质量; 确定所述波束质量是否满足所述用户终端的服务质量（QoS）; 在所述光束中的至少一个第一光束的光束质量不满足所述QoS的情况下，对具有相对于所述第一光束干涉的焊盘的第二光束应用宽滚花; 相对于包括宽滚花光束而不是第二光束的光束预测光束质量; 在包括宽滚花光束而不是第二光束的光束的光束质量满足QoS的情况下，通过包括宽滚花光束而不是第二光束的光束与用户终端通信。

12. 发明公开

KR1020150073674A 디스플레이 구동회로 및 그 구동방법 审中-实审
标题翻译：显示设备的驱动电路及其驱动方法
公开(公告)号：KR1020150073674A
公开(公告)日：2015-07-01
申请号：KR1020130161655
申请日：2013-12-23
申请人： 삼성전자주식회사
发明人： 김용훈
IPC分类号： G09G3/20
摘要： 본발명의하나의실시형태에따른디스플레이구동회로는게이트라인을구동하기위한게이트구동회로및 데이터라인을구동하기위한데이터구동회로를포함하고, 상기게이트구동회로는아웃풋버퍼의출력을제어하기위한내부변조제어신호를생성하는변조제어부, 상기내부변조제어신호를이용하여다중전원전압들중 어느하나의게이트하이전압또는게이트로우전압을선택하기위한전압변조제어신호를생성하는변조신호구동부, 상기전압변조제어신호와상기아웃풋버퍼의출력을제어하기위한변조게이트라인신호를이용하여상기선택된게이트하이전압또는게이트로우전압을생성하기위한변조출력제어신호를생성하는변조선택부및 상기변조출력제어신호를이용하여상기선택된게이트하이전압또는게이트로우전압을생성하는아웃풋버퍼를포함한다.
摘要翻译：根据本发明的实施例，显示驱动电路包括：用于驱动栅极线的栅极驱动电路; 以及用于驱动数据线的数据驱动电路，其中所述栅极驱动电路包括：调制控制器，其产生用于控制输出缓冲器的输出的内部调制控制信号; 调制信号驱动器，其通过使用内部调制控制信号来生成用于选择多个电源电压中的栅极高电压或栅极低电压中的任一个的电压调制控制信号; 调制选择器，其通过使用电压调制控制信号和用于控制输出缓冲器的输出的调制栅极线信号产生用于产生所选择的栅极高电压或栅极低电压的调制输出控制信号; 以及通过使用调制输出控制信号产生选择的栅极高电压或栅极低电压的输出缓冲器。

13. 发明公开

KR1020130078458A ＰＯＰ 구조의 반도체 패키지 有权
标题翻译：具有POP（包装）的半导体封装结构
公开(公告)号：KR1020130078458A
公开(公告)日：2013-07-10
申请号：KR1020110147418
申请日：2011-12-30
申请人： 삼성전자주식회사
发明人： 김용훈 , 강효순 , 김진경
IPC分类号： H01L23/12
CPC分类号： H01L25/105 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/0557 , H01L2224/06155 , H01L2224/06181 , H01L2224/1301 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/17517 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2225/06575 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/1431 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/14361 , H01L2924/1437 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/15788 , H01L2924/1579 , H01L2924/18161 , H01L2924/00012 , H01L2224/45099 , H01L2924/00
摘要： PURPOSE: A semiconductor package of a POP structure is provided to increase memory capacity by securing bandwidth. CONSTITUTION: A first package (100) includes a first semiconductor chip part (105). The first semiconductor chip part is mounted on a first substrate. A second package (200) includes a second semiconductor chip part (205). A second semiconductor chip part is mounted on a second substrate. A connecting member combines the first substrate with the second substrate.
摘要翻译：目的：提供POP结构的半导体封装以通过确保带宽来增加存储容量。构成：第一封装（100）包括第一半导体芯片部分（105）。第一半导体芯片部件安装在第一基板上。第二封装（200）包括第二半导体芯片部分（205）。第二半导体芯片部件安装在第二基板上。连接构件将第一基板与第二基板结合。

14. 发明公开

KR1020130073131A 이동 통신 시스템에서 빔포밍 장치 및 방법 无效
标题翻译：移动通信系统中的波束形成装置和方法
公开(公告)号：KR1020130073131A
公开(公告)日：2013-07-03
申请号：KR1020110140823
申请日：2011-12-23
申请人： 삼성전자주식회사 , 한국과학기술원
发明人： 손미현 , 김용훈 , 윤병태 , 정종욱 , 이동근 , 이정선 , 이상국
IPC分类号： H04B7/08
CPC分类号： H04B7/043 , H04B7/0848
摘要： PURPOSE: A beamforming apparatus and method in a mobile communication system are provided for optimizing both the system performance and the number of components. CONSTITUTION: A local oscillator (LO) signal generator (412) generates an LO signal. A phase shifter (414) generates a predetermined number of phase-shifted LO signals with respect to the generated LO signal. A switching network (416) maps the phase-shifted LO signals to RF signals received via a plurality of receiving paths. A plurality of mixer (418-1~418-N) mixes the RF signals with the mapped LO signals to down-convert a frequency of the RF signals. A plurality of variable gain amplifier (VGA) adjusts amplitude of the down-converted signals. [Reference numerals] (AA) Reception beamforming circuit; (BB) Digital logic signal for each control
摘要翻译：目的：提供移动通信系统中的波束成形设备和方法，用于优化系统性能和组件数量。构成：本地振荡器（LO）信号发生器（412）产生LO信号。移相器（414）相对于所生成的LO信号产生预定数量的相移LO信号。交换网络（416）将相移的LO信号映射到经由多个接收路径接收的RF信号。多个混频器（418-1〜418-N）将RF信号与所映射的LO信号混合，以降低RF信号的频率。多个可变增益放大器（VGA）调节下变频信号的幅度。（附图标记）（AA）接收波束形成电路; （BB）每个控制的数字逻辑信号

15. 发明公开

KR1020120039460A 반도체 패키지 无效
标题翻译：半导体封装
公开(公告)号：KR1020120039460A
公开(公告)日：2012-04-25
申请号：KR1020110090546
申请日：2011-09-07
申请人： 삼성전자주식회사
发明人： 김용훈 , 이지현
IPC分类号： H01L23/48 , H01L23/488
CPC分类号： H01L23/49822 , H01L23/50 , H01L24/48 , H01L2224/48227 , H01L2924/00014 , H01L2924/01012 , H01L2924/15311 , H01L2924/19105 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PURPOSE: A semiconductor package is provided to secure stable and electrical paths by interlinking a first connecting pattern and a second connecting pattern by using electrodes of a capacitor and a plurality of firsts and second via contacts. CONSTITUTION: A package substrate comprises a first wire and a second wire. The first wire and the second wire are electrically separated. First connection patterns(164a) form a first crowding structure(G1). The first connection patterns are electrically connected to the first wire. The first crowding structure comprises a plurality of first monomers(U1). Second connection patterns(164b) form a second crowding structure(G2). The second connection patterns electrically connected to the second wire. The second crowding structure is arranged in a region which is spatially separated from the first crowding structure. The second crowding structure comprises a plurality of second monomers(U2).
摘要翻译：目的：提供半导体封装，通过使用电容器和多个第一和第二通孔触点的电极来互连第一连接图案和第二连接图案来确保稳定和电路径。构成：包装衬底包括第一线和第二线。第一线和第二线被电分离。第一连接图案（164a）形成第一挤压结构（G1）。第一连接图案电连接到第一导线。第一挤压结构包括多个第一单体（U1）。第二连接图案（164b）形成第二拥挤结构（G2）。电连接到第二线的第二连接图案。第二拥挤结构布置在与第一拥挤结构空间上分离的区域中。第二拥挤结构包括多个第二单体（U2）。

16. 发明公开

KR1020120028096A 커플링 도전 패턴을 포함하는 반도체 장치 有权
标题翻译：包含耦合导体图案的半导体器件
公开(公告)号：KR1020120028096A
公开(公告)日：2012-03-22
申请号：KR1020100090095
申请日：2010-09-14
申请人： 삼성전자주식회사
发明人： 김용훈 , 이종주 , 이상엽 , 최영돈 , 이희석
IPC分类号： H01L23/64 , H01L25/10 , H04B5/00 , H01L23/00
CPC分类号： H01L23/645 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/06558 , H01L2225/1023 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/3511 , H04B5/0012 , H04B5/0031 , H04B5/0037 , H04B5/0075 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PURPOSE: A semiconductor device with a coupling conductive pattern is provided to have a through electrode and a coupling conductive pattern by wireless communication between a laminated semiconductor chip and a transceiving device, thereby increasing transmission efficiency. CONSTITUTION: A first semiconductor chip(120) comprises a circuit part, a first coupling conductive pattern, and a through electrode(126). The through electrode connects the circuit part with the first coupling conductive pattern. The transceiving device is placed on the first semiconductor chip. A second coupling conductive pattern(150) wirelessly communicates with the first coupling conductive pattern. The second coupling conductive pattern faces the first coupling conductive pattern.
摘要翻译：目的：提供具有耦合导电图案的半导体器件，以通过层叠半导体芯片和收发器件之间的无线连接具有通孔电极和耦合导体图案，从而提高传输效率。构成：第一半导体芯片（120）包括电路部分，第一耦合导电图案和通孔（126）。贯通电极将电路部分与第一耦合导体图案相连。收发装置放置在第一半导体芯片上。第二耦合导电图案（150）与第一耦合导电图案无线地连通。第二耦合导电图案面向第一耦合导电图案。

17. 发明授权

KR101106299B1 서브 하모닉 믹서 有权
标题翻译：辅助混合器
公开(公告)号：KR101106299B1
公开(公告)日：2012-01-18
申请号：KR1020050097225
申请日：2005-10-14
申请人： 삼성전자주식회사
发明人： 박진수 , 김용훈 , 유창식 , 이성수 , 이흥배
IPC分类号： H03D7/12 , H03D7/00
CPC分类号： H03D7/166
摘要： 본 발명은, 상호 병렬연결된 적어도 한 쌍의 증폭소자를 이용하여 입력된 신호를 증폭시키는 증폭부와, 증폭부로부터의 증폭된 신호와 로컬 오실레이터로부터의 국부발진신호를 혼합하는 혼합부를 포함하는 믹서에 관한 것으로서, 혼합부는, 각 증폭소자를 스위칭하며 상호 병렬연결된 적어도 네 쌍의 스위칭소자를 포함하며, 하나의 증폭소자를 스위칭하는 두 쌍의 스위칭소자는 상호 병렬연결되고 각 스위칭소자에는 상호 상이한 위상을 갖는 국부발진신호가 입력되며, 쌍을 이루는 두 개의 스위칭소자는 상호 병렬연결되고 각 스위칭소자에는 180도의 위상차를 갖는 국부발진신호가 입력된다. 이에 의해, 스위칭단을 1단으로 구성하여 저전원 전압에서도 동작이 가능하며, 혼합부와 증폭부의 성능을 최대한 발휘할 수 있을 뿐만 아니라, 노이즈 성능, 선형성, 이득을 향상시킬 수 있다.
서브 하모닉 믹서, 폴디드 캐스코드(FOLDED CASCODE), 증폭부, 혼합부

18. 发明公开

KR1020110139983A 반도체 패키지 无效
标题翻译：半导体封装
公开(公告)号：KR1020110139983A
公开(公告)日：2011-12-30
申请号：KR1020100060133
申请日：2010-06-24
申请人： 삼성전자주식회사
发明人： 김용훈 , 조영준 , 이지현 , 이희석
IPC分类号： H01L23/48
CPC分类号： H01G4/30 , H01G2/065 , H01G4/228 , H01L23/3128 , H01L23/50 , H01L23/642 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/078 , H01L2924/09701 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1902 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L23/48 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE: A semiconductor package is provided to improve integration by mounting a decoupling capacitor through a conductive pump as an electrode. CONSTITUTION: In a semiconductor package, a semiconductor chip(30) is mounted in the top side of a substrate(10). A first conductive bump(50) is arranged in the bottom of the substrate. First conductive bumps electrically interlink the substrate to an external device. A decoupling capacitor(60) is arranged in the bottom of the substrate. The decoupling capacitor comprises an electrode portion and a dielectric layer The electrode portion(67) comprises a second conductive bump(65) The second conductive bump electrically interlinks the substrate to the external device.
摘要翻译：目的：提供半导体封装以通过将导电泵作为电极安装去耦电容器来改善集成度。构成：在半导体封装中，半导体芯片（30）安装在基板（10）的顶侧。第一导电凸块（50）布置在基板的底部。第一导电凸块将基板电连接到外部装置。去耦电容器（60）布置在衬底的底部。去耦电容器包括电极部分和电介质层电极部分（67）包括第二导电凸块（65）。第二导电凸块将基板电连接到外部装置。

19. 发明公开

KR1020110005054A 광신호를 이용하는 광학시스템 및 고체상태 드라이브 모듈 无效
标题翻译：使用光信号的光学系统和使用光信号的固态驱动模块
公开(公告)号：KR1020110005054A
公开(公告)日：2011-01-17
申请号：KR1020090062565
申请日：2009-07-09
申请人： 삼성전자주식회사
发明人： 김용훈 , 이희석
IPC分类号： H04B10/25 , H04B10/00
CPC分类号： H04J14/0283 , H04J14/0201
摘要： PURPOSE: An optical system using optical signal and a solid state drive module using the optical signal are provided to optimally maintain the SI, PI and EMI characteristics regardless of the shielding operation which uses impedance matching and grounding voltage. CONSTITUTION: A solid state drive module(110) includes solid state memory devices, and an input/output interface(150) transmits and receives data which are supposed to be recorded on the memory device or are recorded on the memory device to and from the main control device. The slide state drive module and the input/output interface transmit and receives the data by using an optical fiber and a waveguide.
摘要翻译：目的：提供使用光信号的光学系统和使用光信号的固态驱动模块，以最佳地保持SI，PI和EMI特性，而不管使用阻抗匹配和接地电压的屏蔽操作。构成：固态驱动模块（110）包括固态存储器件，并且输入/输出接口（150）发送和接收应该被记录在存储器件上或被记录在存储器件上的数据，主控装置。滑动状态驱动模块和输入/输出接口通过使用光纤和波导发送和接收数据。

20. 发明公开

KR1020100071603A 파워 온 리셋 회로 및 그 구동 방법 无效
标题翻译：上电复位电路及其驱动方法
公开(公告)号：KR1020100071603A
公开(公告)日：2010-06-29
申请号：KR1020080130381
申请日：2008-12-19
申请人： 삼성전자주식회사
发明人： 김용훈 , 서명식
IPC分类号： H03K17/22 , G06F1/24
CPC分类号： H03K17/223 , H03K17/145
摘要： PURPOSE: A power on reset circuit and a method for driving the same are provided to regulate an initialization section by maintaining or discharging the charged state of a first node in response with voltage signal. CONSTITUTION: A capacitor unit(C1) is connected between a power voltage and a first node. A first node is charged by applying the power voltage to the capacitor unit. At least one voltage signal is applied to a power on reset circuit(100). In response with the power voltage, the power one reset circuit regulates an initial section by maintaining or discharging the charged state of the first node. A first block(120) generates first control signal based on the level of power signal. A second block(130) is connected between the first node and a ground voltage. First control signal is inputted to the second block.
摘要翻译：目的：提供上电复位电路及其驱动方法，以通过响应于电压信号维持或放电第一节点的充电状态来调节初始化部分。构成：电容器单元（C1）连接在电源电压和第一个节点之间。通过将电源电压施加到电容器单元来对第一节点进行充电。至少一个电压信号被施加到上电复位电路（100）。响应于电源电压，电源复位电路通过维持或放电第一节点的充电状态来调节初始部分。第一块（120）基于功率信号的电平产生第一控制信号。第二块（130）连接在第一节点和地电压之间。第一控制信号被输入到第二块。

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