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    • 2. 发明专利
    • Band saw device
    • 带锯设备
    • JP2011037125A
    • 2011-02-24
    • JP2009186461
    • 2009-08-11
    • Jcm:Kk株式会社ジェイシーエム
    • NAKAYAMA TATSUYUKI
    • B28D5/04B23D53/00
    • PROBLEM TO BE SOLVED: To miniaturize a band saw device with which a silicon ingot is cut into a predetermined shape. SOLUTION: The band saw device includes two parallel-arranged blade wheels 6, an annular band saw 7 wound around the two blade wheels 6, a motor 8 as a drive source rotatably driving the band saw 7 via the blade wheels 6, and an ascending and descending means 10 letting the silicon ingot 2 to ascend and descend to the rotatably driven band saw 7. The band saw 7 and the two blade wheels 6 around which the band saw 7 is wound are arranged between a space S of a gate type holding frame comprising a pillar frame 4 and a beam frame 5. The two blade wheels 6 around which the band saw 7 is wound are hung down and held in the lower part of the horizontal beam frame 5 mounted on the holding frame. Thereby it is possible to hold the band saw 7 and the two blade wheels 6 without increasing the rigid force of the holding frame holding the same. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了使将硅锭切割成预定形状的带锯装置小型化。 解决方案:带锯装置包括两个平行布置的叶片轮6,围绕两个叶轮6缠绕的环形带锯7,作为驱动源的马达8经由叶轮6可旋转地驱动带锯7, 以及上升和下降装置10使硅锭2上升和下降到可旋转驱动的带锯7.带锯7和带锯7所围绕的两个叶轮6布置在 门型保持框架包括立柱框架4和梁框架5.将带锯7围绕其缠绕的两个叶片轮6挂起并保持在安装在保持框架上的水平梁架5的下部。 因此,可以不增加保持框架7和两个叶轮6的刚性力来保持带锯7和两个叶轮6。 版权所有(C)2011,JPO&INPIT