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1. 实用新型

JPS6320107Y2 失效
公开(公告)号：JPS6320107Y2
公开(公告)日：1988-06-03
申请号：JP5366481
申请日：1981-04-13
IPC分类号： H01L25/00 , H01C13/02 , H01F27/00 , H01G4/12 , H01G4/228 , H01G4/38 , H01F15/00 , H01L25/02

9. 发明专利

JPS607760A MANUFACTURE OF IC CARD 失效
公开(公告)号：JPS607760A
公开(公告)日：1985-01-16
申请号：JP11638383
申请日：1983-06-28
申请人： TOSHIBA KK
发明人： SAITOU TAMIO
IPC分类号： H01L25/00 , B42D15/10 , G06K19/077 , H01L23/28 , H01L23/495 , H01L25/02
摘要： PURPOSE:To obtain an extremely thin IC card by a method wherein a lead frame serves not only as a supporting means of an IC chip but also as a connecting means of the IC chip and the summation of the thickness of the lead frame and the thickness of a molded resin is to be the thickness of the IC card. CONSTITUTION:A metal plate of a thickness of 0.2mm. or less, preferrably about 0.05mm., is introduced as a lead frame plate and punched out into a prescribed form. An outside frame is composed of a supporting frame 3 and a plurality of electrode parts 4, a bonding pad part 1 for IC chip mounting supported by arms 2a and 2b, a battery mounting pad part 6 supported by arms 7a and 7b and connected to the pad part 1 by a connecting part 8 and a loop antenna part 5 are formed inside the outside frame. An IC chip is mounted on the pad part 1 and a battery is mounted on the pad part 6 and respective wirings are made. Then front and back sides of the part shown by two-dot chain lines is covered with a molded resin 11 and this part is cut off.

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