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1. 发明专利

JP2005231022A Method and device for polishing diamond 有权
标题翻译：抛光钻石的方法和装置
公开(公告)号：JP2005231022A
公开(公告)日：2005-09-02
申请号：JP2004314637
申请日：2004-10-28
申请人： Tokyo Metropolis , 東京都
发明人： YOKOZAWA TAKESHI , KATAOKA SEIJI , MOTO AKIO , NIHEI NORIHIRO
IPC分类号： B24B1/00 , B24B1/04 , B24B37/00 , B24D3/00 , B24D99/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for easily and efficiently polishing a diamond surface formed in curved shape or provided on the inner surface of a small diameter hole, in a short time. SOLUTION: Polishing is performed by pressing a polishing tool 3 to which ultrasonic wave is applied, to the surface of diamond 6, and efficiently generating frictional heat by ultrasonic wave to eliminate carbon of diamond surface crystal. The polishing tool comprises a bar-like member 30 and a tip part 31 of curved shape at the tip. Further, liquid/solid or its mixture having lubricity is interposed at a contact surface between the polishing tool and the diamond surface to perform polishing. Agglutination around the polishing surface is thereby prevented, and polishing efficiency is increased. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于在短时间内容易且有效地抛光形成为弯曲形状或设置在小直径孔的内表面上的金刚石表面的方法和装置。解决方案：通过将施加有超声波的抛光工具3压在金刚石6的表面上，并通过超声波有效地产生摩擦热来消除金刚石表面晶体的碳来进行抛光。抛光工具包括在尖端处具有弯曲形状的棒状构件30和尖端部31。此外，液体/固体或其具有润滑性的混合物插入在抛光工具和金刚石表面之间的接触表面上以进行抛光。由此防止了研磨面周围的凝集，提高了研磨效率。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005022033A Polishing member 审中-公开
标题翻译：抛光会员
公开(公告)号：JP2005022033A
公开(公告)日：2005-01-27
申请号：JP2003190411
申请日：2003-07-02
申请人： Yamahachi Shizai Kogyo Kk , 山八歯材工業株式会社
发明人： TOYAMA KIMIO
IPC分类号： B24D99/00 , B24D7/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing member that smoothly polishes even the surface of a member made of resin or the like and releases frictional heat generated by polishing or prevents occurrence thereof.
SOLUTION: The polishing member 10 comprises a polishing body 12 mainly containing organic compound and formed in a predetermined shape, and a supporting shaft 14 for rotatably supporting the polishing body 12. A polishing surface 16 of the polishing body 12 is provided with a non-contact section which does not contact with a polished body at a rotating and polishing time. The non-contact section is formed of a groove part 18 having a recessed cross section formed in the polishing surface 16 of the polishing body 12. The groove part 18 functions as a radiating section for releasing the frictional heat generated by contact with a non-polishing body, and functions as a pocket section for temporarily holding ground chips generated at the polishing time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够均匀地均匀地研磨由树脂等构成的构件的表面并且释放由抛光产生的摩擦热或防止其发生的抛光构件。解决方案：抛光构件10包括主要包含有机化合物并形成预定形状的抛光体12和用于可旋转地支撑抛光体12的支撑轴14.抛光体12的抛光表面16设置有在旋转和抛光时间不与抛光体接触的非接触部分。非接触部由形成在研磨体12的研磨面16上的具有凹状截面的槽部18形成。槽部18作为散热部发挥作用，并且用作临时保持在抛光时间产生的碎屑的袋部。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004237437A Lap tool and method of manufacturing lap tool and method of polishing optical part 审中-公开
公开(公告)号：JP2004237437A
公开(公告)日：2004-08-26
申请号：JP2003388026
申请日：2003-11-18
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： SAKAI YOSHIO
IPC分类号： B24B13/01 , B24D99/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a lap tool, which has flexibility following the shape of a surface to be polished and precisely and efficiently flattens the surface to be polished even though irregularities caused by a pre-processing remain, when polishing optical parts such as large-diameter aspheric glass lenses.
SOLUTION: The lap tool 1 is provided with a dome-like elastic body 2, a lap layer 3 having polishing property over an adhesive 3b formed on one surface of the elastic body 2 and a lap material 3a and a crack 8 extending from the surface of the lap layer 3 to one surface of the elastic body 2 for allowing the lap layer 3 to have flexibility.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2003287026A Grinding wheel for linear guide and guide rail 审中-公开
标题翻译：用于线性导轨和导轨的研磨轮
公开(公告)号：JP2003287026A
公开(公告)日：2003-10-10
申请号：JP2002095284
申请日：2002-03-29
申请人： Nsk Ltd , 日本精工株式会社
发明人： MIZUMURA YOSHINORI
IPC分类号： B24B19/08 , B24D99/00 , F16C29/06 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding wheel for a linear guide and a guide rail which grinds a rolling element rolling surface of a guide rail and a scale mounting groove, while maintaining parallelism of both of them.
SOLUTION: This grinding wheel for the linear guide and the guide rail is constituted so as to grind the rolling element rolling groove 51 and the scale mounting groove 13 by one piece of the grinding wheel while maintaining parallelism of them by providing a first grinding part 16 to grind the rolling element rolling groove 51 of the guide rail 2 and providing a second grinding part 17 to grind the scale mounting groove 13 of the guide rail 2 on the grinding wheel 15 to be used upon grinding the guide rail 2.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种用于直线导轨和导轨的砂轮，该导轮和导轨在保持两者的平行性的同时研磨导轨的滚动体滚动表面和刻度安装槽。
解决方案：用于直线导轨和导轨的该砂轮构成为通过一片砂轮研磨滚动体滚动槽51和刻度安装槽13，同时通过提供第一研磨部16，对导轨2的滚动体滚动槽51进行研磨，并设置第二研磨部17，将研磨轮15上的导轨2的刻度安装槽13研磨成用于研磨导轨2。版权所有（C）2004，JPO

5. 发明专利

JP2003236765A BLADE TOOL USED IN WORKPIECE CUTTING DEVICE, MANUFACTURING METHOD OF BLADE TOOL, AND CUTTING METHOD OF WORKPIECE BY BLADE TOOL 审中-公开
公开(公告)号：JP2003236765A
公开(公告)日：2003-08-26
申请号：JP2002040854
申请日：2002-02-18
申请人： KOIDE AKIMICHI
发明人： KOIDE AKIMICHI
IPC分类号： B24B27/06 , B24D3/00 , B24D3/28 , B24D99/00 , B28D5/02 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a blade tool used in a workpiece cutting device for slicing a workpiece (work) such as a semiconductor single-crystal ingot, a manufacturing method of the blade tool, and a cutting method of the workpiece by the blade tool. SOLUTION: An abrasive grain containing fiber member 2 having uniform abrasive grains Q is woven, and is cured like a plate to form the blade tool 1. The blade tool 1 is manufactured in a weaving process of weaving the fiber member 2 having uniform abrasive grains Q in a vertical and lateral lattice shape or diagonally, a coating process of coating the woven fiber member 2 with thermosetting resin, and a curing process of passing the woven fiber member 2 between a pair of rollers to cure it like a plate. Then, the blade tool 1 is fixed to the lower surface of a pedestal 11 of an oscillating device movable back and forth in the horizontal direction for example, and the moving blade tool 1 is pressed to the workpiece (work P) to cut the workpiece (work P). COPYRIGHT: (C)2003,JPO

6. 发明专利

JP2002239827A COMPOSITE TOOL 失效
公开(公告)号：JP2002239827A
公开(公告)日：2002-08-28
申请号：JP2001035314
申请日：2001-02-13
申请人： TOYODA MACHINE WORKS LTD
发明人： TAKAYAMA SHIRO , MATSUZAKI YOSHINOBU
IPC分类号： B23C5/00 , B24D7/00 , B24D99/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To provide a composite tool capable of milling a deburred cast part surface in a flat surface by removing chilled burrs of a cast part by grinding work and to work the cast part surface after casting in a flat surface in high precision, in a short period of time and at low cost. SOLUTION: A body of a front surface milling cutter is mounted concentrically with a spindle on a tool main body integrally fixed on the spindle to be rotationally driven of a spindle stock, a cup type grindstone main body of a cup type super abrasive grain grindstone is concentrically fixed by surrounding a blade part of the front surface milling cutter, a super abrasive grain layer retreating a head end surface by specified quantity from a blade part head end on a ring head end part of the grindstone main body, the burrs of the cast part surface are removed by the cup type super abrasive grain grindstone, and this deburred surface is worked in the flat surface by the front milling cutter.

7. 发明专利

JP2002160171A POLISHING PANEL FOR LIFTING AND POLISHING DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
公开(公告)号：JP2002160171A
公开(公告)日：2002-06-04
申请号：JP2000357843
申请日：2000-11-24
申请人： HEIWA CORP
发明人： SAWADA SHINJI
IPC分类号： A63F7/02 , B24B29/00 , B24B29/04 , B24D11/00 , B24D99/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To reduce manufacturing cost and promote recycling by constructing a polishing panel for a lifting and polishing device with single material. SOLUTION: Non-woven fabric of a designated thickness of a first material is employed and is cut into a designated shape. Coagulation material composed of a plastic adhesive of the same system as the non-woven fabric is applied or sprayed on one surface of the non-woven fabric to form an impregnation layer 14. A thin plate part 13 of a side part is formed by pressing beforehand. Coagulation material of the impregnation layer 14 is set by maintaining a secondary material 11 made with those procedures in an arch shape for a designated time. Consequently, the impregnation layer 14 become a plate like member with stiffness and non-woven fabric on the reverse side maintains original characteristics to be a polishing part 15.

8. 发明专利

JP2001139936A WHETSTONE FOR POLISHING SINGLE CRYSTAL DIAMOND OR DIAMOND SINTERED PRODUCT AND METHOD FOR POLISHING THE SAME AND SINGLE CRYSTAL DIAMOND AND DIAMOND SINTERED PRODUCT OBTAINED BY POLISHING 失效
公开(公告)号：JP2001139936A
公开(公告)日：2001-05-22
申请号：JP32052399
申请日：1999-11-11
申请人： NAT INST OF ADVANCED IND SCIEN , APPLIED DIAMOND KK
发明人： ABE TOSHIHIKO , HASHIMOTO HITOSHI , TAKEDA SHUICHI
IPC分类号： B24B9/16 , B24D3/02 , B24D99/00 , C09K3/14 , C30B29/04 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To obtain a low cost whetstone which is used for polishing a single crystal diamond or diamond sintered product, can polish the single crystal diamond or diamond sintered product at a low temperature without generating cracks or breakage or deteriorating the quality, can maintain the stable performance of the whetstone, can be used for flat polishing devices, lap polishing devices and other conventional devices, can simply be used, and gives stable polished products, and to provide a method for polishing the single crystal diamond or diamond sintered product. SOLUTION: This whetstone for polishing the single crystal diamond or diamond sintered product, is characterized by containing as a main component an intermetallic compound of Ti with one or more elements selected from the group consisting of Al, Cr, Mn, Fe, Co, Ni and Cu, and the method for polishing the single crystal diamond or diamond sintered product, is characterized by polishing the single crystal diamond or diamond sintered product at room temperature or, if necessary, while heating the polishing portion at 100 to 800 deg.C.

9. 发明专利

JP3099216B2 失效
公开(公告)号：JP3099216B2
公开(公告)日：2000-10-16
申请号：JP21952194
申请日：1994-08-22
IPC分类号： B24B9/00 , B24D3/00 , B24D5/00 , B24D5/14 , B24D7/18 , B24D99/00 , B24D17/00

10. 发明专利

JP2000263450A ROLL FOR GRINDING AND POLISHING 失效
公开(公告)号：JP2000263450A
公开(公告)日：2000-09-26
申请号：JP7547699
申请日：1999-03-19
申请人： KENKEN KK
发明人： IRIE KENJI
IPC分类号： B24D5/00 , B24D3/00 , B24D99/00 , B24D17/00
摘要： PROBLEM TO BE SOLVED: To improve finishing of a polishing surface and particularly surely prevent generation of a polishing streak while improvement of grinding and polishing force is attained, in a roll for grinding and polishing rotated while pressing an external peripheral surface to a ground/polished material to be used for grinding or polishing surfaces of these materials. SOLUTION: Disk-shaped textile sheets 1, 1,... formed of alumina fiber or the like are layered along a roll axial center X and fixedly bonded by a bonding agent resin. A thickness in the direction of the roll axial center X of each textile sheet 1 is set to (t), a roll internal diameter is set to (d), and a tilt angle θbetween each textile sheet 1 and a virtual plane L vertical to the roll axial center X is set to a value satisfying a relation of θ>=tan-1(2t/d).

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