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1. 发明专利

JP2011161523A Polishing roller 审中-公开
标题翻译：抛光辊
公开(公告)号：JP2011161523A
公开(公告)日：2011-08-25
申请号：JP2010023698
申请日：2010-02-05
申请人： Marugen Tekkosho:Kk , Nihon Kenshi Co Ltd , 日本研紙株式会社 , 株式会社丸源鐵工所
发明人： YAMAMOTO NOBUYUKI , SUZUKI NOBUHIKO
IPC分类号： B24D13/12
摘要： PROBLEM TO BE SOLVED: To provide a polishing roller capable of reusing a core material and contributing to effective use of resources or reduction of production cost. SOLUTION: A buff roller 1 as the polishing roller has a polishing cylinder 3 formed into a cylindrical shape by a nonwoven fabric polishing material and the core material 5 with rigidity detachably inserted into the polishing cylinder 3. The core material 5 has an outer cylinder 7 having a slit 15 in an axial direction and an inner cylinder 9 having an elastic member 19 extending in the axial direction at three places of an outer circumferential face. Two of the three elastic members 19 are preliminarily fixed to the inner cylinder 9. After the inner cylinder 9 is inserted into the outer cylinder 7 inserted and set into the polishing cylinder 3, the remaining one elastic member 19C is press-fitted thereinto through a longitudinal groove 17, the outer cylinder 7 is expanded by elastic force due to the press-fitting and pressed to the inner circumferential face of the polishing cylinder 3, and the roundness of the core material 5 to the polishing cylinder 3 is assured. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够重新使用芯材并且有助于有效利用资源或降低生产成本的抛光辊。作为抛光辊的抛光辊1具有通过无纺布研磨材料形成为圆筒状的研磨滚筒3，并且具有刚性可拆卸地插入到研磨滚筒3中的芯材5.芯材5具有外筒7在轴向上具有狭缝15，内筒9具有在外周面的三个位置沿轴向延伸的弹性构件19。三个弹性构件19中的两个预先固定到内筒9.在将内筒9插入插入并设置到抛光缸3中的外筒7中之后，剩余的一个弹性构件19C通过纵向凹槽17，外筒7由于压配而被弹力膨胀并被压到抛光滚筒3的内周面，并且确保了芯材5到研磨滚筒3的圆度。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP3691852B2 Polishing pad 失效
公开(公告)号：JP3691852B2
公开(公告)日：2005-09-07
申请号：JP50955797
申请日：1996-08-20
申请人：ロームアンドハースエレクトロニックマテリアルズシーエムピーホウルディングスインコーポレイテッド
发明人：ジョンヴィー．エイチ．ロバーツ
IPC分类号： B24B37/20 , B24B37/26 , B24D7/12 , B24D13/12 , H01L21/304 , B24B37/00
CPC分类号： B24B37/205 , B24B37/26 , Y10T428/31
摘要： A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This is accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.

5. 发明专利

JP2005210143A Manufacturing method of polishing pad and polishing pad 有权
标题翻译：抛光垫和抛光垫的制造方法
公开(公告)号：JP2005210143A
公开(公告)日：2005-08-04
申请号：JP2005112423
申请日：2005-04-08
申请人： Rohm & Haas Electronic Materials Cmp Holdings Inc , ロームアンドハースエレクトロニックマテリアルズシーエムピーホウルディングスインコーポレイテッド
发明人： ROBERTS JOHN V H
IPC分类号： B24B37/20 , B24B37/26 , B24D7/12 , B24D13/12 , H01L21/304 , B24B37/00 , B24B37/04
CPC分类号： B24B37/205 , B24B37/26 , Y10T428/31
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing pad which is useful for the in-situ detection of an end point by means of an optical method, and which is useful for polishing a wafer on which an IC is mounted, and such a pad. SOLUTION: The manufacturing method of a pad, which is useful for the in situ-detection of an end point by means of an optical method, also useful for polishing a wafer on which an IC is mounted, the pad including a first part made of a first resin and a second part made of a second resin, a first part made of a hard homogeneous resin sheet with no intrinsic ability to absorb or transport slurry particles, and is transparent to the light beam having a wavelength within the range of 190 to 3,500 nm, includes steps of: (1) providing a rod or a plug made of the first resin; (2) arranging the rod or the plug made of the first resin in the second resin being in a liquid state; (3) hardening the second resin to obtain a shaped body; and (4) slicing the shaped body. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种抛光垫的制造方法，其可用于通过光学方法原位检测端点，并且其可用于抛光IC上的晶片安装和这样的垫。解决方案：用于通过光学方法对端点的原位检测有用的焊盘的制造方法也可用于抛光其上安装有IC的晶片，所述焊盘包括第一由第一树脂制成的部分和由第二树脂制成的第二部分，由不具有吸收或输送浆料颗粒的固有能力的硬质均匀树脂片制成的第一部分，并且对波长在该范围内的波长是透明的包括以下步骤：（1）提供由第一树脂制成的棒或塞子; （2）将由所述第一树脂制成的所述杆或所述塞子设置在所述第二树脂中的液态; （3）硬化第二树脂以获得成形体; （4）切割成形体。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004511083A The base pad for polishing pad 有权
公开(公告)号：JP2004511083A
公开(公告)日：2004-04-08
申请号：JP2002506890
申请日：2001-06-29
申请人：ロデールホールディングスインコーポレイテッドRodel Holdings,Inc.
发明人：スコット，ダイアン・ビー． , ツァン，タオ , ベイカー，アーサー・リチャード・ザ・サード
IPC分类号： B24B37/22 , B24B37/24 , B24D11/02 , B24D13/12 , B24D13/14 , H01L21/304 , B24B37/00
CPC分类号： B24B37/22 , B24B37/24 , B24D11/02
摘要： The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.

7. 发明专利

JP2004501789A Grooved polishing pad and method of use 有权
公开(公告)号：JP2004501789A
公开(公告)日：2004-01-22
申请号：JP2002506895
申请日：2001-06-29
申请人：インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation
发明人：チェン、シン−ツォン , ディビス、ケネス、エム , ロッドベル、ケネス、ピー
IPC分类号： B24B37/26 , B24D13/12 , B24D13/14 , B24D18/00 , H01L21/304 , B24B37/00
CPC分类号： B24B37/26 , B24D18/00
摘要：【課題】高品質のウェハに均一に研磨された表面を確実に形成することができる溝付き研磨パッドを提供すること。
【解決手段】パッドの作用表面がルータ・ビットおよびルータ・ビットに隣接する少なくとも１つの突出停止部材から離間してこれらと向き合うようにして、パッドを支持表面上で位置決めすることにより、ＣＭＰパッドに溝を形成する。ビットの外側端部は停止部材の先まで突出している。ビットが回転しているときに、ビットとパッドとを軸方向に相対的に移動させると、ビットの外側端部がパッドに最初の凹部を彫り込む。次いで、回転しているビットとパッドとを横方向に相対的に移動させて、該凹部から離れるように横方向に延びる、該凹部とほぼ同じ深さを有する溝を形成する。ビットおよびパッドの様々な横方向移動を用いて、様々な溝パターンを形成する。溝パターンの深さは、１つまたは複数の停止部材によって精密に制御される。溝は、パッドの研磨表面および／または反対側の後面に形成することができ、後面の溝を研磨表面または前面の溝と相互接続するための通路を設けることができる。研磨表面の溝は、研磨表面が加工物表面と接触している間に研磨用スラリーが流れることができる出口を備えることができる。
【選択図】図１

8. 发明专利

JP2000198061A CHEMICAL MECHANICAL POLISHING PAD 失效
公开(公告)号：JP2000198061A
公开(公告)日：2000-07-18
申请号：JP164299
申请日：1999-01-07
申请人： UNITED MICROELECTRONICS CORP
发明人： LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , YO SHUKO , GO KONRIN , YU FUKUYO
IPC分类号： B24B37/26 , B24D13/12 , B24D13/14 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To uniformly distribute the slurry to accelerate the polishing by designing a pattern of stream line grooves on a chemical mechanical polishing pad on the basis of a flow equation obtained from the blowout flow and the vortex flow. SOLUTION: The direction of a slurry flow includes the blowout flow and the vortex flow mentioned in an equation (I). In the equation I, Ψ is a stream line function, m is a strength parameter of blowout flow, k is a strength parameter of vortex flow, ln is a natural logarithm, and r, θ and z are coordinate parameters. A stream line groove function of an equation II is obtained on the basis of the equation I. In the equation II, exp is an exponential function, and C1 = constant = exp (Ψ/k). A designed pattern of the stream line grooves formed on a polishing pad for slurry is obtained on the basis of the equation I. The polishing pad is designed on the basis of the optimum result of the stream line groove pattern. By the stream line grooves, the direction of the slurry current can be optimized, and the slurry can be uniformly distributed under a polishing head. Whereby the polishing effect and the flatness can be effectively improved.

9. 发明专利

JP2000158324A DEVICE AND METHOD FOR CHEMICALLY AND MECHANICALLY FLATTENING SEMI-CONDUCTOR WAFER 失效
公开(公告)号：JP2000158324A
公开(公告)日：2000-06-13
申请号：JP32865099
申请日：1999-11-18
申请人： CHARTERED SEMICONDUCTOR MFG
发明人： SUDIPTO RANENDRA ROY
IPC分类号： B24B37/04 , B24B53/007 , B24B57/02 , B24D13/12 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To prevent non-uniformity of polishing of a wafer by mounting a device (cylindrical body) including a plurality of abrasive pads to the outside of a hollow core in parallel with the hollow core, moving the abrasive pads (cylindrical) in the X-Y-Z direction, and rotating it. SOLUTION: For example, a device (cylindrical body) including four abrasive pads 58 is mounted to the outside of a hollow core 56 in parallel with the hollow core 56. A pad/core assembly 54 is rotated around its axial line 82 by a rotation actuator 64. The pad/core assembly 54 moves in the X-Y-Z direction as well as the rotation. A wafer carrier 53 mounted with a wafer 52 is also rotated around the axial line 82. In performing a polishing operation, an abrasive pad conditioner 60 is abutted to the abrasive pads 58. This abutting recovers and adjusts the abrasive pads 58. The rotation driving device 64 rotates the pad/core assembly 54 around the axial line 82.

10. 发明专利

JPH11156699A SURFACE POLISHING PAD 失效
公开(公告)号：JPH11156699A
公开(公告)日：1999-06-15
申请号：JP33944397
申请日：1997-11-25
申请人： SPEEDFAM CO LTD
发明人： ARAI HATSUYUKI , OU JIYOSHIN
IPC分类号： B24B37/20 , B24B37/22 , B24B37/24 , B24B37/26 , B24D3/22 , B24D13/12 , B24D13/14 , H01L21/302 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To provide a two-layered polishing pad which can have abrasive liquid penetrated entirely uniformly in the pad and can polish a wafer uniformly to part near the outer periphery. SOLUTION: The pad consists of a hard upper layer member 11 which is made of a material having permeability of abrasive liquid and has low compressibility, a soft lower layer member 12 which is made of a similar material and has high compressibility, and an adhering layer 13 which is sandwiched between the both members and adheres these materials each other. Plural narrow grooves 14 for promoting penetration of the abrasive liquid into the lower layer member 12 and for dividing a pad surface into plural locally-movable small regions 15 are drilled in the pad surface with interval where maximum length of one side of the small regions is less than 10 mm and in the depth more than at least a half of the thickness of the upper layer member 11.

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