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1. 发明专利

JP3767633B2 Processing and / or assembly equipment 失效
公开(公告)号：JP3767633B2
公开(公告)日：2006-04-19
申请号：JP50369999
申请日：1998-06-12
申请人：ファインツールインターナショナルホルディング
发明人：クメス，ジグムンツ
IPC分类号： B23Q3/157 , B23Q37/00 , B23P21/00 , B23Q3/06 , B23Q39/00 , B23Q41/00 , H05K13/04
CPC分类号： H05K13/04 , B23P21/006 , B23Q37/00 , B23Q39/00 , B23Q41/00 , Y10T29/5155 , Y10T29/5157 , Y10T29/53061

2. 发明专利

JP5404438B2 Repair equipment and repair method 有权
公开(公告)号：JP5404438B2
公开(公告)日：2014-01-29
申请号：JP2010006075
申请日：2010-01-14
申请人：三菱重工業株式会社
发明人：献大西
IPC分类号： B23B39/14 , B23K31/00 , B23K37/08 , B23P6/00 , B23Q17/20 , G21C17/003 , G21C19/02
CPC分类号： G21C17/017 , B23B3/26 , B23B29/03489 , B23B41/00 , B23P23/02 , B23Q9/00 , B23Q9/0057 , G21C19/207 , Y10T29/511 , Y10T29/5157 , Y10T29/5168 , Y10T29/5199 , Y10T29/52 , Y10T82/125 , Y10T82/22 , Y10T408/03 , Y10T408/16 , Y10T408/558 , Y10T408/5583

3. 发明专利

JP2012209538A Manufacturing method of laminated ceramic electronic component 有权
标题翻译：层压陶瓷电子元件的制造方法
公开(公告)号：JP2012209538A
公开(公告)日：2012-10-25
申请号：JP2012024232
申请日：2012-02-07
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： MATSUI TOGO , DOOKA MINORU , TAKASHIMA HIROYOSHI , OKAJIMA KENICHI
IPC分类号： H01G4/30 , H01G4/12
CPC分类号： H01G4/30 , H01G4/002 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/435 , Y10T29/5157
摘要： PROBLEM TO BE SOLVED: To provide a method capable of efficiently applying ceramic paste without thickness variation only onto a side face of a green chip, when obtaining the green chip in the state of exposing an internal electrode on the side face and then applying the ceramic paste so as to cover the internal electrode exposed on the side face of the green chip in order to form a protective area at a side part of the internal electrode.SOLUTION: To respective side faces 20 of a plurality of green chips 19 arrayed in row and column directions after cutting of a mother block, a ceramic paste 43 is applied using an application plate 44. In an application step, the ceramic paste 43 is transferred to the side faces 20 by relatively moving the green chips 19 and the application plate 44 in an extending direction of the side faces 20 in the state that the ceramic paste 43 is connected to both of the green chips 19 and the application plate 44 while separating the green chips 19 from the application plate 44.
摘要翻译：要解决的问题：为了提供一种能够在没有厚度变化的情况下有效地施加陶瓷膏到绿色芯片的侧面上的方法，当在侧面上暴露内部电极的状态下获得绿色芯片时，施加陶瓷膏以覆盖暴露在绿色芯片的侧面上的内部电极，以在内部电极的侧部形成保护区域。解决方案：在切割母体块之后，以行和列方向排列的多个绿色芯片19的各个侧面20使用涂布板44涂覆陶瓷膏43.在涂布步骤中，将陶瓷糊 43通过在陶瓷膏43连接到绿色芯片19和应用板两者的状态下相对于侧面20的延伸方向相对移动绿色芯片19和施加板44而转移到侧面20 44，同时将绿色芯片19与应用板44分开。版权所有：（C）2013，JPO＆INPIT

4. 发明专利

JP5678905B2 積層セラミック電子部品の製造方法有权
公开(公告)号：JP5678905B2
公开(公告)日：2015-03-04
申请号：JP2012024232
申请日：2012-02-07
申请人：株式会社村田製作所
发明人：透悟松井 , 透悟松井 , 稔堂岡 , 稔堂岡 , 高島　浩嘉 , 浩嘉高島 , 岡島　健一 , 健一岡島
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/30 , H01G4/002 , H01G4/12 , H01G13/00 , Y10T29/43 , Y10T29/435 , Y10T29/5157

5. 发明专利

JP2011143506A Repairing device and repairing method 有权
标题翻译：修理装置和修理方法
公开(公告)号：JP2011143506A
公开(公告)日：2011-07-28
申请号：JP2010006075
申请日：2010-01-14
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： ONISHI KEN
IPC分类号： B23B5/36 , B23P6/00 , B23Q17/20 , G21C17/003 , G21C19/02
CPC分类号： G21C17/017 , B23B3/26 , B23B29/03489 , B23B41/00 , B23P23/02 , B23Q9/00 , B23Q9/0057 , G21C19/207 , Y10T29/511 , Y10T29/5157 , Y10T29/5168 , Y10T29/5199 , Y10T29/52 , Y10T82/125 , Y10T82/22 , Y10T408/03 , Y10T408/16 , Y10T408/558 , Y10T408/5583
摘要： PROBLEM TO BE SOLVED: To provide a repairing device and a repairing method improving efficiency of a repairing action. SOLUTION: The repairing device 1 includes a casing 21, a slide shaft 22 arranged so as to slide with respect to the casing 21, a turntable 24 arranged so as to rotate with respect to the slide shaft 22, a cutting mechanism 4 arranged in the turntable 24 and having a cutting tool 41, and a proceeding/retreating mechanism 6 proceedingly/retreatingly displacing the radius of rotation of the cutting mechanism 4 with respect to rotation of the turntable 24. Under a state the casing 21 is aligned and positioned with respect to a pipe, the turntable 24 is rotatingly displaced and the proceeding/retreating mechanism 6 proceedingly/retreatingly displaces the cutting mechanism 4 while the slide shaft 22 slides in the axial direction, and thereby the cutting tool 41 machines the inner peripheral surface of the pipe while spirally rotating along the inner peripheral surface shape of the pipe. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供修复装置和提高修复效果的修复方法。解决方案：修理装置1包括壳体21，布置成相对于壳体21滑动的滑动轴22，相对于滑动轴22布置成转动的转盘24，切割机构4 布置在转台24中并且具有切割工具41，并且前进/后退机构6相对于转盘24的旋转而继续/后退地移动切割机构4的旋转半径。在壳体21对准的状态下，相对于管子定位，转盘24旋转移位，并且前进/后退机构6在滑动轴22沿轴向方向滑动的同时进行切割机构4的后退移位，从而切割工具41对内周面进行加工沿着管的内周面形状旋转。版权所有（C）2011，JPO＆INPIT

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