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1. 发明专利

JP4795355B2 Substrate structure 有权
公开(公告)号：JP4795355B2
公开(公告)日：2011-10-19
申请号：JP2007533117
申请日：2006-02-20
申请人：パナソニック株式会社
发明人：清史中西 , 孝介久保田 , 吉博宇田 , 一弘小西 , 源久小谷 , 正浩小野 , 盛司山口 , 和博新地 , 温雄早川 , 健朗松木 , 厚志片桐 , 悟留河 , 英士西村
IPC分类号： H05K9/00 , H05K1/02 , H05K3/28
CPC分类号： H05K3/284 , H01L2224/16225 , H01L2924/00014 , H05K1/0203 , H05K1/0218 , H05K1/0274 , H05K7/20463 , H05K9/0047 , H05K9/0086 , H05K2201/0209 , H05K2201/0215 , H05K2201/10128 , H05K2201/10515 , H05K2201/2054 , H05K2203/1316 , H05K2203/1322 , H01L2224/0401
摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. ln the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

2. 发明专利

KR102231055B1 KR102231055B1 - Shielding package, and manufacturing method of the shielding package 有权
公开(公告)号：KR102231055B1
公开(公告)日：2021-03-22
申请号：KR1020207030253A
申请日：2019-07-01
申请人： 타츠타 전선 주식회사
发明人： 히로아키 우메다 , 히데토시 노구치 , 하지메 나카조노
IPC分类号： H01L23/60 , H01L23/04 , H01L23/31
CPC分类号： H05K9/0045 , H01L23/60 , H01L23/00 , H01L23/04 , H01L23/28 , H01L23/31 , H05K9/00 , H05K9/0047 , H05K9/0084
摘要： 본 발명은, 식별성이 높은 도형이 차폐층의 표면에 형성된 차폐 패키지를 제공한다. 본 발명의 차폐 패키지는, 전자 부품이 수지층에 의해 봉지된 패키지와, 상기 패키지를 덮는 차폐층으로 이루어지는 차폐 패키지로서, 상기 수지층의 표면은, 복수의 홈부가 집합함으로써 선묘 및/또는 점묘된 묘사 영역과, 상기 묘사 영역 이외의 비묘사 영역으로 되고, 상기 묘사 영역 상에 위치하는 상기 차폐층의 표면에는, 상기 홈부에 기인하는 복수의 오목부가 형성되어 있고, 상기 오목부는, 집합되어 도형을 선묘 및/또는 점묘하고 있는 것을 특징으로 한다.

5. 发明专利

JP2014139077A Lightweight audio system for automotive applications 有权
标题翻译：用于汽车应用的轻型音频系统
公开(公告)号：JP2014139077A
公开(公告)日：2014-07-31
申请号：JP2014022945
申请日：2014-02-10
申请人： Delphi Technologies Inc , デルファイ・テクノロジーズ・インコーポレーテッド
发明人： CHRIS R SNIDER , VINEET GUPTA , CURTIS A STAPERT , PAUL C BURTON , MICHAEL G COADY , JOSEPH K HUNTZINGER , KEVIN E MEYER , ROBERT L VADAS , TIMOTHY D GARNER , JEFFREY T BELL , DONALD G MOESCHBERGER , ALLEN E OBERLIN , JOHN M MATLY , JERRY J WENDLING , KIP R PIEL
IPC分类号： B60R11/02 , B29C45/14 , H05F1/00 , H05K7/20 , H05K9/00
CPC分类号： H05K9/0007 , B29C59/16 , B60R11/02 , G06F11/00 , H04B1/082 , H04R1/02 , H05K1/0215 , H05K1/141 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/20409 , H05K7/20418 , H05K7/20436 , H05K9/0047 , H05K9/0079 , H05K9/0081 , H05K13/00 , H05K2201/09081 , H05K2201/10386 , H05K2201/10446 , Y10T16/547 , Y10T16/5476 , Y10T29/49002 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169 , Y10T29/49172 , Y10T29/4957 , Y10T29/49826 , Y10T29/49861 , Y10T29/5313 , Y10T74/20396 , Y10T403/70 , Y10T403/77 , Y10T428/24289
摘要： PROBLEM TO BE SOLVED: To provide a lightweight radio/CD player for vehicular application, which is "fastenerless" and provided with details to accept playback mechanisms and audio devices, as well as circuit boards required for electrical control and display.SOLUTION: The player comprises a case and frontal interface of a composite structure including an insert molded electrically conductive wire mesh screen. The PCB architecture is divided into first board carrying common circuit components in a surface mount configuration suitable for high volume production, and second board carrying application specific circuit components in a wave soldered stick mount configuration. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools etc. The major components and subassemblies self-interconnect by integral guide and self-connection mechanisms of a slide lock and a snap lock. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.
摘要翻译：要解决的问题：提供用于车辆应用的轻便无线电/ CD播放器，其是“无紧固件”并且具有接收回放机构和音频设备的细节以及电气控制和显示所需的电路板。解决方案：播放器包括复合结构的壳体和正面界面，该复合结构包括插入模制的导电丝网。 PCB结构被划分为第一板，其承载具有适合于大批量生产的表面安装配置中的公共电路部件，以及第二板承载具有波焊焊棒安装配置的应用特定电路部件。主要组件和组件在最终组装过程中是自行固定的，无需专用工具等。主要组件和组件通过滑动锁和卡扣锁的整体引导和自连接机构自相互连接。无线电架构包括改进的按钮，采用4杆活动铰链和前装饰装饰钮扣。

6. 发明专利

JP5344032B2 Injection-molded articles and methods for their production 有权
公开(公告)号：JP5344032B2
公开(公告)日：2013-11-20
申请号：JP2011503299
申请日：2011-01-06
申请人：東レ株式会社
发明人：寿寛田部谷 , 泰憲長嶋 , 比呂実谷口 , 孝幸大西
IPC分类号： B29C45/14 , B29C45/26 , H01Q15/14 , H01Q17/00 , H05K9/00
CPC分类号： B29C45/1657 , B29C45/0013 , B29L2031/3437 , G06F1/1656 , G06F1/181 , H05K9/0047
摘要： Provided is an injection molded article having a junction surface where side end surfaces of two thermoplastic resin members are bonded by injection molding one of the members onto the side end surface of the other member, wherein (a) a junction line where a longitudinal cross sectional surface of the molded article cross crosses with the junction surface is defined by a first junction line segment extending from the front surface toward the inside of the molded article and having a terminal on the inside, a second junction line segment extending from the back surface toward the inside of the molded article and having a terminal on the inside, and a third junction line segment connecting the terminal of the first junction line segment and the terminal of the second junction line segment, as well as (b-1) directions (A) of the respective junction line segments with respect to the normal line of the front surface or the back surface of the one thermoplastic resin member are different and the direction (B) of the third junction line segment is inclined with respect to the normal line, or (b-2) the directions (A) are the same in the first junction line segment and the second junction line segment and are different between the first junction line segment and the third junction line segment and the direction (B) is inclined with respect to the normal line.

7. 发明专利

JPWO2011086959A1 射出成形品およびその製造方法有权
公开(公告)号：JPWO2011086959A1
公开(公告)日：2013-05-20
申请号：JP2011503299
申请日：2011-01-06
申请人：東レ株式会社
发明人：寿寛田部谷 , 寿寛田部谷 , 泰憲長嶋 , 泰憲長嶋 , 比呂実谷口 , 比呂実谷口 , 孝幸大西 , 孝幸大西
IPC分类号： B29C45/14 , B29C45/26
CPC分类号： B29C45/1657 , B29C45/0013 , B29L2031/3437 , G06F1/1656 , G06F1/181 , H05K9/0047
摘要：一方の熱可塑性樹脂部材の側端面に対し他方の熱可塑性樹脂部材が射出成形されて双方の部材が双方の側端面において接合された接合面を有する射出成形品であって、(a)成形品の縦断面と接合面との交わりにより描かれる接合線が、成形品の表面から内側に延び内側に終端を有する第1の接合線分、成形品の裏面から内側に延び内側に終端を有する第2の接合線分、および、第1の接合線分の終端と第2の接合線分の終端とを結ぶ第3の接合線分からなり、かつ、(b−1)一方の熱可塑性樹脂部材の表面あるいは裏面の法線となす各接合線分の方向(A)が、各接合線分とも異なるとともに、第3の接合線分の方向(B)が法線に対し傾斜している、あるいは、(b−2)方向(A)が第1の接合線分と第2の接合線分において同じであり、第1の接合線分と第3の接合線分とにおいて異なるとともに、方向(B)が法線に対し傾斜している、射出成形品。

8. 发明专利

JPH11277582A Method and apparatus for molding electromagnetic shielding housing 审中-公开
标题翻译：用于模制电磁屏蔽外壳的方法和装置
公开(公告)号：JPH11277582A
公开(公告)日：1999-10-12
申请号：JP3421199
申请日：1999-02-12
申请人： Natl Standard Co , ナショナルスタンダードカンパニー
发明人： BURTON PAUL
IPC分类号： H01F27/36 , B29C45/14 , B29C45/26 , H05K9/00
CPC分类号： H05K9/0047 , B29C45/14065 , B29C45/14778 , B29C2045/14114 , B29K2995/0011
摘要： PROBLEM TO BE SOLVED: To obtain an injection molded case-like shielding housing for preventing an invasion and divergence of an electromagnetic wave by disposing and holding a conductive grid material at a predetermined position on a surface of a molding and in a mold by a magnetic positioning means, and then forming the housing.
SOLUTION: A grid material or a board 26 is inserted into a mold, and engaged with a surface of a core 14 of an injection molding machine 12. A mesh-like grid material 26 forms an electromagnetic wave shielding housing in an injection mold to prevent an invasion and divergence of an electromagnetic wave to surrounding electronic equipment. A wire grid material 26 forms a structure for performing high flexibility and strength. An insertion and a disposition of the board 26 are facilitated in a molding cavity of the machine 12, and can be brought into coincidence with a shape of a core surface. The material 26 can be held at the core surface of the core 14 by using a holding means such as a magnet 18 or the like to prevent the invasion and the divergence of the wave to the equipment.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了获得注射成型的壳状屏蔽壳体，用于通过将导电栅格材料设置并保持在模制件的表面上的预定位置和通过磁性的模具中来防止电磁波的侵入和发散定位装置，然后形成外壳。解决方案：将格栅材料或板26插入模具中，并与注射成型机12的芯体14的表面接合。网状栅格材料26在注射模具中形成电磁波屏蔽壳体以防止对周边电子设备的电磁波的入侵和分歧。线栅材料26形成用于实现高柔性和强度的结构。在机器12的模制腔中易于插入和布置板26，并且可以与芯表面的形状一致。材料26可以通过使用诸如磁体18等的保持装置来保持在芯14的芯表面处，以防止波浪到设备的侵入和发散。

9. 发明专利

JP6278616B2 電子モジュールの保持および保護のためのシャーシシステムおよび方法有权
公开(公告)号：JP6278616B2
公开(公告)日：2018-02-14
申请号：JP2013121496
申请日：2013-06-10
申请人：ザ・ボーイング・カンパニー , The Boeing Company
发明人：ウィルキンス, ドナルドフランク
IPC分类号： H05K7/14 , B64D47/00 , H05K9/00
CPC分类号： H05K7/20445 , H05K9/0047 , Y10T29/49002

10. 发明专利

JP2013530532A Use of blowing agents to improve the Emi shielding characteristics 审中-公开
公开(公告)号：JP2013530532A
公开(公告)日：2013-07-25
申请号：JP2013514622
申请日：2011-05-26
申请人：ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニムN V Bekaert Societe Anonyme
发明人：デウィッテ，リック , ヴェルブルージュ，ヴィム
IPC分类号： H05K9/00 , B29C45/00 , B32B5/18 , B32B27/18
CPC分类号： H05K9/0047 , B29C44/12 , B29K2995/0005 , H05K9/009
摘要：電磁干渉に対するシールド特性又は静電放電特性を改良するハウジングに適した導電性プラスチック物品（３１）が開示されている。このプラスチック物品は、低圧射出成形によって作製される。当該物品（３１）は、少なくとも０．２５体積%の導電性添加物（３８）を含んでいる。当該物品（３１）は気泡構造を含んでいる。気泡構造は、膨張剤又は発泡剤を用いることによって作製されている。導電性プラスチック物品（３１）の製造において、少なくとも０．２５重量％の膨張剤又は発泡剤が用いられる。
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