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2. 发明专利

JP2004050830A Method for assembling small electrical machine structure in liquid ejector 审中-公开
公开(公告)号：JP2004050830A
公开(公告)日：2004-02-19
申请号：JP2003176428
申请日：2003-06-20
申请人： Eastman Kodak Co , イーストマンコダックカンパニー
发明人： DEBAR MICHAEL J , CHRISTOPHER N DELAMETER , FURLANI EDWARD P
IPC分类号： B41J2/16
CPC分类号： B41J2/16 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1642 , B41J2002/043
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrostatic actuator of a multilayer small electric machine in a liquid ejector.
SOLUTION: The actuator is generated by settling in an electrode layer of an initial layer. The patterned layer of a sacrificial substance is formed in a first electrode layer in a manner that makes the area of the first electrode layer is exposed by a subsequent layer. A second electrode layer is settled and patterned in a subsequent layer. Subsequently, the third patterned layer of the sacrificial substance has an opened portion due to the exposed area of the first electrode layer and formed in the second electrode layer. The structure is settled in a third layer exposing the surface of the third layer, patterned and flattened. A third electrode layer is settled and patterned in the flattened structure and on the exposed surface. The sacrificial substance is partially removed, whereby the first electrode layer, the structure and the third electrode layer freely move correlatively with the second electrode layer.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2018167446A アクチュエータ装置审中-公开
公开(公告)号：JP2018167446A
公开(公告)日：2018-11-01
申请号：JP2017065592
申请日：2017-03-29
申请人：ブラザー工業株式会社
发明人：垣内徹
IPC分类号： B41J2/14
CPC分类号： H01L41/0475 , B41J2/045 , B41J2/14201 , B41J2/14233 , B41J2002/043 , B41J2002/14491 , H01L41/0533 , H01L41/0973 , H01L41/1876
摘要：【課題】端子の断線防止と、アクチュエータ基板と配線基板との接着強度の向上とを、共に実現する。【解決手段】ヘッド1は、共通接点12gを有する流路基板と、共通接点12gと電気的に接続される共通配線18gを有するCOF18とを含む。COF18は、共通接点12gと共通配線18gとが対向した状態で、接着剤を介して流路基板に接着されている。共通配線18gは、共通接点12gとの接着領域18Agに、互いに離隔した5つの端子18g1と、5つの端子18g1と連結された基部18g2とを有する。【選択図】図6

4. 发明专利

JP4221638B2 Manufacturing method and a manufacturing method of the electrostatic actuator of the printer head 有权
公开(公告)号：JP4221638B2
公开(公告)日：2009-02-12
申请号：JP2001039713
申请日：2001-02-16
申请人：ソニー株式会社
发明人：五輪男牛之▲浜▼ , 徹谷川
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： B41J2/1642 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1635 , B41J2/1639 , B41J2/1645 , B41J2/1646 , B41J2002/043 , Y10T29/49401

5. 发明专利

JP2007253608A Manufacturing process of nozzle substrate, manufacturing process of droplet discharge head, droplet discharge head, and droplet ejection apparatus 有权
标题翻译：喷嘴基板的制造工艺，喷墨头的制造工艺，喷墨头和喷射喷涂装置
公开(公告)号：JP2007253608A
公开(公告)日：2007-10-04
申请号：JP2006281305
申请日：2006-10-16
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ARAKAWA KATSUHARU , BIZEN RYOICHI
IPC分类号： B41J2/135 , B41J2/045 , B41J2/055 , B41J2/16
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/043 , B41J2002/14419
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing process of a nozzle substrate which cements firmly with a supporting substrate at the time of working of a substrate and keeps the substrate not damaged, moreover, enables the easy release of the supporting substrate from the substrate, prevents a crack from reaching even a part for a head section when the crack arises in the substrate, facilitates handling thereby, and is useful to an improvement in yield or productivity. SOLUTION: The manufacturing process of the nozzle substrate comprises the step of forming a recess used as a nozzle hole 11 by etching working, the step of sticking the first supporting substrate 61 on a surface by a working side which has the recess, a step of opening the tip of the recess by forming a sheet metal in a desired thickness from the substrate to be processed 100 from the surface which stuck the first supporting substrate and the surface by the opposite side, the step of sticking the second supporting substrate 62 on the surface by the side of opening to which the opening of the recess is carried out, the step of joining the third supporting substrate to the stripped surface by exfoliating the first supporting substrate from the processed substrate, and the step of exfoliating the second supporting substrate from the processed substrate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供在基板加工时用支撑基板牢固粘合的喷嘴基板的制造工艺，并且保持基板不被损坏，此外，能够容易地将支撑基板从当在基板中出现裂纹时，基板防止裂纹到达头部的一部分，从而便于其处理，并且对于提高产量或生产率是有用的。解决方案：喷嘴基板的制造过程包括通过蚀刻加工形成用作喷嘴孔11的凹槽的步骤，通过具有凹部的工作侧将第一支撑基板61粘贴在表面上的步骤，从所述第一支撑基板的表面和相对侧的表面形成从所述被处理基板100的所需厚度的金属板开始所述凹部的前端的工序;将所述第二支撑基板 62是通过进行凹部的开口部的开口侧的表面，通过从被处理基板剥离第一支撑基板而将第三支撑基板接合到剥离面的工序，以及将第二支撑基板剥离的工序从处理过的衬底支撑衬底。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2015093488A 湿度を低減するためのMEMSアクチュエータ圧力補償構造有权
标题翻译： MEMS致动器压力补偿结构降低湿度
公开(公告)号：JP2015093488A
公开(公告)日：2015-05-18
申请号：JP2014219975
申请日：2014-10-29
申请人：ゼロックスコーポレイション , XEROX CORPORATION
发明人：ピーター・ジェイ・ニストロム , バリー・ピー・マンデル
IPC分类号： B41J2/14
CPC分类号： B41J2/045 , B41J2/14314 , B41J2002/043
摘要：【課題】安定した動作ができる静電駆動インクジェット印刷ヘッドを提供する。【解決手段】通気システム及びアクチュエータアレイを含む印刷ヘッド10において、各アクチュエータ15は、アクチュエータ空気チャンバ20を含む。通気システムは、大気に対してアクチュエータ空気チャンバ20を通気する空気経路を含む。印刷ヘッド10は、さらに、空気経路内の空気から水分を除去するように構成された乾燥機50、52を含む。乾燥機50、52は、乾燥剤50、抵抗ヒータ52又はその双方を含む。【選択図】図1
摘要翻译：要解决的问题：提供能够稳定运行的静电喷墨打印头。解决方案：在包括排气系统和致动器阵列的打印头10中，每个致动器15包括致动器空气室20.排气系统包括空气路径每个致动器空气室20排放到大气中。打印头10还包括一个干燥器50,52，该干燥器被构造成从空气路径内的空气中除去水分。干燥器50,52包括干燥剂50，电阻加热器52或其二者。

8. 发明专利

JP2007190772A Droplet ejection head, droplet ejector, process for manufacturing droplet ejection head, and process for manufacturing droplet ejector 有权
标题翻译：喷射喷头，喷射器，制造喷射头的过程以及制造喷射器的过程
公开(公告)号：JP2007190772A
公开(公告)日：2007-08-02
申请号：JP2006010333
申请日：2006-01-18
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： OTANI KAZUFUMI
IPC分类号： B41J2/055 , B41J2/045 , B41J2/16
CPC分类号： B41J2002/043 , B41J2002/14419
摘要： PROBLEM TO BE SOLVED: To provide a droplet ejection head, which can attain a high density of nozzles and prevent pressure interference between nozzles, and to provide its manufacturing process.
SOLUTION: The droplet ejection head 10 comprises a nozzle substrate 1, a cavity substrate 3 having an ejection chamber 31, and a reservoir substrate 2 having a reservoir 23 wherein a diaphragm portion 100 equipped with a resin membrane 111 for buffering a pressure variation is provided at a part on the wall of the reservoir 23. In the manufacturing process of the droplet ejection head 10, the diaphragm portion 100 is formed by etching a portion 100a of a silicon substrate 200 becoming the diaphragm portion down to a required depth from one side and then wet-etching a portion 23a serving as the reservoir from the opposite side of the silicon substrate 200.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种液滴喷射头，其能够获得高密度的喷嘴并防止喷嘴之间的压力干扰，并提供其制造过程。解决方案：液滴喷射头10包括喷嘴基板1，具有喷射室31的空腔基板3和具有储存器23的储存器基板2，其中隔膜部分100配备有用于缓冲压力的树脂膜111 在液滴喷射头10的制造过程中提供了变化。在液滴喷射头10的制造过程中，通过将形成隔膜部分的硅基板200的部分100a蚀刻到所需的深度然后从硅衬底200的相反侧湿蚀刻用作储存器的部分23a。（C）2007，JPO＆INPIT

9. 发明专利

JP3941387B2 Electrostatic actuator and a method of manufacturing the same 有权
公开(公告)号：JP3941387B2
公开(公告)日：2007-07-04
申请号：JP2000387321
申请日：2000-12-20
申请人：セイコーエプソン株式会社
发明人：靖史松野 , 博之石川 , 正寛藤井
IPC分类号： B41J2/055 , B41J2/16 , B41J2/045 , H02N1/00
CPC分类号： B41J2002/043

10. 发明专利

JP2006159661A Method for manufacturing liquid drop ejection head, liquid drop ejection head and liquid drop ejector 有权
标题翻译：制造液体喷射头，液体喷射头和液滴喷射器的方法
公开(公告)号：JP2006159661A
公开(公告)日：2006-06-22
申请号：JP2004354989
申请日：2004-12-08
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： ARAKAWA KATSUHARU , MATSUMOTO YASUTAKA
IPC分类号： B41J2/16
CPC分类号： B41J2/1634 , B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/043 , Y10T29/42 , Y10T29/49401 , Y10T156/1056
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid drop ejection head with high yield without causing any cracking or chipping of a silicon substrate during manufacture. SOLUTION: The method for manufacturing a liquid drop ejection head comprises a step for forming a recess becoming a nozzle 8 by etching one side of a silicon substrate 30, a step for sticking a supporting substrate 40 to the side of the silicon substrate 30 in which the recess becoming a nozzle 8 is formed, a step for thinning the silicon substrate 30 from the side opposite to the sticking side of the supporting substrate 40, and a step for stripping the supporting substrate 40 from the silicon substrate 30 after thinning the silicon substrate 30. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种以高产率制造液滴喷射头的方法，而不会在制造期间引起硅基板的任何破裂或碎裂。解决方案：液滴喷射头的制造方法包括通过蚀刻硅基板30的一侧来形成成为喷嘴8的凹部的步骤，将支撑基板40粘贴到硅基板侧的步骤 30，其中形成为喷嘴8的凹部，用于使硅基板30从与支撑基板40的粘贴侧相反的一侧变薄的步骤，以及在变薄之后从硅基板30剥离支撑基板40的步骤硅衬底30.版权所有（C）2006，JPO＆NCIPI

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