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    • 10. 发明专利
    • Vision regeneration assisting apparatus
    • 视觉再生辅助装置
    • JP2011115287A
    • 2011-06-16
    • JP2009273850
    • 2009-12-01
    • Nidek Co Ltd株式会社ニデック
    • SHODO KENZO
    • A61F2/14A61F9/007A61F9/08
    • A61F9/08A61N1/0543A61N1/36046
    • PROBLEM TO BE SOLVED: To provide a vision regeneration assisting apparatus capable of keeping the excellent connection state of an electronic circuit and a substrate through an installation base, preventing the invasion of body fluid to the electronic circuit and being implanted for a long period of time with high reliability. SOLUTION: The vision regeneration assisting apparatus includes: the substrate wherein stimulation electrodes for electrically stimulating the retina are respectively installed at one end of a plurality of traces; a control part comprising a multiplexer for controlling electric stimulation pulses to be transmitted to the respective stimulation electrodes; the installation base having a hermetic bottom member for sealing the control part and the installation surface of the control part and a contact surface with the substrate, and comprising a ceramic sintered body having a plurality of through-holes in the thickness direction in order to electrically connect the control part and the traces; and an inner conductor provided with a first conductive member wherein silver, molybdenum or tungsten is filled to a predetermined depth from an opening formed on the installation surface side of the control part as the main material of the conductive material, and a second conductive member wherein platinum or gold is filled in the remaining through-holes not filled with the first conductive member as the conductive material. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种视觉再生辅助装置,其能够通过安装基座保持电子电路和基板的良好连接状态,防止体液侵入电子电路并长时间植入 时间段可靠性高。 解决方案:视觉再生辅助装置包括:基板,其中用于电刺激视网膜的刺激电极分别安装在多个迹线的一端; 控制部分包括用于控制要传送到各个刺激电极的电刺激脉冲的多路复用器; 安装基座具有用于密封控制部分和控制部分的安装表面的密封底部构件和与基板的接触表面,并且包括在厚度方向上具有多个通孔的陶瓷烧结体,以便电 连接控制部分和走线; 以及设置有第一导电构件的内部导体,其中银,钼或钨从作为导电材料的主要材料的控制部分的安装表面侧上形成的开口填充到预定深度,以及第二导电构件, 铂或金填充在未填充有第一导电构件的剩余通孔中作为导电材料。 版权所有(C)2011,JPO&INPIT