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1. 发明专利

JP2001009729A SUPERABRASIVE GRAIN CUTTING WHEEL 失效
公开(公告)号：JP2001009729A
公开(公告)日：2001-01-16
申请号：JP21768099
申请日：1999-06-25
申请人： OSAKA DIAMOND IND
发明人： ISHITOBI YOSHIZUMI , OKANISHI YUKIO
IPC分类号： B24D3/00 , B24D5/12
摘要： PROBLEM TO BE SOLVED: To firmly join a superabrasive grain layer to a base board composed of a hard material by forming a nickel plating layer on a surface of a disk- shaped base board composed of a hard material, forming a copper plating layer on a surface of the nickel plating layer, and forming the superabrasive grain layer on a surface of the copper plating layer. SOLUTION: In a superabrasive grain cutting wheel, a nickel plating layer 3 is formed on a surface of a disk-shaped base board 2 composed of a hard material including carbide of a solid solution of molybdenum and tungsten or carbide of tungsten as a hard layer, a copper plating layer 4 is formed on a surface of the nickel plating layer 3, and a superabrasive grain layer 1 is formed on a surface of the copper plating layer 4. Thus, fixing force of the base board 2 to the superabrasive grain layer 1 is extremely strengthened to exhibit high performance over a long period without separating the superabrasive grain layer 1 from the base board 2 even under a severe condition of a high speed feed and a deep cut.

2. 发明专利

JP2000326234A SUPER-ABRASIVE GRAIN WHEEL FOR DEBURRING 失效
公开(公告)号：JP2000326234A
公开(公告)日：2000-11-28
申请号：JP17589599
申请日：1999-05-18
申请人： OSAKA DIAMOND IND
发明人： TANAKA MASARU , OGURA YOZO
IPC分类号： B24D7/00 , B24D3/00 , B24D3/06
摘要： PROBLEM TO BE SOLVED: To provide a super-abrasive grain wheel which has much higher material removing capability and longer life than those of conventional super-abrasive grain wheels and capable of highly efficient deburring, especially for various kinds of castings and MMC. SOLUTION: This cup-shaped super-abrasive grain wheel fixes super-abrasive grain whose average size is 100 to 2000 μm in a single layer on a base metal surface with a binder whose main ingredient is brazing filler metal, whereas the super-abrasive grain layer is formed with a flat part 2a perpendicular to a wheel rotating shaft C, and a tapered part 2b continuous to the flat part and inclining to the wheel rotating shaft, and its tapered part angle θ is set to 5 to 60 degrees.

3. 发明专利

JP2000317845A SUPER ABRASIVE GRAIN BLADE 失效
公开(公告)号：JP2000317845A
公开(公告)日：2000-11-21
申请号：JP16430899
申请日：1999-05-07
申请人： OSAKA DIAMOND IND
发明人： KOIKE AKIHIRO , ONISHI MINEO , SHIMIZU YUICHI
IPC分类号： B24D5/00 , B23D61/02 , B24D3/00 , B24D5/06 , B24D5/12
摘要： PROBLEM TO BE SOLVED: To heighten a noise preventive effect in a simple structure and improve the cutting quality and life by superimposing and joining plural discs through a separating material having aluminum component to form a base metal. SOLUTION: A base metal is formed by superimposing a central disc 11 and both side discs 12, 13. The discs 11, 12, 13 are, for example, made of steel of 0.45 mm thick, and a separating material 9 having an aluminum component is applied to the superposing surface except a super abrasive grain layer 2 forming part of the outer periphery. The central disc 11 with a diameter of 94 mm and both side discs 12, 3 with a diameter of 92 mm are joined by spot welding at equal spaces on the circumferences with radiuses of 41 mm and 14 mm. Thus, in the discs 11, 12, 13, when the outer peripheries are surrounded and filled with a mixture of diamond grains and metal powder of copper, tin, iron, nickel or the like and heat-sintered at 850 deg.C to form a super abrasive grain layer 2, the outer peripheral part is easily secured integrally, but the inner peripheral part is not secured to prevent mutual joining.

4. 发明专利

JP2000308971A SUPER-ABRASIVE GRAIN CUTTING WHEEL 失效
公开(公告)号：JP2000308971A
公开(公告)日：2000-11-07
申请号：JP15847399
申请日：1999-04-26
申请人： OSAKA DIAMOND IND
发明人： INOUE HARUO , OKANISHI YUKIO
IPC分类号： B24D3/00 , B24D3/06 , B24D3/14 , B24D3/28 , B24D5/12
摘要： PROBLEM TO BE SOLVED: To lower cutting resistance and to reduce dispersion and chipping of thickness of a work by covering all or a part of an exposed surface of a disc base plate made of high speed steel with a chrome plated film. SOLUTION: A high speed steel made base plate 1 is set in a mold. A diamond layer 2 is fastened on an outer peripheral surface of the high speed steel made base plate by blending diamond abrasive grains in a resin bond with polyimide resin as a main component and silicon carbide powder as a filler, filling a uniformly mixed mixture in the mold, heating and pressurizing it. This diamond layer 2 is applied with truing dressing by a dressing machine. Thereafter, this diamond layer 2 of a diamond cutting wheel and a base plate hole part are marked with insulating varnish, only both surfaces of the base plate are covered with chrome plating, a chromium plated film 4 is formed, and a resin bond diamond cutting wheel is made.

5. 发明专利

JP2000246542A RESIN BOND SUPER ABRASIVE GRAIN WIRE SAW 失效
公开(公告)号：JP2000246542A
公开(公告)日：2000-09-12
申请号：JP10044099
申请日：1999-03-02
申请人： OSAKA DIAMOND IND
发明人： YAMANAKA MASAAKI , OGAWA HIDEKI , URAKAWA NOBUO , HARA AKIO
IPC分类号： B23D61/18 , B24D3/00 , B24D3/28 , B24D11/00
摘要： PROBLEM TO BE SOLVED: To enhance the bondability with resin bond by coating super abrasive grain such as diamond, CBN, etc., with metal and to suppress the heat deterioration of the resin bond by releasing the grinding heat generated in cutting operation by the coating metal. SOLUTION: A core 1 formed by primer coating epoxy resin on a copper plated piano wire with the thickness approximately 2 μm is prepared, phenol resin, diamond filler of mean grain size approximately 2.6 μm, NI plating coated diamond abrasive grain of the mean grain size approximately 25 μm are mixed together, and cresol is added to the mixture to prepare the coating. The coating is baked on the core 1 to be hardened. Because the metal coated abrasive grain 3 is used, the resin is generated protrusions 6 along the abrasive grain 3 top by the wettability and the bondability of the coated metal and the resin so that even if the resin bond layer thickness between the abrasive grains 3 becomes thin, it can exhibit abrasive grain holding capacity and if the thickness (t) of the bond layer is 1/3-2/3 of the abrasive grain, it can exhibit sufficient holding force.

6. 发明专利

JP2000218512A CMP PAD CONDITIONER AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000218512A
公开(公告)日：2000-08-08
申请号：JP5918099
申请日：1999-01-28
申请人： OSAKA DIAMOND IND
发明人： KADOMURA KAZUNORI , FUKUNISHI TOSHIO
IPC分类号： B24B53/12 , B24B53/017 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To prevent cutting performance from being decreased caused by clogging or the like by forming grooves on an exposed part of diamond abrasive grains of a CMP pad conditioner. SOLUTION: This conditioner has a metal base 4 onto which a surface diamond abrasive grains 2 whose average particle diameter is 30-1000 nm is fixed in a single layer by a binder 3 mainly composed of plating or brazing material. On an exposed part of the diamond abrasive grains 2 of the conditioner, grooves 1 are formed. By the aid of the grooves 1, sharpness of a cutting edge with the abrasive grains is increased, and also clogging hardly occurs since the groove 1 serves as pockets for receiving chips. Accordingly, the sharp cutting performance of the conditioner is remarkably improved for enabling highly accurate and efficient dressing. Also, the grooves 1 when formed in a continuous manner with an exposed part of the binder 3, the capacity of pockets for the chips can be increased, thereby improving the cutting performance and reducing dressing resistance.

7. 发明专利

JP2000052226A WIRE SAW AND ITS MANUFACTURE 失效
公开(公告)号：JP2000052226A
公开(公告)日：2000-02-22
申请号：JP23954898
申请日：1998-08-10
申请人： SUMITOMO ELECTRIC INDUSTRIES , OSAKA DIAMOND IND
发明人： MIZOGUCHI AKIRA , SUGAWARA JUN , YAMANAKA MASAAKI , OGAWA HIDEKI , URAKAWA NOBUO
IPC分类号： B24B27/06 , B23D61/18 , B24D3/00 , B24D3/28 , B24D11/00 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To carry out slicing work by a wire saw by covering an outer peripheral surface of a conductor of high strength applied with coppering with a resin bond layer containing abrasive particulates of a specific grain diameter and a filler in resin having a specific elastic modulus and softening temperature. SOLUTION: A conductor 2 is made by applying coppering on a piano wire. Abrasive particulates 3 are fastened on an outer peripheral surface of this conductor 2 of high strength by a resin bond 5 layer. As these abrasive particulates 3, super-abrasive particulates like diamond are favourable, and those of more than 2/3 of thickness of the resin bond 5 layer and less than 1/2 of a diameter of the conductor 2 are used. Additionally, as resin bond 5, resin an elastic modulus of which is more than 100 kg/mm2 and softening temperature of which is more than 200 deg.C and in which a filler 4 a grain diameter of which is less than 2/3 of thickness of the resin bond 5 layer is included is used. Fastening power of the conductor 2 and the resin bond 5 layer is improved and flexibility is also improved by carrying out surface treatment applied on the conductor 2 by coppering.

8. 发明专利

JP2000006033A RESIN BOND SUPER-ABRASIVE GRAIN WHEEL AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000006033A
公开(公告)日：2000-01-11
申请号：JP21019798
申请日：1998-06-18
申请人： OSAKA DIAMOND IND
发明人： KATO HIROSHI , FURUYA KAZUYOSHI
IPC分类号： B24D3/00 , B24D3/28 , B24D5/02
摘要： PROBLEM TO BE SOLVED: To obtain a product with high performance and without secular change by molding super-abrasive grain in a specified width in a rotary shaft direction of a resin bond super-abrasive grain wheel having super-abrasive grain layers coupled by a resin system coupling material plural number of times and integrally sticking super-abrasive grain on the surface of a seamless and integrated cylindrically metallic support. SOLUTION: On the surface of a seamless and integrated cylindrically metallic support, a super-abrasive grain layer is molded in width of 20 mm or more in a rotary shaft direction of a wheel plural number of times and a seamless and integrated super- abrasive grain layer of a width of 50 mm or more is fixed in the direction. Because the super-abrasive grain layer is seamless and is integrated, excellent grinding performance in which not only a projections to be left for cutting is not generated on the surface of a workpiece but also surface roughness is increased because a feed mark is generated on the surface of the workpiece is displayed. Because the metallic support is also seamless and integrated, deviation and unbalance of the metallic support at the time of high speed revolution are not generated and a grinding work with extremely high performance and high safety is made possible.

9. 发明专利

JPH11309661A METHOD FOR CUTTING PROCESS BY MEANS OF WIRE SAW 失效
公开(公告)号：JPH11309661A
公开(公告)日：1999-11-09
申请号：JP13461898
申请日：1998-04-28
申请人： OSAKA DIAMOND IND
发明人： YAMANAKA MASAAKI , OGAWA HIDEKI , URAKAWA NOBUO
IPC分类号： B24B27/06 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To provide a method for stably cutting and processing hard brittle material such as silicon, neodymium, ferrite and the like. SOLUTION: This processing method is so designed that a wire saw, in which a large number of super abrasive grains are applied in an irregular form over to the circumferential surface of a wire of high strength, is brought into contact with the surface to be cut of hard brittle material so as to be passed over at high speed higher than 800 m/minute with respect to the hard brittle material. The wire saw to be used is formed out of resin bond containing a strong bond, and it is desirable that each abrasive grain space is made in such a way as to be greater than 4.0 mm /m, which is formed by each abrasive grain projected out of a bond layer.

10. 发明专利

JPH11216658A MANUFACTURE OF WIRE SAW AND WIRE SAW 失效
公开(公告)号：JPH11216658A
公开(公告)日：1999-08-10
申请号：JP3817298
申请日：1998-02-03
申请人： SUMITOMO ELECTRIC INDUSTRIES , OSAKA DIAMOND IND
发明人： SUGAWARA JUN , KAMIOKA ISAO , MIZOGUCHI AKIRA , YAMANAKA MASAAKI , OGAWA HIDEKI , URAKAWA NOBUO
IPC分类号： B24B27/06 , B23D61/18 , B24D3/00 , B24D3/28 , B24D11/00 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a wire saw and the wire saw whereby slicing work or the like of a silicon wafer can be performed. SOLUTION: In this manufacturing method of a wire saw, after a core wire 1 of high strength is made to pass in mixed paint mixing an abrasive grain 3 and a filler 11 in a resin solution, the mixed paint adhering to the core wire 1 is squeezed while rotating a die 2 having a recessed part B in an internal peripheral surface, the abrasive grain 3 is positioned spirally on a peripheral surface of this core wire 1 to be guided to a baking furnace, and this mixed paint is baked on the peripheral surface of the core wire 1 to be secured. In this case, the secured abrasive grain in a manufactured wire saw is formed to protrude in helical shape on the core wire to be sharpened.

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