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    • 4. 发明专利
    • POLISHING TOOL
    • JP2003224094A
    • 2003-08-08
    • JP2002020033
    • 2002-01-29
    • EBARA CORPKUREHA CHEMICAL IND CO LTD
    • HIROKAWA KAZUTOSAKABE HIROSHI
    • B24B37/20B24B37/24B24D3/28H01L21/304B24B37/00
    • PROBLEM TO BE SOLVED: To provide a polishing tool wherein stability of polishing rate, superior flatness and step-difference characteristic can be obtained, and reduction or the like of defects (scratches) generated on a polished surface of an abrasive object of a semiconductor wafer can be exhibited excellently to various kinds of abrasive object. SOLUTION: This polishing tool 1 performs polishing by sliding while the abrasive object is pressed, and is mainly composed of thermoplastic resin whose mean glass transition temperature (Tg) is at least 270 K and at most 400 K. Low glass transition temperature (Tg) phase wherein glass transition temperature (Tg) of thermoplastic resin is at most 320 K is at least 10 wt.% and at most 90 wt.%, and high glass transition temperature (Tg) phase wherein glass transition temperature (Tg) is at least 320 K is at most 90 wt.% and at least 10 wt.%. The thermoplastic resin is composed of aromatic vinyl monomer of at least 0 wt.% and at most 80 wt.%, (meth)acrylic acid ester monomer of at least 0 wt.% and at most 100 wt.% and vinyl monomer of at least 0 wt.% and at most 50 wt.% which can be copolymerized with the aromatic vinyl monomer and the (meth)acrylic acid ester monomer. It is preferable that weight- average molecular weight is at least 5,000 and at most 5,000,000. COPYRIGHT: (C)2003,JPO