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1. 发明专利

JP2015051634A 熱空気圧式アクチュエータの作業流体層有权
标题翻译：热气动执行器工作流体层
公开(公告)号：JP2015051634A
公开(公告)日：2015-03-19
申请号：JP2014172399
申请日：2014-08-27
申请人：ゼロックスコーポレイションXerox Corporation , Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： NYSTROM PETER J , HAYS ANDREW W
IPC分类号： B41J2/14 , B41J2/05 , B41J2/16
CPC分类号： B41J2/14064 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14387 , Y10T29/49401
摘要：【課題】画質が低下し、印刷速度が遅くなることを防止することができる記録ヘッドを提供する。【解決手段】ノズル52のアレイからインク74を吐出する熱空気圧式アクチュエータ58のアレイを含み、このアクチュエータのアレイは、複数の作業流体チャンバ40と流体連通する複数のチャネルを含むことができる。アクチュエータのアレイが完成した後、アクチュエータのアレイの外側の作業流体入口内に作業流体60を注入し、複数のチャネルに通して複数の作業流体チャンバに作業流体を注入する。【選択図】図7
摘要翻译：要解决的问题：提供一种能够防止图像质量和打印速度降低的记录头。解决方案：记录头包括用于从喷嘴阵列52喷射墨水74的热气动致动器58的阵列。致动器阵列可以包括与多个工作流体室40流体连通的多个通道。在完成致动器阵列的形成之后，将工作流体60注入到致动器阵列的外部上的工作流体入口中并进入多个工作流体室通过多个通道。

2. 发明专利

JP2012196960A High density multilayer interconnect for print head 有权
标题翻译：高密度多层印刷头连接
公开(公告)号：JP2012196960A
公开(公告)日：2012-10-18
申请号：JP2012042539
申请日：2012-02-28
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： NYSTROM PETER J , CELLURA MARK A , REDDING GARY D
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： B41J2/14233 , B41J2/161
摘要： PROBLEM TO BE SOLVED: To provide methods for manufacturing a print head having electrical contacts which are easier to manufacture than prior structures, and the resulting print head.SOLUTION: The method for forming an inkjet print head can include attaching a plurality of piezoelectric elements 20 to a diaphragm 36, dispensing an interstitial layer 50 over the diaphragm, and forming a plurality of patterned conductive traces 80 on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.
摘要翻译：要解决的问题：提供制造具有比现有结构更容易制造的电触头的打印头的方法以及所得到的打印头。解决方案：用于形成喷墨打印头的方法可以包括将多个压电元件20附接到隔膜36，在隔膜上分配间隙层50，并且在间隙层上形成多个图案化导电迹线80到物理和电接触多个压电元件。可以使用例如光刻，剥离过程，激光烧蚀等形成多个图案化迹线。可以通过两个图案化导电迹线和两个压电元件之间的表面接触来建立多个图案化导电迹线与多个压电元件之间的电连接结构，不需要单独的导体。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011245858A Molded nozzle plate with alignment features for simplified assembly 有权
标题翻译：具有对准功能的模制喷嘴板，用于简化组装
公开(公告)号：JP2011245858A
公开(公告)日：2011-12-08
申请号：JP2011111715
申请日：2011-05-18
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： NYSTROM PETER J , PHILLIPS SCOTT J , CELLURA MARK A
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： B41J2/162 , B41J2/1433 , B41J2/1623 , B41J2/1628 , B41J2/1634 , B41J2/1637 , B41J2202/20 , Y10T29/49124
摘要： PROBLEM TO BE SOLVED: To provide a molded nozzle plate with alignment features for simplified assembly of an ink jet print head.SOLUTION: The ink jet print head includes a molded nozzle plate 370. The molded nozzle plate further includes a nozzle hole surface having two or more nozzle holes 330 in the nozzle plate, a sidewall 390 defining cavities surrounding the nozzle hole surface, and the molded die alignment features 380 in the cavities of the nozzle plate. The MEMS die is positioned in the cavities according to the molded die alignment features.
摘要翻译：要解决的问题：为了提供具有用于简化喷墨打印头的组装的对准特征的模制喷嘴板。喷墨打印头包括模制喷嘴板370.模制喷嘴板还包括喷嘴孔表面，喷嘴孔表面在喷嘴板中具有两个或更多个喷嘴孔330，侧壁390限定围绕喷嘴孔表面的空腔，以及在喷嘴板的空腔中的模制模具对准特征380。 MEMS模具根据模制的模具对准特征定位在空腔中。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011156864A Silicon based module array and method of forming the same 审中-公开
标题翻译：基于硅的模块阵列及其形成方法
公开(公告)号：JP2011156864A
公开(公告)日：2011-08-18
申请号：JP2011005415
申请日：2011-01-14
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： CELLURA MARK A , NYSTROM PETER J , PHILLIPS SCOTT J , MEYERS JOHN P , DINGMAN LYLE G , DOLAN BRYAN R
IPC分类号： B41J2/16 , B41J2/44 , B41J2/45 , B41J2/455 , H01L31/02
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a silicon based module having space-saving and high-definition properties and to provide a method of forming the module. SOLUTION: The silicon based module includes a substrate 106 on which chip assemblies 102, 104 are fixed. On the assembly 102, a silicon chip 108 and a driver die 110 having an electrical circuitry are installed, and the assembly 104 includes a silicon chip 112 and a driver die 114 having the electrical circuitry. Further, component parts corresponding to the assemblies 102, 104 are aligned each other along in a longitudinal direction L of the substrate, and also along in a width direction P of the substrate perpendicular to the longitudinal direction L. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有节省空间和高清晰度特性的硅基模块，并提供形成该模块的方法。解决方案：硅基模块包括其上固定有芯片组件102,104的基板106。在组件102上，安装具有电路的硅芯片108和驱动器芯片110，并且组件104包括硅芯片112和具有电路的驱动器芯片114。此外，对应于组件102,104的部件沿着基板的纵向方向L彼此对准，并且还沿垂直于纵向方向L的基板的宽度方向P彼此对准。（C ）2011，JPO＆INPIT

5. 发明专利

JP2009018583A Method for positioning die module array 有权
标题翻译：定位模块阵列的方法
公开(公告)号：JP2009018583A
公开(公告)日：2009-01-29
申请号：JP2008176554
申请日：2008-07-07
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： NYSTROM PETER J , GULVIN PETER M , MEYERS JOHN P
IPC分类号： B41J2/16
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： PROBLEM TO BE SOLVED: To provide an improved method for positioning a die module array.
SOLUTION: The method for positioning the die module array includes forming a physical reference surface directly on an individual silicon die module, providing a temporary holder including an alignment tool, arranging a die on the temporary holder by abutting the physical reference surface against the alignment tool, temporarily fixing the die arranged on the temporary holder, and bonding a permanent substrate to the die arranged on the temporary holder.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于定位模具模块阵列的改进方法。解决方案：用于定位模具模块阵列的方法包括在单个硅模块模块上直接形成物理参考表面，提供临时保持器，其包括对准工具，通过使物理参考表面抵靠物体参考表面将模具布置在临时保持器上对准工具，临时固定设置在临时保持器上的模具，以及将永久基板接合到设置在临时保持器上的模具。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2013173360A Control of quality of adhesive bond line using saturated mesh 有权
标题翻译：使用饱和网控制胶粘线的质量
公开(公告)号：JP2013173360A
公开(公告)日：2013-09-05
申请号：JP2013021335
申请日：2013-02-06
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： NYSTROM PETER J , ZUO YANJIA
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/161
摘要： PROBLEM TO BE SOLVED: To provide a method for bonding a member of an inkjet head assembly.SOLUTION: A printing head assembly 100 includes: a plurality of functional plates which are laminated on one another to constitute the head assembly 100; and an adhesive confinement structure including an adhesive-coated mesh substrate arranged between the adjacent functional plates for bonding functional plates.
摘要翻译：要解决的问题：提供一种用于接合喷墨头组件的构件的方法。解决方案：打印头组件100包括：多个功能板，其彼此层叠以构成头组件100; 以及粘合剂约束结构，其包括布置在相邻功能板之间的粘合剂涂覆的网格基底，用于接合功能板。

7. 发明专利

JP2013111978A Multi-film adhesive design for interfacial bonding printhead structure 有权
标题翻译：多层粘接设计用于界面粘结印刷结构
公开(公告)号：JP2013111978A
公开(公告)日：2013-06-10
申请号：JP2012251907
申请日：2012-11-16
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： ZUO YANJIA , CASELLA JAMES M , BADESHA SANTOKH S , NYSTROM PETER J , WILLIAMS ANTONIO L , THOMAS J WAIBURU , KANUNGO MANDAKINI
IPC分类号： B41J2/055 , B41J2/045 , B41J2/16 , C09J7/00
CPC分类号： B41J2/161 , B41J2/1623
摘要： PROBLEM TO BE SOLVED: To provide: an adhesive material used by a composite method for stacking a printhead structure; and a head assembly using the same.SOLUTION: A printhead assembly 100 includes: a plurality of functional plates stacked together; a first adhesive layer for compliance strength arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent functional plates to provide chemical resistance to ultraviolet curable ink or gel ink.
摘要翻译：要解决的问题：提供：通过用于堆叠打印头结构的复合方法使用的粘合材料; 以及使用该组件的头组件。打印头组件100包括：堆叠在一起的多个功能板; 用于在相邻功能板之间布置的用于柔顺强度的第一粘合剂层，以提供板之间的结合; 以及布置在相邻功能板之间的第二粘合剂层，以提供对紫外线固化油墨或凝胶油墨的耐化学性。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012218438A Patterned conductive array, and self-leveling epoxy 有权
标题翻译：图案导电阵列和自我调节环氧树脂
公开(公告)号：JP2012218438A
公开(公告)日：2012-11-12
申请号：JP2012063647
申请日：2012-03-21
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： GERNER BRADLEY J , DOLAN BRYAN R , ANDREWS JOHN R , NYSTROM PETER J
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1631 , B41J2/1634 , B41J2/1646
摘要： PROBLEM TO BE SOLVED: To provide a method of assembling a print head having an electrical interconnect layer that is manufactured more easily than conventional assemblies to increase the jet density of a piezoelectric ink jet print head.SOLUTION: A method of forming an ink jet print head can include a step of attaching multiple piezoelectric elements 20 to a diaphragm 36, a step of dispensing an interstitial layer 50 over the diaphragm, a step of electrically coupling multiple conductive elements 62 to the multiple piezoelectric elements, and a step of curing the interstitial layer. Multiple electrically isolated conductive particles 54 in the interstitial layer electrically couple the multiple conductive elements to the multiple piezoelectric elements. The conductive particles can be evenly distributed throughout the whole of a dielectric of the interstitial layer or can be localized to the top surface of each piezoelectric element and interposed between the multiple piezoelectric elements and the multiple conductive elements. The conductive elements can be part of a flex circuit manifold printed circuit board 60.
摘要翻译：要解决的问题：提供一种组装具有比常规组件更容易制造的电互连层的打印头的方法，以增加压电喷墨打印头的喷射密度。解决方案：形成喷墨打印头的方法可以包括将多个压电元件20附接到隔膜36的步骤，在隔膜上分配间隙层50的步骤，将多个导电元件62电耦合的步骤涉及多个压电元件，以及固化间隙层的步骤。间隙层中的多个电绝缘导电粒子54将多个导电元件电耦合到多个压电元件。导电粒子可以均匀地分布在间隙层的整个电介质中，或者可以定位在每个压电元件的顶表面上并插入在多个压电元件和多个导电元件之间。导电元件可以是柔性电路歧管印刷电路板60的一部分。版权所有：（C）2013，JPO＆INPIT

9. 发明专利

JP2012201114A Use of photoresist material as interstitial fill for pzt printhead fabrication 有权
标题翻译：使用光电材料作为PZT PRINTHEAD制造的绝缘膜
公开(公告)号：JP2012201114A
公开(公告)日：2012-10-22
申请号：JP2012045240
申请日：2012-03-01
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： CELLURA MARK A , NYSTROM PETER J , LAW KOCK-YEE , MEYERS JOHN P , REDDING GARY D , ZHANG YUANJIA
IPC分类号： B41J2/16 , B41J2/045 , B41J2/055
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1645
摘要： PROBLEM TO BE SOLVED: To provide a more accurate and simplified method of manufacturing a high-density inkjet printhead assembly including an external manifold.SOLUTION: The method comprises: dispensing a photosensitive interstitial layer 50 to fill spaces between adjacent piezoelectric elements 20 and to contact a diaphragm 36; removing a first portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20 and leaving a second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20; and with the second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20, attaching the plurality of piezoelectric elements 20 to a plurality of electrodes 114 to provide an electrical pathway between each piezoelectric element 20 and the electrode 114 attached thereto.
摘要翻译：要解决的问题：提供一种更精确和简化的制造包括外部歧管的高密度喷墨打印头组件的方法。解决方案：该方法包括：分配感光间隙层50以填充相邻压电元件20之间的空间并接触隔膜36; 去除相邻的压电元件20之间的空间中的光敏间隙层50的第一部分，并将光敏间隙层50的第二部分留在相邻的压电元件20之间的空间中; 并且在相邻压电元件20之间的空间中的感光间隙层50的第二部分，将多个压电元件20附接到多个电极114，以在每个压电元件20和附接到其之间的电极114之间提供电路径。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2009045937A Micro-electro mechanical system (mems) based efficient imaging array jet 有权
标题翻译：微电子机械系统（MEMS）基于高效成像阵列
公开(公告)号：JP2009045937A
公开(公告)日：2009-03-05
申请号：JP2008209817
申请日：2008-08-18
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： DRAKE DONALD J , NYSTROM PETER J
IPC分类号： B41J2/01
CPC分类号： B41J2/15 , B41J2/155 , B41J2002/14491 , B41J2202/20 , Y10T29/49401
摘要： PROBLEM TO BE SOLVED: To solve the problems of the preceding technology that includes that of the depth of image forming arrays. SOLUTION: Provided is an image forming array having a plurality of image forming chips in zigzag so that space forming chips and image forming chips are alternately disposed in a row and a plurality of driver chips aligned adaptively in a space made by the zigzag chips. COPYRIGHT: (C)2009,JPO&INPIT

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