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1. 发明专利

JP2010162668A Polishing tape and minute projection polishing device using the polishing tape 有权
标题翻译：抛光带和分钟投影抛光装置使用抛光带
公开(公告)号：JP2010162668A
公开(公告)日：2010-07-29
申请号：JP2009009259
申请日：2009-01-19
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI , MIZUMURA MICHINOBU
IPC分类号： B24B21/00 , B24B21/06
摘要： PROBLEM TO BE SOLVED: To provide a minute projection polishing device capable of efficiently polishing a minute projection to be polished, to a predetermined height in a short time using a polishing tape constituted by laminating resin layers on both end sides of an polishibg face, without measuring the height of the minute projection by a sensor.
SOLUTION: This minute projection polishing device polishes a minute process α on a flat plate by an polishing tape 1 having resin layers on both end sides in a width direction of an polishing layer. The device has a pressing means for pressing the polishing tape 1 to the minute process α, and a tape transfer means for making the polishing tape 1 travel in a direction intersecting with a pressing direction of the pressing means. The resin layers are used as guides of a plishing depth on both end sides in the width direction of the polishing face.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在短时间内有效地将要抛光的微小的投影抛光到预定高度的微小投影抛光装置，其使用在波兰的两端侧层叠树脂层而构成的研磨带而不用传感器测量微小投影的高度。解决方案：该微小投影抛光装置通过在抛光层的宽度方向的两端侧具有树脂层的研磨带1在平板上抛光微小的加工α。该装置具有用于将研磨带1按压到微小过程α的压制装置，以及用于使研磨带1沿与按压装置的按压方向交叉的方向行进的带传送装置。树脂层作为研磨面的宽度方向的两端侧的研磨深度的导向体使用。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010104865A Defect correction method 有权
标题翻译：缺陷修正方法
公开(公告)号：JP2010104865A
公开(公告)日：2010-05-13
申请号：JP2008276581
申请日：2008-10-28
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI , NAKABAYASHI AI
IPC分类号： B05D1/26
摘要： PROBLEM TO BE SOLVED: To shorten the time for correcting defects in a wide area of a coating film, and to achieve the uniformity of the thickness of the coating film regardless of the unevenness of a substrate surface. SOLUTION: In a defect correction method for correcting a defect 6 of an orientation film 3 formed on a color filter substrate 1 surface, a chemical liquid dropping step of dropping a proper amount of a correcting liquid 5 to the defect 6, and a stamp pressing step of spreading out the correcting liquid 5 by pressing the color filter substrate 1 surface with a stamp 8 elastically deformed according to the unevenness of the color filter substrate 1 surface are carried out. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了缩短用于校正涂膜的广泛区域中的缺陷的时间，并且为了实现涂膜的厚度的均匀性，而与基板表面的不均匀性无关。解决方案：在用于校正形成在滤色器基板1表面上的取向膜3的缺陷6的缺陷校正方法中，将适当量的校正液5滴落到缺陷6的药液滴下步骤，以及执行按照滤色器基板1表面按照滤色器基板1表面的不均匀性而弹性变形的印模8按压滤色器基板1表面来扩展校正液体5的压印步骤。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2006202828A Method of correcting wiring on electronic circuit substrate 审中-公开
标题翻译：校正电子电路基板上布线的方法
公开(公告)号：JP2006202828A
公开(公告)日：2006-08-03
申请号：JP2005010259
申请日：2005-01-18
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： MIZUMURA MICHINOBU , HIRANO TAKAFUMI
IPC分类号： H01L21/3205 , G02F1/13 , G02F1/1343 , G09F9/00 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To apply a conductive material content liquid definitely to the disconnected part of the interconnect line of an electronic circuit substrate, to form a conductive thin film without drying the conductive material content liquid by the discharge port of a dispenser, and to bring the conductive thin film formed in the disconnected part into close contact on the substrate.
SOLUTION: After the conductive material content liquid 7 which makes a nonvolatile solvent distribute the conductive material is coated to the disconnected part 3a of the interconnect line 3 formed on a TFT substrate (electronic circuit substrate) 1, so that the ends 3c and 3c of the interconnect line 3 which performs the disconnected part 3a in between the disconnected part 3a are connected by the dispenser 4; the applied conductive material content liquid 7 is heated by the irradiation of a continuous wave laser light La, and the conductive thin film 7a is deposited in the disconnected part 3a. After an appropriate time; a UV cured resin (ultraviolet curing resin) 8 is applied so that the whole conductive thin film 7a may be covered, the coated UV cured resin 8 is irradiated with the UV light (ultraviolet ray light), and cured.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了将导电材料含量液体肯定地施加到电子电路基板的互连线的断开部分，以形成导电薄膜，而不会通过分配器的排出口干燥导电材料含量液体并且使形成在断开部分中的导电薄膜紧密接触在基板上。解决方案：在将形成非挥发性溶剂的导电材料含量液体7分散在导电材料之后，涂覆在形成在TFT基板（电子电路基板）1上的布线3的断开部分3a上，使得端部3c 在分离部3a之间进行断开的部分3a的互连线3的3c和3c通过分配器4连接; 所施加的导电材料含量液体7通过连续波激光La的照射被加热，导电薄膜7a沉积在断开部分3a中。经过适当的时间; 涂布紫外线固化树脂（紫外线固化树脂）8，以覆盖整个导电薄膜7a，用紫外线（紫外线）照射涂覆的UV固化树脂8并固化。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2013029326A Defect inspection method and defect inspection device for organic el panel 审中-公开
标题翻译：有机EL面板的缺陷检查方法和缺陷检查装置
公开(公告)号：JP2013029326A
公开(公告)日：2013-02-07
申请号：JP2011163639
申请日：2011-07-26
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI
IPC分类号： G01N21/88 , H01L51/50 , H05B33/12
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection method capable of detecting a defect of an organic layer just after being formed when defect inspection of an organic EL panel is performed.SOLUTION: The defect inspection method comprises: obliquely disposing light source 2 for irradiating an organic layer 12 with inspection light 2A, to a substrate 10; disposing imaging means 3 for imaging the organic layer 12 at a position where the inspection light 2A is not incident; detecting light emitted from the organic layer 12 by the irradiation of the inspection light 2A, by the imaging means 3; and inspecting a defect on the basis of an imaging signal relating to the organic layer 12 obtained by the imaging means 3.
摘要翻译：要解决的问题：提供一种能够在进行有机EL面板的缺陷检查时刚刚形成之后检测有机层的缺陷的缺陷检查方法。解决方案：缺陷检查方法包括：将具有检查光2A的有机层12的光源2倾斜地配置到基板10; 布置成像装置3，用于在检查光2A未入射的位置成像有机层12; 通过成像装置3检测由检查光2A的照射从有机层12发射的光; 并根据由成像装置3获得的与有机层12相关的成像信号检查缺陷。（C）2013，JPO和INPIT

5. 发明专利

JP2010204472A Ink for correcting bright spot defect of polarizing plate and method for correcting polarizing plate using the same 有权
标题翻译：用于校正偏光板的亮点缺陷的墨水和使用其校正偏光板的方法
公开(公告)号：JP2010204472A
公开(公告)日：2010-09-16
申请号：JP2009051045
申请日：2009-03-04
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI , NAKABAYASHI AI , MIZUMURA MICHINOBU
IPC分类号： G02B5/30 , G02F1/13 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide a light shielding material capable of restoring a bright spot defect caused due to a polarizing plate for liquid crystal panels without deteriorating a polarizer, and a method for restoring the bright spot defect of the polarizing plate using the light shielding material. SOLUTION: The method for restoring the bright spot defect caused in the polarizing plate for liquid crystal panels using an ultraviolet curing resin in which a violet light shielding pigment is dispersed and the ultraviolet curing resin, includes processes of: removing a part corresponding to the bright spot defect of the polarizing plate by laser; filling the ultraviolet curing resin in the part removed by laser; and curing the filled ultraviolet curing resin by irradiating it with light in an ultraviolet region. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够恢复由于用于液晶面板的偏振板而引起的亮斑缺陷而不劣化偏振片的遮光材料，以及使用以下方法来恢复偏振片的亮点缺陷的方法：遮光材料。解决方案：使用其中分散有紫光遮蔽颜料的紫外线固化树脂和紫外线固化树脂在液晶面板的偏振片中引起的亮点缺陷的方法包括以下处理：除去相应的部分通过激光对偏振片的亮点缺陷; 在通过激光去除的部分中填充紫外线固化树脂; 并通过用紫外线区域照射来固化填充的紫外线固化树脂。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2007279513A Defect correction method 有权
标题翻译：缺陷修正方法
公开(公告)号：JP2007279513A
公开(公告)日：2007-10-25
申请号：JP2006107805
申请日：2006-04-10
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： MIZUMURA MICHINOBU , HIRANO TAKAFUMI , KAWAHARA NAOTO
IPC分类号： G02B5/20
摘要： PROBLEM TO BE SOLVED: To securely correct a defect of a pattern formed on a substrate surface and to shorten the correction time. SOLUTION: A method of correcting a defect part of a pixel of a black matrix formed on the surface of a color filter substrate 6 by coating the defect part with a correcting material 27 includes a stage of fitting a small resin-made piece formed in the same shape with the pixel and having one flat surface to a tip part 23a of a coating needle 23 with the flat surface 25a down, a stage of sticking the correcting material 27 on the flat surface 25a of the small piece 25, and a stage of pressing the small piece 25 against the defective pixel 28a to transfer the correcting material 27. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了可靠地校正形成在基板表面上的图案的缺陷并缩短校正时间。解决方案：通过用校正材料27涂覆缺陷部分来校正形成在滤色器基板6的表面上的黑矩阵的像素的缺陷部分的方法，包括：将小树脂制件与像素形成相同的形状并且具有一个平坦表面连接到平面25a的涂覆针23的尖端部分23a，将校正材料27粘贴在小件25的平坦表面25a上的阶段，以及将小件25压靠在缺陷像素28a上以传送校正材料27的阶段。（C）2008年，JPO和INPIT

7. 发明专利

JP2007019105A Laminated material for repairing interconnection of electronic circuit board, and method and apparatus of repairing interconnection of electronic circuit board 有权
标题翻译：用于修复电子电路板的互连的层叠材料以及电子电路板的修复互连的方法和装置
公开(公告)号：JP2007019105A
公开(公告)日：2007-01-25
申请号：JP2005196652
申请日：2005-07-05
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： MIZUMURA MICHINOBU , HIRANO TAKAFUMI
IPC分类号： H05K3/22 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide an interconnection repairing material which can easily repair the disconnection of a complicated thin interconnection formed on an electronic circuit board, and also to provide an interconnection repairing method and an interconnection repairing apparatus using the interconnection repairing material.
SOLUTION: The laminated material 1 for repairing an interconnection consists of a base material 2, a thermofusion layer 3 stacked on the base material 2, and a fine grain metal layer 4 stacked on the thermofusion layer 3. In the interconnection repairing method, the fine grain metal layer 4 of the laminated material 1 for repairing an interconnection is abutted against a disconnected part of an electronic circuit. Thereafter, laser light is irradiated on part of the laminated material 1 for repairing an interconnection which is above the disconnected part. The laser light is absorbed by the thermofusion layer 3, which causes the thermofusion layer 3 and the fine grain metal layer 4 to be melted and separated from the base material 2 and then the thermofusion layer 3 and the fine grain metal layer 4 are transferred into the disconnected part. Then, laser light is irradiated on the thermofusion layer 3 transferred into the disconnected part to remove it by thermal decomposition. Thereafter, laser light is irradiated on the fine grain metal layer 4 to melt and sinter the fine metal.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以容易地修复形成在电子电路板上的复杂薄互连的断开的互连修复材料，并且提供互连修复方法和使用互连修复材料的互连修复设备。解决方案：用于修补互连的层叠材料1由基材2，层叠在基材2上的热熔融层3和层叠在热熔融层3上的细粒金属层4构成。在互连修理方法用于修复互连的层压材料1的细晶粒金属层4与电子电路的断开部分抵接。此后，激光照射在层压材料1的一部分上，用于修复断开部分之上的互连。激光由热熔融层3吸收，导致热熔融层3和细粒金属层4与基材2熔融分离，然后将热熔融层3和细粒金属层4转移到断开的部分。然后，将激光照射到转移到断开部分的热熔融层3上，以通过热分解将其去除。此后，将激光照射在细晶粒金属层4上，使细金属熔融并烧结。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005354009A Conductive-material-contained liquid for repairing wiring on electronic circuit substrate, and method of repairing wiring on electronic circuit substrate 有权
标题翻译：用于修复电子电路基板上的布线的导电材料含有液体以及在电子电路基板上修理布线的方法
公开(公告)号：JP2005354009A
公开(公告)日：2005-12-22
申请号：JP2004176071
申请日：2004-06-14
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI , MIZUMURA MICHINOBU , KAJIYAMA KOICHI
IPC分类号： B05D3/06 , B05D5/12 , H05K3/22
摘要： PROBLEM TO BE SOLVED: To repaire wiring by appropriately coating a conductive-material-contained liquid on the broken portion of the wiring on an electronic circuit substrate irrespective of a coating method of a solution coater, and thereby forming a conductive thin film having appropriate thickness.
SOLUTION: Holes 4a, 4b for coupling of repair wiring are provided at a preselected repair part of a wiring broken portion 3a in TFT wiring (wiring) 3 formed on a TFT substrate (electronic circuit substrate) 1 by irradiating pulse laser La using a laser processor 6, and then a conductive-material-contained liquid 8 is coated with such composition as comprising a solvent including a highly volatile solvent and a lowly volatile solvent, which contains a conductive material. After the highly volatile solvent in the liquid 8 volatilizes, continuous wave laser is irradiated to a portion where the conductive-material-contained liquid has been coated to heat the liquid 8, thereby percipitating a conductive thin film of the conductive material in the preselected repair part, and thereby repairing connection of the wiring broken portion 3a.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过在电子电路基板上的布线的断开部分上适当地涂覆含导电材料的液体来修复布线，而不管涂布机的涂布方法如何，从而形成导电薄膜具有适当的厚度。解决方案：用于耦合修复布线的孔4a，4b设置在通过照射脉冲激光La的TFT基板（电子电路基板）1上形成的TFT布线（布线）3中布线断裂部分3a的预选修复部分使用激光处理器6，然后用包含高挥发性溶剂和含有导电材料的低挥发性溶剂的溶剂的组合物涂覆含导电材料的液体8。在液体8中的高挥发性溶剂挥发后，将连续波激光照射到已经涂覆有导电材料的液体的部分以加热液体8，从而在导电材料的导电薄膜中预选择修复从而修复接线断裂部分3a的连接。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2012091074A Micro dispenser and method of filling chemical into the same 有权
标题翻译： MICRO分配器和填充化学物质的方法
公开(公告)号：JP2012091074A
公开(公告)日：2012-05-17
申请号：JP2010238129
申请日：2010-10-25
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI
IPC分类号： B05C5/00
摘要： PROBLEM TO BE SOLVED: To facilitate filling of a chemical into a dispenser body and to suppress wasteful consumption of part of the chemical.SOLUTION: A micro dispenser for discharging an appropriate amount of the chemical 8 filled in the body includes a needle tube 1 opened at both ends and tapered at a leading end 1a, and a capillary tube 2 formed to be inserted into the needle tube 1 through an opening in its trailing end 1b and opened at both ends to suck the chemical 8 into it, and is formed to simultaneously supply constant-pressure air to the trailing ends 1b, 2b of the needle tube 1 and the capillary tube 2 in a state that the capillary tube 2 with the chemical 8 sucked into it is inserted into the needle tube 1 so as to seal a gap 10 between its outer peripheral surface 2b and an inner peripheral surface 1d of the needle tube 1.
摘要翻译：要解决的问题：为了便于将化学品填充到分配器主体中并且抑制部分化学品的浪费的消耗。解决方案：用于排出适量的填充在本体中的化学物质8的微型分配器包括：在两端开口且在前端1a呈锥形的针管1和形成为插入针头的毛细管2 管1通过其尾端1b的开口并在两端开口以将化学物质8吸入其中，并且形成为同时向针管1的后端1b，2b和毛细管2供给恒压空气在将吸入有化学物质8的毛细管2插入针管1中的状态下，将其外周面2b和针管1的内周面1d之间的间隙10密封起来。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011120993A Foreign matter removing device for substrate and method for removing foreign matter for substrate 有权
标题翻译：用于基板的外部去除装置和用于移除基板的外部事件的方法
公开(公告)号：JP2011120993A
公开(公告)日：2011-06-23
申请号：JP2009279998
申请日：2009-12-10
申请人： V Technology Co Ltd , 株式会社ブイ・テクノロジー
发明人： HIRANO TAKAFUMI , KUDO SHUJI
IPC分类号： B08B7/00
摘要： PROBLEM TO BE SOLVED: To provide a foreign matter removing device for substrate with capability to successfully remove organic foreign matter sticking to the surface of a substrate in a manufacturing process, without leaving tailings unremoved and injuring the surface of the substrate, as well as a method for removing the foreign matter for substrates.
SOLUTION: The organic foreign matter α is specified by observing the surface of the substrate BS, and the positions of the foreign matter removing device for substrates and the organic foreign matter α on the substrate BS are registered. Next, a photocatalytic tape PHT is made to descend and a photocatalytic layer of the photocatalytic tape PHT is contact-bonded to the organic foreign matter α. After that, the light is shined from the opposite side, to the surface which is contact-bonded to the organic foreign matter α, of the photocatalytic tape PHT by actuating a light irradiation means 400. The organic foreign matter α is photooxidized by the action to absorb the light by the photocatalyst and consequently, the organic foreign matter α is decomposed and removed, thus completing the removal of the foreign matter α.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够在制造过程中成功除去粘附在基板表面上的有机异物的基板的异物去除装置，而不会留下未被除去并损坏基板的表面的尾料作为以及用于除去基材的异物的方法。解决方案：通过观察基板BS的表面来指定有机异物α，并且登记基板的异物去除装置和基板BS上的有机异物α的位置。接着，使光催化带PHT下降，使光催化剂带PHT的光催化剂层与有机异物α接触。之后，通过致动光照射装置400，将光从相对侧照射到与光催化带PHT的有机异物α接触的表面。有机杂质α通过动作光氧化通过光催化剂吸收光，因此有机异物α被分解除去，从而完成除去异物α。版权所有（C）2011，JPO＆INPIT

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