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    • 1. 发明专利
    • Polyimide film and method for producing the same
    • 聚酰亚胺膜及其制造方法
    • JP2013203779A
    • 2013-10-07
    • JP2012071446
    • 2012-03-27
    • Ube Industries Ltd宇部興産株式会社
    • UEKIDO TAKESHI
    • C08J5/18C08K3/36C08L79/08
    • PROBLEM TO BE SOLVED: To provide a polyimide film having irregularities formed by adhering a spherical filler to a surface thereof, and a method for producing the same.SOLUTION: A polyimide film has irregularities formed by adhering a spherical filler to a surface thereof, and the spherical filler has an average particle size of 1-10 μm and a standard deviation of particle size distribution of 1 or less. In the irregularities of the polyimide film surface, 80% or more of projections have heights 0.3-0.5 time the average particle size of the spherical filler. The polyimide film is produced by applying a polyimide precursor solution containing 5-30 mass% of the spherical filler onto a self-supporting film of polyimide followed by heating.
    • 要解决的问题:提供一种具有通过将球形填料粘附到其表面上形成的凹凸的聚酰亚胺膜及其制造方法。解决方案:聚酰亚胺膜具有通过将球形填料粘附到其表面而形成的凹凸,以及 球形填料的平均粒径为1-10μm,粒度分布的标准偏差为1以下。 在聚酰亚胺膜表面的凹凸中,80%以上的突起的高度为球形填料的平均粒径的0.3-0.5倍。 通过将含有5-30质量%的球形填料的聚酰亚胺前体溶液涂布在聚酰亚胺的自支撑膜上,然后加热来制造聚酰亚胺膜。
    • 2. 发明专利
    • Method of manufacturing polyimide film, and polyimide film
    • 制备聚酰亚胺膜的方法和聚酰亚胺膜
    • JP2012201860A
    • 2012-10-22
    • JP2011069997
    • 2011-03-28
    • Ube Industries Ltd宇部興産株式会社
    • KAMINE TETSUJIUEKIDO TAKESHI
    • C08J5/18C08G73/10H05K1/03H05K3/28
    • PROBLEM TO BE SOLVED: To provide a polyimide film restrained in coloring and enhanced in light transmittance, without impairing a physical property such as a heat resistance, and a method of manufacturing the same.SOLUTION: The polyimide film enhanced in light transmittance can be obtained by the method of manufacturing the polyimide film having a step of obtaining a self-supporting film by flow-casting, on a support body, a polyamic acid solution containing a polyamic acid solution obtained by reacting a tetracarboxylic acid component with a diamine component, and a phosphate and/or a salt thereof of 0.00025 pt.wt or more and less than 0.001 pt.wt, per 100 pts.wt of the polyamic acid solution, followed to be dried, and a step of heating the self-supporting film.
    • 要解决的问题:提供抑制着色的聚酰亚胺膜和增强透光性,而不损害诸如耐热性的物理性质及其制造方法。 解决方案:通过制造具有通过流延获得自支撑膜的步骤的聚酰亚胺膜的制备方法,在载体上,含有聚酰胺的聚酰胺酸溶液,可以获得透光性提高的聚酰亚胺膜 按每100重量份聚酰胺酸溶液使四羧酸组分与二胺组分反应得到的酸溶液和磷酸盐和/或其盐为0.00025重量份至小于0.001重量份,随后 待干燥,以及加热自支撑膜的步骤。 版权所有(C)2013,JPO&INPIT
    • 3. 发明专利
    • Device and method for producing polyimide film
    • 用于生产聚酰亚胺膜的装置和方法
    • JP2012200995A
    • 2012-10-22
    • JP2011067638
    • 2011-03-25
    • Ube Industries Ltd宇部興産株式会社
    • UEKIDO TAKESHIMASUI EIJIOGAWA YUJIKIMURA MASAKATSU
    • B29C41/24B29C41/34B29K79/00B29L7/00C08J5/18
    • PROBLEM TO BE SOLVED: To provide a device and method for producing a polyimide film which can produce the polyimide film to which surface modification and various properties are imparted with good productivity.SOLUTION: The device for producing the polyimide film includes: a cast furnace 4 for drying a cast object 1a obtained by casting a polyimide precursor solution 1 on a support body 3 to form a self-supporting film 1b; a coater furnace 5 having an organic solution application device 11a (11b) applying an organic solution to both faces or one face of the self-supporting film 1b having pass through the cast furnace 4 and a dryer 13a (13b) blowing hot air to the self-supporting film 1b to which the organic solution is applied; and a cure furnace 6 heating the self-supporting film 1b having pass through the coater furnace 5 to complete imidization. By using the device for producing the polyimide film, the polyimide film is produced.
    • 要解决的问题:提供一种可以制造能够赋予表面改性和各种性能的聚酰亚胺膜的聚酰亚胺膜的制造装置和方法,并且具有良好的生产率。 解决方案:用于制造聚酰亚胺膜的装置包括:用于干燥通过将聚酰亚胺前体溶液1浇铸在支撑体3上而形成自支撑膜1b而获得的铸造物体1a的铸造炉4; 涂布机5具有将有机溶液施加到通过铸造炉4的自支撑膜1b的两面或一面的有机溶液涂布装置11a和吹入热空气的干燥机13a(13b) 施加有机溶液的自支撑膜1b; 以及加热通过涂布机5的自支撑膜1b以完成酰亚胺化的固化炉6。 通过使用聚酰亚胺膜的制造装置,制作聚酰亚胺膜。 版权所有(C)2013,JPO&INPIT
    • 5. 发明专利
    • Method of producing polyimide film
    • 生产聚酰亚胺膜的方法
    • JP2010149494A
    • 2010-07-08
    • JP2009133557
    • 2009-06-02
    • Ube Ind Ltd宇部興産株式会社
    • UEKIDO TAKESHIIIIZUMI NOBORUNISHINO TOSHIYUKIMASUI EIJIYANAGIDA KEIICHI
    • B29C55/08B29K79/00B29L7/00B32B15/088C08G73/10H05K1/03
    • B29C41/003B29C41/24B29C55/08B29D7/01B29K2077/10B29K2079/08B29L2007/008C08G73/1067C08J5/18C08J2379/08C08L79/08
    • PROBLEM TO BE SOLVED: To provide a method of stably performing continuous production which hardly causes a trouble such as breakage of a clamping part of a film edge part with respect to a method of producing a polyimide film which is controlled such that the linear expansion coefficient in the transverse direction is smaller than the linear expansion coefficient in the machine direction. SOLUTION: The method of producing polyimide film is characterized by: casting a solvent solution of a polyimide precursor on a support; removing a solvent in the solution; peeling a cast film from which the solvent is removed, as a self-sustaining film; starting the stretching of the self-sustaining film having a solvent content of 25 to 45% and an imidization rate of 5 to 40%, in the transverse direction at an initial heating temperature of 80 to 240°C; and, thereafter, heating the stretched film at a final heating temperature of 350 to 580°C. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种稳定地进行连续生产的方法,其难以引起诸如膜边缘部分的夹持部分的破损的问题,相对于制备聚酰亚胺膜的方法,其控制使得 横向的线膨胀系数小于机器方向的线膨胀系数。 解决方案:聚酰亚胺膜的制造方法的特征在于:在载体上浇铸聚酰亚胺前体的溶剂溶液; 去除溶液中的溶剂; 剥离除去溶剂的流延膜作为自持膜; 在80〜240℃的初始加热温度下,在宽度方向开始拉伸溶剂含量为25〜45%,酰亚胺化率为5〜40%的自支撑膜; 然后在350〜580℃的最终加热温度下加热拉伸膜。 版权所有(C)2010,JPO&INPIT
    • 9. 发明专利
    • Polyimide film for metallizing, and metal laminate polyimide film
    • 用于金属化的聚酰亚胺膜和金属层压聚酰亚胺膜
    • JP2010267691A
    • 2010-11-25
    • JP2009116204
    • 2009-05-13
    • Ube Ind Ltd宇部興産株式会社
    • KAMINE TETSUJIUEKIDO TAKESHIMATSUMOTO NAOYUKI
    • H05K1/03B32B27/34
    • PROBLEM TO BE SOLVED: To provide a polyimide film which is favorably used as a base material of an electronic component such as a printed circuit board, flexible printed substrate, and TAB tape, and on which a metal layer is directly provided, on the surface, by a metallizing method for superior adhesiveness even after heating. SOLUTION: The polyimide film for metallization includes a polyimide layer (a) on both surfaces or single surface of a polyimide layer (b). The polyimide layer (a) means such polyimide as obtained from acid component whose main component is 2,3,3',4'-biphenyl tetracarboxylic acid dianhydride and diamine component whose main component is diaminodiphenyl ether. The polyimide film for metallizing contains surface treatment agent. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供有利地用作电子部件如印刷电路板,柔性印刷基板和TAB带的基材的聚酰亚胺膜,并且在其上直接设置有金属层, 在表面上,即使在加热后也通过金属化方法具有优异的粘附性。 解决方案:用于金属化的聚酰亚胺膜包括在聚酰亚胺层(b)的两个表面或单个表面上的聚酰亚胺层(a)。 聚酰亚胺层(a)是指由主成分为2,3,3',4'-联苯四羧酸二酐和主要成分为二氨基二苯醚的二胺成分的酸成分得到的聚酰亚胺。 用于金属化的聚酰亚胺膜含有表面处理剂。 版权所有(C)2011,JPO&INPIT