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1. 发明专利

JP2009154541A Multilayer polyimide film and laminated body 有权
标题翻译：多层聚酰亚胺膜和层压体
公开(公告)号：JP2009154541A
公开(公告)日：2009-07-16
申请号：JP2009030719
申请日：2009-02-13
申请人： Ube Ind Ltd , 宇部興産株式会社
发明人： YAMAMOTO TOMOHIKO , ABU TOSHIHIKO , NISHINO TOSHIYUKI , AMANE TAKASHI
IPC分类号： B32B27/34 , B32B15/088 , C08G73/10 , H05K1/03 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer polyimide film able to be laminated with a metal foil on a comparatively mild condition, a durability to chlorine containing solvents is superior, also able to select adhesion conditions by being able to control its glass transition temperature in a wide range and also endure for using at a high temperature and to provide a laminated body with a metal layer made by using the film.
SOLUTION: A multilayer polyimide film made adjusted by changing a composition of p-phenylene dimaine and/or diaminodiphenylether so as a glass transition temperature (Tg) of a thin layer polyimide(Y) to be made a desired value in a range between 210°C and 310°C, the thin layer polyimide (Y) with an imide unit comprised of an aromatic tetracarboxylic acid dianhydride residue and am aromatic diamine residue being laminated to be one body on at least one side of a substrate polyimide (X) layer with a low thermal expansion nature and a metallic layer laminated bocy made by using the multilayer polyimide film.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够在相对温和的条件下与金属箔层压的多层聚酰亚胺膜，对含氯溶剂的耐久性优异，还能够通过控制其玻璃来选择粘合条件转变温度在宽范围内并且还耐受在高温下使用并且提供具有通过使用该膜制成的金属层的层压体。解决方案：通过改变对苯二甲酰胺和/或二氨基二苯基醚的组成以及薄层聚酰亚胺（Y）的玻璃化转变温度（Tg）来调节的多层聚酰亚胺膜，使其成为所需值的范围在210℃至310℃之间，具有由芳族四羧酸二酐残基和芳香族二胺残基构成的酰亚胺单元的薄层聚酰亚胺（Y）在基材聚酰亚胺（X）的至少一面上被层压成一体）层和通过使用多层聚酰亚胺膜制成的金属层层叠的boc。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2004314394A Method for manufacturing polyimide film 有权
公开(公告)号：JP2004314394A
公开(公告)日：2004-11-11
申请号：JP2003110324
申请日：2003-04-15
申请人： Ube Ind Ltd , 宇部興産株式会社
发明人： UEKIDO TAKESHI , AMANE TAKASHI , YAMASHITA ATSUSHI , ABU TOSHIHIKO
IPC分类号： B29C41/12 , B29K79/00 , B29L7/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a polyimide film based on a 3,3',4,4'-biphenyltetracarboxylic acid component and p-phenylenediamine, high in productivity, causing no cloudiness and having good transparency.
SOLUTION: A solution is prepared by adding an imidating catalyst to a solution of a polyimide precursor, which is based on a 3,3'4,4'-biphenyltetracarboxylic dianhydride and p-phenylendiamine, in a polar organic solvent if necessary and cast on a support to be brought into contact with an alcohol being liquid at the normal temperature. Thereafter, the self-supporting film of polyamic acid peeled from the support is heated and dried to manufacture the imidated polyimide film.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2006124685A Polyimide film for cof (chip-on-film), and laminate 审中-公开
标题翻译：用于COF（芯片 - 薄膜）的聚酰亚胺薄膜和层压板
公开(公告)号：JP2006124685A
公开(公告)日：2006-05-18
申请号：JP2005283834
申请日：2005-09-29
申请人： Ube Ind Ltd , 宇部興産株式会社
发明人： HAMADA KAZUYUKI , AMANE TAKASHI , NAGOSHI YASUHIRO , FUJIWARA KAZUHIRO , KOBAYASHI SEIKI , UCHIDA KAZUSHIGE , KOMODA TSUNEHISA
IPC分类号： C08L79/08 , B32B15/088 , C08J5/18 , C08K3/00 , C23C14/20 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film for COF high in dimensional accuracy and substantially free of large protrusions attributable to an internally added inorganic filler, smooth in surface and high in dimensional accuracy under moisture absorption, and giving high-quality copper-clad substrates, and to obtain a laminate reduced in causing spring-back and improved in the rigidity and dimensional accuracy under moisture absorption of the polyimide film compared to four-component polyimide film.
SOLUTION: The film comprises a polyimide that is produced by thermal imidation of a 3,3',4,4'-biphenyltetracarboxylic dianhydride and p-phenylenediamine as the respective main components. In the film, an inorganic filler prior to addition to film is less than 1 μm in avearge size and there are no protrusions attributable to inorganic fillers with larger average size. The film has a thickness of 25-35 μm. The laminate is obtained by subjecting the polyimide film for COF to discharge treatment under a vacuum followed by forming a substrate metallic thin film and then an electrically conductive metallic layer consisting of electrically conductive metallic deposit.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供高尺寸精度的COF的聚酰亚胺膜，并且基本上没有可归因于内部添加的无机填料的大的突起，表面光滑并且在吸湿下的尺寸精度高，并且提供高质量并且为了获得与四组分聚酰亚胺膜相比，聚酰亚胺薄膜吸湿的刚性和尺寸精度降低的层压板，从而得到弹性回复。解决方案：该膜包括通过3,3'，4,4'-联苯四羧酸二酐和对苯二胺作为主要组分的热亚胺化制备的聚酰亚胺。在膜中，添加到膜之前的无机填料在放大尺寸中小于1μm，并且没有归因于具有较大平均尺寸的无机填料的突起。该膜的厚度为25-35μm。通过使COF的聚酰亚胺膜在真空下进行放电处理，然后形成基板金属薄膜，然后由导电金属沉积物构成的导电金属层，获得层压体。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2009029141A Thermocompression bondable polyimide and laminate 审中-公开
标题翻译：热塑性聚合物和层压板
公开(公告)号：JP2009029141A
公开(公告)日：2009-02-12
申请号：JP2008241252
申请日：2008-09-19
申请人： Ube Ind Ltd , 宇部興産株式会社
发明人： YAMAMOTO TOMOHIKO , ABU TOSHIHIKO , NISHINO TOSHIYUKI , AMANE TAKASHI
IPC分类号： B32B27/34 , B32B15/08 , B32B15/088 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a multilayer polyimide film which can be laminated on a metal foil under a relatively mild condition, has excellent durability against a chlorine based solvent, can widely select adhesion condition by widely controlling a glass transition temperature and is durable to use at high temperature and to provide a metallic layer laminate using the same film.
SOLUTION: The multilayer polyimide film is formed by integrally laminating a thin film polyimide (Y) having an imide unit comprising an aromatic tetra-carboxylic acid di-anhydrate residue and an aromatic diamine residue at least on one surface of a low thermal expansive base body polyimide (X) layer and changing and adjusting the composition of p-phenylene diamine and/or diamino diphenyl ether in such a manner that the glass transition temperature (Tg) of the thin layer polyimide (Y) exhibits a prescribed value in the range of 210-310°C. The metallic layer laminate uses the multilayer polyimide film.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以在相对温和的条件下层压在金属箔上的多层聚酰亚胺膜，对氯系溶剂具有优异的耐久性，可以广泛地选择粘合条件，通过广泛控制玻璃化转变温度和耐高温使用，并提供使用相同膜的金属层层压体。解决方案：多层聚酰亚胺膜是通过在至少一个低热表面上整合层压具有包含芳族四羧酸二水合物残余物和芳族二胺残基的酰亚胺单元的薄膜聚酰亚胺（Y）膨胀基体聚酰亚胺（X）层，并且以如下方式改变和调节对苯二胺和/或二氨基二苯醚的组成，使得薄层聚酰亚胺（Y）的玻璃化转变温度（Tg）在范围210-310°C。金属层叠体使用多层聚酰亚胺膜。版权所有（C）2009，JPO＆INPIT

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