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    • 3. 发明专利
    • Method for manufacturing mim tunnel diode
    • 制造MIM隧道二极管的方法
    • JP2012151346A
    • 2012-08-09
    • JP2011009850
    • 2011-01-20
    • Toyoda Gosei Co LtdToyota Central R&D Labs Inc株式会社豊田中央研究所豊田合成株式会社
    • ITO TADASHIYAMADA NOBORUUENO YUKIHISA
    • H01L29/88H01L21/329
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an MIM tunnel diode in which an extremely thin and uniform insulation layer can be formed on a first metal layer easily by plasma oxidation.SOLUTION: A method for manufacturing an MIM tunnel diode in which a first metal layer 14 composed of nickel, an insulation layer 16 composed of nickel oxide having a thickness of 1 to 10 nm, and a second metal layer 18 are laminated in this order on an insulating substrate 12 includes an insulation layer forming step for forming an insulation layer by oxidizing the first metal layer by plasma oxidation method. When the first metal layer is oxidized by plasma oxidation method in the insulation layer forming step, a parallel-plate plasma generating device is used, and the oxygen pressure p(Pa), the self-bias voltage V(V) and the processing time t(min) of the parallel-plate plasma generating device are set to satisfy the following conditions; 6.8≤p≤12.0, 290≤V≤400, 3≤t≤6.
    • 要解决的问题:提供一种MIM隧道二极管的制造方法,其中可以通过等离子体氧化容易地在第一金属层上形成极薄且均匀的绝缘层。 解决方案:一种制造MIM隧道二极管的方法,其中将由镍组成的第一金属层14,由氧化镍构成的绝缘层16和第二金属层18层压在 绝缘基板12上的顺序包括通过用等离子体氧化法氧化第一金属层来形成绝缘层的绝缘层形成步骤。 当在绝缘层形成工序中第一金属层被等离子体氧化法氧化时,使用平行平板等离子体生成装置,氧压p(Pa),自偏压V DC ≤400,3≤t≤6。 版权所有(C)2012,JPO&INPIT