专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010028706A Circuit construct for ic card and tag, and manufacturing method therefor 审中-公开
标题翻译： IC卡和标签的电路结构及其制造方法
公开(公告)号：JP2010028706A
公开(公告)日：2010-02-04
申请号：JP2008190621
申请日：2008-07-24
申请人： Toyo Aluminium Kk , 東洋アルミニウム株式会社
发明人： SARUWATARI MASATAKA , NAKANO TOSHIHIKO
IPC分类号： H01Q1/38 , B42D15/10 , G06K19/07 , G06K19/077 , H01Q7/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit construct for an IC card and tag in which the cost for bonding both ends of antenna circuit pattern layers can be reduced, and productivity thereof can be improved, and to provide a manufacturing method therefor. SOLUTION: The circuit construct 1 for an IC card and tag includes a substrate 11 made of a resin film; antenna circuit pattern layers 13 that are made of a metal foil and formed on one surface of the substrate 11; one end portion 13a of a first circuit pattern layer portion of the antenna circuit patterns 13; and a conductive linear body 15 for bring one end portion 13b of a second circuit pattern layer portion into conduction. The linear body 15 includes a center portion extending on the other surface of the substrate 11; and one end portion 15a and the other end portion 15b, that penetrate, from the other surface of the substrate 11, the substrate 11 and each of the first and second circuit pattern layer portions, and are disposed on each surface of the first and second circuit pattern layer portions. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于IC卡和标签的电路结构，其中可以降低接合天线电路图案层的两端的成本，并且可以提高其生产率，并提供其制造方法。解决方案：用于IC卡和标签的电路结构1包括由树脂膜制成的基板11; 由金属箔制成并形成在基板11的一个表面上的天线电路图案层13; 天线电路图案13的第一电路图案层部分的一个端部13a; 以及用于使第二电路图案层部分的一个端部13b导通的导电线状体15。直线体15包括在基板11的另一个表面上延伸的中心部分; 以及一个端部15a和另一个端部15b，其从基板11的另一个表面穿透基板11以及第一和第二电路图案层部分中的每一个，并且设置在第一和第二电路图案的每个表面上电路图案层部分。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2008053470A Rear face protection sheet for solar battery module and solar battery module equipped therewith 审中-公开
标题翻译：太阳能电池模块及其配套的太阳能电池模块后面保护表
公开(公告)号：JP2008053470A
公开(公告)日：2008-03-06
申请号：JP2006228315
申请日：2006-08-24
申请人： Toyo Aluminium Kk , 東洋アルミニウム株式会社
发明人： KOJIMA MASARU , NAKANO TOSHIHIKO , HOSAKA MAKOTO , YASUKAWA HIDENORI
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a rear face protection sheet for a solar battery module which excels in anti-moisture permeability and is good in design, with no increase in weight per unit area, and to provide the solar battery module equipped with the same. SOLUTION: The rear face protection sheet 10 for a solar battery module is one arranged on the rear face side of the solar battery module 100, and has an aluminum foil 12 with at least one face colored as an ink layer 121. The solar battery module 100 is equipped with the rear face protection sheet 10 for a solar battery module, with the aluminum foil 12 arranged in such a manner that the colored face may be on the light reception side. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种太阳能电池模块的后表面保护片，其具有优异的抗透湿性和良好的设计，而不增加每单位面积的重量，并提供装备有太阳能电池模块用同样的解决方案：太阳能电池模块的后表面保护片10是布置在太阳能电池模块100的背面侧的背面保护片10，并且具有至少一个被着色为油墨层121的面的铝箔12。太阳能电池模块100配备有用于太阳能电池模块的后表面保护片10，其中铝箔12以使得着色面可以在光接收侧的方式布置。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2009088364A Circuit constitution body and manufacturing method thereof 有权
标题翻译：电路构成体及其制造方法
公开(公告)号：JP2009088364A
公开(公告)日：2009-04-23
申请号：JP2007258233
申请日：2007-10-02
申请人： Toyo Aluminium Kk , 東洋アルミニウム株式会社
发明人： YASUKAWA HIDENORI , OTA ATSUSHI , NAKANO TOSHIHIKO
IPC分类号： H05K1/09 , H05K1/11 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a circuit constitution body capable of having various characteristics, and to provide manufacturing method thereof.
SOLUTION: Antenna circuit constitution bodies 1 and 2 for an IC card and an IC tag each have a resin film base 11 and an antenna circuit pattern formed on a surface of the base. The antenna circuit pattern layer includes a first antenna circuit pattern layer 100 having an electric conductor made principally of aluminum and a second antenna circuit pattern layer 200 having an electric conductor made principally of copper different from aluminum.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够具有各种特性的电路结构体，并提供其制造方法。解决方案：用于IC卡和IC标签的天线电路结构体1和2各自具有形成在基座的表面上的树脂膜基座11和天线电路图案。天线电路图案层包括具有主要由铝制成的电导体的第一天线电路图案层100和具有主要由不同于铝的铜制成的导体的第二天线电路图案层200。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008041511A Method of manufacturing metal foil for collector 审中-公开
标题翻译：用于收集器的金属箔的制造方法
公开(公告)号：JP2008041511A
公开(公告)日：2008-02-21
申请号：JP2006216378
申请日：2006-08-09
申请人： Toyo Aluminium Kk , 東洋アルミニウム株式会社
发明人： OTA ATSUSHI , NAKANO TOSHIHIKO
IPC分类号： H01M4/64
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal foil for a collector capable of forming through holes industrially stably.
SOLUTION: The method of manufacturing the metal foil for the collector comprises: a process for adhering a synthetic resin layer 3 on one surface of the metal foil 1 by interposing an adhesive layer 2; a process for forming a resist layer 4 having a prescribed pattern on the other surface of the metal foil 1; a process for forming a plurality of through holes 11 on the metal foil 1 where the synthetic resin layer 3 is adhered to one surface by etching with the resist layer 4 formed on the other surface as a mask; a process for separating the synthetic resin layer 3 and the adhesive layer 2 from the metal foil 1 after forming the through hole 11; and a process for removing the resist layer 4 after separating the synthetic resin layer 3 and the adhesive layer 2.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在工业上稳定地形成通孔的集电器用金属箔的制造方法。解决方案：用于集电器的金属箔的制造方法包括：通过插入粘合层2将合成树脂层3粘附在金属箔1的一个表面上的工艺; 在金属箔1的另一个表面上形成具有规定图案的抗蚀剂层4的工艺; 在金属箔1上形成多个通孔11的方法，其中合成树脂层3通过用形成在另一表面上的抗蚀剂层4作为掩模进行蚀刻而粘附到一个表面; 在形成通孔11之后，从金属箔1分离合成树脂层3和粘合层2的工序; 以及在分离合成树脂层3和粘合剂层2之后去除抗蚀剂层4的工艺。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2005022270A Carbon coated aluminum foil for cooking and its manufacturing method 审中-公开
标题翻译：用于烹饪的碳包铝铝箔及其制造方法
公开(公告)号：JP2005022270A
公开(公告)日：2005-01-27
申请号：JP2003190845
申请日：2003-07-03
申请人： Toyo Aluminium Kk , 東洋アルミニウム株式会社
发明人： RO AKINORI , NAKANO TOSHIHIKO , ISHIDA GIICHI , MATSUI TETSUYA
IPC分类号： A47J27/00 , A47J36/02 , B32B15/04 , B32B15/20 , C23C8/64 , C23C24/08 , C23C30/00
CPC分类号： H01G11/26 , H01G11/28 , H01G11/30
摘要： PROBLEM TO BE SOLVED: To provide a carbon coated aluminum foil for cooking enhanced in the adhesion of an aluminum foil to coated carbon, capable of heating food uniformly and efficiently and capable of adsorbing oils and fats oozing from food.
SOLUTION: A carbon-containing substance is bonded to the surface of the aluminum foil and, when the whole is heated in a hydrocarbon-containing space, an interposition layer containing aluminum and carbon is formed between the aluminum foil and a carbon-containing layer. The adhesion of the carbon-containing layer to the aluminum foil is enhanced by the interposition layer. When food is heated and cooked using the carbon coated aluminum foil for cooking thus manufactured, food is heated uniformly by the effect of far infrared rays discharged from coated carbon but coated carbon is prevented from being peeled from the aluminum foil and also from adhering on the food. Further, since coated carbon adsorbs oils and fats oozing from food, the taste of cooked food is not damaged.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于烹饪的碳涂覆铝箔，其增强了铝箔与涂覆碳的粘附性，能够均匀且有效地加热食物并且能够吸附从食物渗出的油和脂肪。解决方案：将含碳物质结合到铝箔的表面，并且当整体在含烃空间中被加热时，在铝箔和碳 - 碳化合物之间形成包含铝和碳的插入层，含有层。通过介入层增强含碳层对铝箔的粘合性。当使用这样制造的用于烹饪的碳涂覆的铝箔来加热烹饪食物时，通过从涂覆的碳排出的远红外线的作用使食物均匀地加热，但是防止涂覆的碳从铝箔上剥离，并且还粘附在餐饮。此外，由于涂覆的碳吸附从食物渗出的油和脂肪，熟食的味道不被损坏。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2514187B2 失效
公开(公告)号：JP2514187B2
公开(公告)日：1996-07-10
申请号：JP3939386
申请日：1986-02-24
申请人： TOYO ALUMINIUM KK
发明人： NAKANO TOSHIHIKO , NAGASE FUMIAKI , TAKEUCHI EIICHI
IPC分类号： B65D1/28 , B29C51/14

7. 发明专利

JPH057268B2 失效
公开(公告)号：JPH057268B2
公开(公告)日：1993-01-28
申请号：JP16494585
申请日：1985-07-24
申请人： TOYO ALUMINIUM KK
发明人： KAMATA MAMORU , NAGASE FUMIAKI , TAKEUCHI EIICHI , NAKANO TOSHIHIKO
IPC分类号： B65D33/00 , B65D33/22 , B65D77/38 , B65D81/34

8. 发明专利

JPH0431273A FOOD PACKAGE 失效
公开(公告)号：JPH0431273A
公开(公告)日：1992-02-03
申请号：JP12521690
申请日：1990-05-14
申请人： TOYO ALUMINIUM KK
发明人： NAKANO TOSHIHIKO
IPC分类号： B65D81/34
摘要： PURPOSE:To permit a food container to be heated by an electronic oven in its original packaged condition and eliminate the possibility of the container rupture due to an increase in the inner pressure by a method wherein the heat sealed resin layer of the container is provided with a strong adhesive force part and a weak adhesive force part and the latter part is made separable by the inner pressure of the container. CONSTITUTION:A lid 42 consisting of a laminated sheet 1 is heat sealed to a flange 41 provided around the peripheral edge of an opening part of a container 40. An air escape part 30' of thus sealed container is heat sealed with a resin layer 4 and the remainder is heat sealed with a heat seal layer 3. Since the air escape part 30' is heat sealed with the resin layer having a weak adhesive force, as the temperature and pressure inside the container rise during heating by an electronic oven, the separation of the air escape part alone gradually progress from the inside thereof until the inside of the container is brought in communication with the outside. In this way, in comparison with the rupture of a completely sealed container, the inner pressure of the container is kept lower, the openings are formed partially and the escape of air and the reduction of pressure take place simultaneously with the formation of such openings and, consequently, a quiet heating condition is produced and, since the position of air escape can be specified, there is no possibility of the content leakage.

9. 发明专利

JPH0349829B2 失效
公开(公告)号：JPH0349829B2
公开(公告)日：1991-07-30
申请号：JP26940486
申请日：1986-11-12
申请人： TOYO ALUMINIUM KK
发明人： KAMATA MAMORU , NAGASE FUMIAKI , TAKEUCHI EIICHI , NAKANO TOSHIHIKO
IPC分类号： B65D30/08 , B65D30/16 , B65D33/22 , B65D81/34

10. 发明专利

JPH01145115A MANUFACTURE OF INJECTION MOLDED BODY HAVING METALLIC THIN FILM 失效
公开(公告)号：JPH01145115A
公开(公告)日：1989-06-07
申请号：JP30521987
申请日：1987-12-01
申请人： TOYO ALUMINIUM KK
发明人： NAKANO TOSHIHIKO , NAGASE FUMIAKI , MAKIMOTO SHOICHI , TAKEUCHI EIICHI , KAMATA MAMORU
IPC分类号： B29C45/16 , B29C45/14 , B29C61/02 , B29K105/02 , B29L9/00 , B32B7/02 , B32B15/08
摘要： PURPOSE:To enable the title method to mold into a complicated form without generating break by a method wherein a laminated body obtained by laminating a heat- shrinkable synthetic resin film at least to one side of a metallic thin film through an intermittent laminated layer is formed, which is molded by performing heating and shrinking and injection molding of thermoplastic synthetic resin is performed by making use of the same as an insert base material. CONSTITUTION:A laminated body 1 is obtained by laminating a heat-shrinkable synthetic resin film 4 to a metallic thin film 2 through an intermittent laminating layer 3. When the laminated body 1 is heated and shrunk through hot air after the laminated body 1 has been set up to, for example, one side mold 12 of an injection molding mold, the laminated body 1 is stuck close to the mold 12 while generating fine creases and an insert base material 20 is made. Press contacting of both the molds 11, 12 is performed and injection molding is performed by casting molten thermoplastic synthetic resin through a nozzle 13 after that. As a large number of fine creases have been formed beforehand through heating and shrinking, a deformation at the time of forming is absorbed by the creases and molding can be performed into a complicated form without causing break or a crack on the metallic thin film.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式