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1. 发明专利

JP2014176239A Polyphase ac power supply for plasma discharge 审中-公开
标题翻译：用于等离子体放电的多相交流电源
公开(公告)号：JP2014176239A
公开(公告)日：2014-09-22
申请号：JP2013048508
申请日：2013-03-11
申请人： Toyama Prefecture , 富山県 , Tateyama Machine Kk , 立山マシン株式会社 , Cosel Co Ltd , コーセル株式会社
发明人： SHIMIZU KOJI , ODA SEIJI , NOJIMA NOBUYUKI , MATSUMOTO KAZUNORI , SHIRAISHI NOBUYUKI
IPC分类号： H02M7/493 , C23C16/503 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide an ideal polyphase AC power supply having high amplitude and phase symmetry, i.e., high amplitude and phase symmetry where the magnitude of voltage is the same in all phases, and the adjacent phase difference is the same, by controlling a PWM (pulse width modulation) circuit and a phase adjustment circuit digitally.SOLUTION: A DC power supply 1 is connected with n PWM inverters 2, the output of each PWM inverter 2 is connected with n transformers 3, respectively, n discharge electrodes 4 and n waveform detection circuits 5 are connected to the output side of these transformers 3, and the output side of these waveform detection circuits 5 are connected with a PWM control circuit 6.
摘要翻译：要解决的问题：为了提供具有高幅度和相位对称性的理想的多相交流电源，即，在所有相中的电压大小相同的高幅度和相位对称，并且相邻的相位差是相同的，通过控制一个PWM（脉冲宽度调制）电路和一个相位调整电路。解决方案：直流电源1与n个PWM逆变器2连接，每个PWM逆变器2的输出分别与n个变压器3相连，n个放电电极4 并且n个波形检测电路5连接到这些变压器3的输出侧，并且这些波形检测电路5的输出侧与PWM控制电路6连接。

2. 发明专利

JP2003332722A Method of soldering electronic component and solder applying device 有权
标题翻译：焊接电子元件和焊接器的方法
公开(公告)号：JP2003332722A
公开(公告)日：2003-11-21
申请号：JP2002137126
申请日：2002-05-13
申请人： Cosel Co Ltd , コーセル株式会社
发明人： MIZUI KATSUMI , KUBOIKE YOSHIBUMI , SHIRAISHI NOBUYUKI
IPC分类号： B41F15/08 , B23K1/00 , B23K3/06 , B23K101/42 , B41F15/40 , B41M1/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an electronic component soldering method and a solder applying device, which are capable of efficiently and accurately applying solder with a simple structure in a soldering process.
SOLUTION: The solder applying device uses a solder printing mask 26 that is equipped with a relief recess 22 at which the tip of a terminal 8 of an electronic component 1 is located, a U-shaped groove 24 which extends in a prescribed direction and is located near the relief recess 22, and a plurality of through-holes 20 where the soldering part 9 of the electronic component 1 which is formed along the bottom of the U-shaped groove 24 is exposed. The electronic components 1 are covered with the solder printing mask 26 so as to expose the soldering parts 9 of the electronic components 1 through the through-holes 20 provided to the solder printing mask 26, and solder cream 5 is placed inside the U-shaped groove 24. A squeegee 30 equipped with a scraper 32 fitted into the U-shaped groove 20 in the widthwise direction is moved in the lengthwise direction of the U-shaped groove 20 to apply the solder cream 5 on the soldering part 9 of the electronic component 1.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供能够在焊接工艺中以简单的结构有效且准确地施加焊料的电子部件焊接方法和焊料施加装置。焊料施加装置使用配有电子部件1的端子8的前端所在的卸压凹部22的焊锡印刷用掩模26，在规定的范围内延伸的U字形槽24 并且位于释放凹部22附近，以及多个通孔20，其中沿着U形槽24的底部形成的电子部件1的焊接部9露出。电子部件1被焊料印刷掩模26覆盖，以通过设置在焊料印刷掩模26上的通孔20露出电子部件1的焊接部9，将焊膏5放置在U形在U形槽20的长度方向上移动配备有沿宽度方向嵌合在U形槽20中的刮板32的刮板30，将焊膏5涂布在电子部件的焊接部9上版权所有（C）2004，JPO

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