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1. 发明专利

JP2012004595A Method of manufacturing light-emitting element module substrate 有权
标题翻译：制造发光元件模块基板的方法
公开(公告)号：JP2012004595A
公开(公告)日：2012-01-05
申请号：JP2011205800
申请日：2011-09-21
申请人： Toshiba Corp , Toshiba Lighting & Technology Corp , 東芝ライテック株式会社 , 株式会社東芝
发明人： HAPPOYA AKIHIKO , IZUMI MASAHIRO , SANPEI TOMOHIRO
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting element module substrate having a mounting part and a bonding part with a high reflectance, a high bondability, and an excellent electric insulation from an end part.SOLUTION: Provided is a method of manufacturing a light-emitting element module substrate that has a lamination plate including a base metal plate and an insulating layer provided on the base metal plate, and a metal layer provided on the insulating layer and having a mounting part and a bonding part. The metal layer includes at least one of silver layers as the top layers of the mounting part and the bonding part. The mounting part and the bonding part are electrically blocked from the circumference of a lamination plate. In the manufacturing method, the silver layer is formed by electrolytic plating via a plating wiring part connected to a foundation layer formed on the insulating layer and having at least one of patterns of the mounting part and the bonding part. Further, at least a part of the plating wiring part is removed.
摘要翻译：解决问题的方案：提供一种制造发光元件模块基板的方法，该发光元件模块基板具有从端部具有高反射率，高粘合性和优异的电绝缘性的安装部分和接合部分。解决方案：提供一种制造发光元件模块基板的方法，该发光元件模块基板具有包括基板金属板和设置在基板金属板上的绝缘层的叠层板，以及设置在绝缘层上的金属层，安装部和接合部。金属层包括作为安装部的顶层和接合部的银层中的至少一个。安装部和接合部与层压板的圆周电气封闭。在制造方法中，通过经由连接到形成在绝缘层上的基底层的电镀布线部分进行电解电镀形成银层，并且具有安装部分和接合部分的图案中的至少一个。此外，除去电镀配线部的至少一部分。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011216588A Light emitting element module-substrate, light emitting element module, and lighting device 审中-公开
标题翻译：发光元件元件基板，发光元件模块和照明装置
公开(公告)号：JP2011216588A
公开(公告)日：2011-10-27
申请号：JP2010081911
申请日：2010-03-31
申请人： Toshiba Corp , Toshiba Lighting & Technology Corp , 東芝ライテック株式会社 , 株式会社東芝
发明人： HAPPOYA AKIHIKO , IZUMI MASAHIRO , SANPEI TOMOHIRO
IPC分类号： H01L33/62 , F21S2/00 , F21V29/00 , F21Y101/02
CPC分类号： H01L33/405 , F21K9/232 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2924/3025 , H05K1/056 , H05K3/0097 , H05K3/242 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting element module-substrate that has a high degree of reflection and high bonding properties, and also has a packaging and bonding section excellent in electric insulation with an end part, and also to provide a light emitting element module and a lighting device.SOLUTION: Provided is a light emitting element module-substrate which has: a laminate 10 that includes a base metal board 11 and insulating layer 12 provided on the base metal board; and a metal layer 20 which is a metal layer provided on the insulating layer, and has a packaging section 25 where a light emitting element 50 is packaged, and a bonding section 26 where the wiring is bonded that is electrically connected to the light emitting element. The metal layer is at least the top layer of either of the packaging section and bonding section, and includes a silver layer 23 formed through electrolytic plating. The packaging and bonding sections are electrically isolated from the peripheral edge 10e of the laminated board.
摘要翻译：要解决的问题：提供具有高反射性和高粘合性的发光元件模块基板，并且还具有与端部电绝缘性优异的封装结合部，并且还提供发光元件模块和照明装置。解决方案：提供一种发光元件模块 - 基板，其具有：层叠体10，其包括基板金属板11和设置在基板上的绝缘层12; 以及金属层20，其是设置在绝缘层上的金属层，并且具有封装有发光元件50的封装部25和与发光元件电连接的布线的接合部26 。金属层至少是包装部分和接合部分中的任一个的顶层，并且包括通过电解电镀形成的银层23。封装和接合部分与层压板的周缘10e电隔离。

3. 发明专利

JP2011035431A Light-emitting module 有权
标题翻译：发光模块
公开(公告)号：JP2011035431A
公开(公告)日：2011-02-17
申请号：JP2010255672
申请日：2010-11-16
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： SANPEI TOMOHIRO , OTANI KIYOSHI , IZUMI MASAHIRO , MURATA ATSUYA
IPC分类号： H01L33/48
CPC分类号： H01L2224/48137 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting module which can improve heat dissipation from LEDs mounted to a substrate and can suppress the separation of a sealing resin from the module substrate caused by a heat cycle resulting from light emission and its suspension. SOLUTION: A plurality of metal heat diffusion layers 6 and 7 are formed on part of the surface of the module substrate 2. Wiring conductors 16 and 17 are formed on the surface of the module substrate 2 where the wiring conductors 16 and 17 and the heat diffusion layers 6 and 7 jointly form irregularities. A plurality of LEDs 32 supplied with power through the wiring conductors are mounted on the heat diffusion layers 6 and 7. The module substrate 2 is coated with a translucent sealing resin 48, and the module substrate 2, the heat diffusion layers 6 and 7, wiring conductors 16 and 17, and LEDs 32 are embedded in the translucent sealing resin 48. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种发光模块，其可以改善从安装到基板的LED的散热，并且可以抑制由于发光引起的热循环引起的密封树脂与模块基板的分离，悬挂。解决方案：在模块基板2的表面的一部分上形成有多个金属热扩散层6和7.在布线导体16和17的模块基板2的表面上形成有布线导体16和17 并且热扩散层6和7共同形成凹凸。通过布线导体供电的多个LED32安装在热扩散层6和7上。模块基板2涂覆有半透明的密封树脂48，模块基板2，热扩散层6和7，布线导体16和17以及LED32嵌入在半透明的密封树脂48中。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011014878A Light emitting module and lighting device 有权
标题翻译：发光模块和照明装置
公开(公告)号：JP2011014878A
公开(公告)日：2011-01-20
申请号：JP2010105665
申请日：2010-04-30
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： MORIKAWA KAZUTO , IZUMI MASAHIRO , NISHIMURA KIYOSHI , SANPEI TOMOHIRO , TAKENAKA ERIKA , MATSUDA SHUHEI
IPC分类号： H01L33/60 , F21S2/00 , F21Y101/02
CPC分类号： H05K1/0274 , F21K9/23 , F21K9/232 , F21Y2115/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H05K3/284 , H05K2201/0108 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light emitting module, along with a lighting device, for raising optical output and maintaining the optical output for an extended period.SOLUTION: The light emitting module 1 includes a module substrate 5, a reflecting layer 11, power feeding conductors 12 and 13, a plurality of light emitting elements 21, a bonding wire 23, and a sealing member 28. The reflecting layer 11 is provided on an insulating layer surface of the module substrate 5, and power feeding conductors 12 and 13 are provided near the reflecting layer 11. A plurality of light emitting elements 21 are provided to the reflecting layer 11. Adjoining light emitting elements 21 are connected together using the bonding wire 23. The reflecting layer 11, the power feeding conductors 12 and 13, the light emitting elements 21, and the bonding wires 23 are buried in a translucent sealing member 28 having gas permeability. The occupying area of the reflecting layer 11 plus the power feeding conductors 12 and 13 is 80% or more of the sealing area of the sealing member 28.
摘要翻译：要解决的问题：提供一种发光模块以及照明装置，用于提高光输出并保持光输出长时间。解决方案：发光模块1包括模块基板5，反射层11，馈电导体12和13，多个发光元件21，接合线23和密封构件28.反射层11设置在模块基板5的绝缘层表面上，并且馈电导体12和13 设置在反射层11附近。多个发光元件21设置在反射层11上。使用接合线23将发光元件21相邻。反射层11，馈电导体12和13，发光元件21和接合线23埋入具有透气性的半透明密封件28中。反射层11的占有面积加上供电导体12,13的密封部件28的密封面积的80％以上。

5. 发明专利

JP2010226099A Light emitting module 有权
标题翻译：发光模块
公开(公告)号：JP2010226099A
公开(公告)日：2010-10-07
申请号：JP2010039563
申请日：2010-02-25
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： SANPEI TOMOHIRO , OTANI KIYOSHI , IZUMI MASAHIRO
IPC分类号： H01L33/56 , F21S2/00 , F21Y101/02 , H01L33/60
CPC分类号： H01L2224/48137
摘要： PROBLEM TO BE SOLVED: To provide a light emitting module for maintaining the light reflection performance of a metallic reflection layer while increasing the heat dissipation of a light emitting diode element. SOLUTION: A light emitting module 1 includes: a module board 2; metallic reflection layers 6 and 7; light emitting diode lines 31; and a sealing member 48. The metallic reflection layers are laminated on the module board. Each of the light emitting diode lines includes a plurality of light emitting diodes 32 arrayed on a light reflection surface 5d of each of the metallic reflection layers and a plurality of bonding wires 37 connected between the light emitting diodes. A translucent die bond member 35 is interposed between the light emitting diode element and the light reflection surface. A sealing member is deposited on the module board so as to coat the light emitting diode lines and the metallic reflection layers. The die bond member is made of resin whose gas permeability is lower than that of the sealing resin material, and extended in the periphery of the light emitting diode element on the metallic reflection layer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在增加发光二极管元件的散热的同时保持金属反射层的光反射性能的发光模块。解决方案：发光模块1包括：模块板2; 金属反射层6和7; 发光二极管线31; 和密封构件48.金属反射层层压在模块板上。每个发光二极管线包括排列在每个金属反射层的光反射表面5d上的多个发光二极管32和连接在发光二极管之间的多个接合线37。在发光二极管元件和光反射表面之间插入半透明的管芯接合构件35。密封构件沉积在模块板上，以涂覆发光二极管线和金属反射层。芯片接合部件由透气性低于密封树脂材料的树脂制成，并且在金属反射层的发光二极管元件周围延伸。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010205775A Light emitting module 有权
标题翻译：发光模块
公开(公告)号：JP2010205775A
公开(公告)日：2010-09-16
申请号：JP2009046738
申请日：2009-02-27
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： OTANI KIYOSHI , SAITO AKIKO , IZUMI MASAHIRO , SANPEI TOMOHIRO , HAYASHIDA YUMIKO , MURATA ATSUYA
IPC分类号： H01L33/48
CPC分类号： H01L2224/48137
摘要： PROBLEM TO BE SOLVED: To provide a COB type light emitting module which can form an approximately round light distribution pattern, and can simplify laying of a bonding wire.
SOLUTION: A plurality of light emitting groups 21-30 on a module substrate 2 include a plurality of LED arrays 31 formed of a plurality of chip-like LEDs 32 fixed on the substrate 2 in line and bonding wires for connecting the LEDs. The number of LEDs included in the respective LED arrays 31 are same. The respective groups 21-30 are arranged to occupy a rectangle region on the substrate 2 by arranging the plurality of LED arrays 31 in a direction orthogonal to a direction the arrays extend. The respective light emitting groups include two different kinds of light emitting groups in which lengths of the arrays 31 included therein in an arrangement direction are different. Lengths in arrangement directions of the LED arrays 31 of the light emitting groups 21, 22, 24, 25, 26, 27, 29, 30, which are arranged on both sides of the light emitting groups 23, 28 having the longest length in the arrangement direction of the LED arrays 31 out of the various light emitting groups, become shorter as the light emitting groups are arranged farther from the light emitting groups having the longest length.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种COB型发光模块，其可以形成近似圆形的配光图案，并且可以简化接合线的铺设。解决方案：模块基板2上的多个发光组21-30包括由固定在基板2上的多个芯片状LED32形成的多个LED阵列31和用于连接LED的接合线。 LED阵列31中包含的LED的数量相同。各组21a通过在与阵列延伸的方向正交的方向上布置多个LED阵列31而布置成占据基板2上的矩形区域。各个发光基团包括其中包括在排列方向上的阵列31的长度不同的两种不同的发光组。发光组21,22,24,25,26,27,29,30的LED阵列31的配置方向的长度设置在发光组23,28的两侧的长度最长的发光组各发光组中的LED阵列31的排列方向随着发光组远离具有最长长度的发光体排列而变短。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009170114A Led bulb and luminaire 审中-公开
标题翻译： LED球泡灯
公开(公告)号：JP2009170114A
公开(公告)日：2009-07-30
申请号：JP2008003667
申请日：2008-01-10
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： TAKENAKA ERIKA , OGAWA KOZO , SAITO AKIKO , IZUMI MASAHIRO , TANAKA TOSHIYA , OSAWA SHIGERU , MORIKAWA KAZUTO
IPC分类号： F21S2/00 , F21V3/00 , F21V3/04 , F21V23/00 , F21V29/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To effectively radiate heat from a plurality of blue LED elements to increase the luminescent efficiency when obtaining white light through a yellow phosphor by using an LED module with the plurality of blue LED elements surface-mounted as a light source.
SOLUTION: The LED module 11A with the plurality of blue LED elements surface-mounted is attached to a heat radiating part 12 as a base part. The heat radiating part 12 radiates heat from the blue LED elements on the LED module 11A. The yellow phosphor 22 is applied to a globe 14, the LED module 11A is covered with the globe 14 applied with the yellow phosphor 22 and light emitted from the blue LED elements is converted to white light through the yellow phosphor 22 and radiated to the outside. A base 16 is attached to the heat radiating part 12 on the opposite side of the globe 14 and is electrically connected to a lighting circuit for lighting the blue LED elements.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了有效地从多个蓝色LED元件辐射热量，以通过使用具有表面安装为多个的蓝色LED元件的LED模块通过黄色荧光体获得白光来提高发光效率资源。解决方案：具有表面安装的多个蓝色LED元件的LED模块11A被附接到作为基座的散热部件12。散热部分12从LED模块11A上的蓝色LED元件辐射热量。黄色荧光体22被施加到球体14上，LED模块11A被施加有黄色荧光体22的球体14覆盖，并且从蓝色LED元件发射的光通过黄色荧光体22转换为白色光并辐射到外部。底座16在灯罩14的相对侧附接到散热部12，并且电连接到照明电路以照亮蓝色LED元件。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008270701A Light emitting device and illuminating fitting 审中-公开
标题翻译：发光装置和照明配件
公开(公告)号：JP2008270701A
公开(公告)日：2008-11-06
申请号：JP2007209217
申请日：2007-08-10
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： SANPEI TOMOHIRO , HAYASHIDA YUMIKO , IWAMOTO MASAMI , IZUMI MASAHIRO , KAWASHIMA KIYOKO , MATSUDA SHUHEI
IPC分类号： H01L33/50 , F21S2/00 , F21S8/04 , F21Y101/02 , H01L33/56 , H01L33/60
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device and an illuminating fitting capable of emitting white light having high color rendering property and capable of dealing with various color temperatures, and further capable of providing various and variable colors.
SOLUTION: The light emitting device 10 includes a substrate 20, a first light emission part 30 composed of light emitting elements 30R, 30G, 30B with three kinds or more different wavelengths disposed in a predetermined arrangement pattern on the substrate, and a second light emitting part 40 having light emitting elements 40B, 41B for excitating phosphors and phosphors 24, 25 excited by the light emitting elements.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够发出具有高显色性并能够处理各种色温的白光的发光装置和照明装置，并且还能够提供各种各样的颜色。解决方案：发光器件10包括衬底20，由在衬底上以预定布置图案布置的具有三种或更多种不同波长的发光元件30R，30G，30B组成的第一发光部分30，以及第二发光部分40具有用于激发由发光元件激发的荧光体和荧光体24,25的发光元件40B，41B。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008085302A Illumination apparatus 有权
标题翻译：照明设备
公开(公告)号：JP2008085302A
公开(公告)日：2008-04-10
申请号：JP2007184808
申请日：2007-07-13
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： SANPEI TOMOHIRO , IZUMI MASAHIRO , NOGI SHINJI , SAITO AKIKO
IPC分类号： H01L33/06 , F21S8/04 , F21Y101/02 , H01L33/32 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an illumination apparatus for easily forming a reflective layer, and for efficiently extracting the rays of light.
SOLUTION: An illumination apparatus (1) is provided with a plurality of semiconductor light-emitting devices (5), reflective layers (3, 23), a plurality of conductor parts (4c, 25a) and a translucent adhesive layer (6). Each of the semiconductor light-emitting devices (5) has a translucent substrate (11) and a semiconductor light-emitting layer (12) formed on the substrate (11). The reflective layers (3, 23) respectively have a size on which semiconductor light-emitting devices (5) are arranged at intervals. The conductor parts (4c, 25a) are formed on the reflective layers (3, 23), and electrically connected to the semiconductor light-emitting devices (5). The adhesive layer (6) bonds the substrates (11) of the semiconductor light-emitting devices (5) onto the reflective layers (3, 23), and thereby holds the semiconductor light-emitting devices (5) on the reflective layers (3, 23).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于容易地形成反射层并有效地提取光线的照明装置。解决方案：照明装置（1）设置有多个半导体发光器件（5），反射层（3,23），多个导体部分（4c，25a）和半透明粘合剂层（ 6）。每个半导体发光器件（5）具有形成在基板（11）上的透光性基板（11）和半导体发光层（12）。反射层（3,23）分别具有间隔配置有半导体发光元件（5）的尺寸。导体部分（4c，25a）形成在反射层（3,23）上，电连接到半导体发光器件（5）。粘合剂层（6）将半导体发光元件（5）的基板（11）粘合到反射层（3,23）上，从而将半导体发光元件（5）保持在反射层（3）上，23）。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008084908A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2008084908A
公开(公告)日：2008-04-10
申请号：JP2006260111
申请日：2006-09-26
申请人： Toshiba Lighting & Technology Corp , 東芝ライテック株式会社
发明人： OTANI KIYOSHI , SAITO AKIKO , IZUMI MASAHIRO , NISHIMURA KIYOSHI , SANPEI TOMOHIRO
IPC分类号： H01L33/32 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/49107 , H01L2224/73265
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device in which light take out efficiency can be enhanced while reducing the amount of phosphor used. SOLUTION: The light emitting device comprises a substrate 4 having a plurality of recesses and flat surface portions, a reflective layer 5 formed on the recesses and flat surface portions, a circuit pattern 3 formed on the reflective layer, a semiconductor light emitting element 2 having a translucent element substrate and a light emitting layer and arranged in the recess such that the boundary of the translucent element substrate and the light emitting layer opposes the side face of the circuit pattern 3, a translucent adhesive layer 21 for bonding the translucent element substrate of the semiconductor light emitting element to the reflective layer, and a resin layer 9 containing phosphor being excited by light emitted from the semiconductor light emitting element to emit light and arranged to cover the semiconductor light emitting element. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种可以在减少所使用的荧光体的量的同时提高光取出效率的发光装置。解决方案：发光器件包括具有多个凹部和平坦表面部分的基板4，形成在凹部和平坦表面部分上的反射层5，形成在反射层上的电路图案3，发射元件2具有半透明元件基板和发光层，并且布置在凹部中，使得半透明元件基板和发光层的边界与电路图案3的侧面相对;半透明粘合剂层21，用于将半透明半导体发光元件的元件衬底到反射层，以及包含荧光体的树脂层9被从半导体发光元件发射的光激发，并发射并覆盖半导体发光元件。版权所有（C）2008，JPO＆INPIT

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