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1. 发明专利

JP2008305168A Electronic equipment and manufacturing method thereof 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2008305168A
公开(公告)日：2008-12-18
申请号：JP2007151743
申请日：2007-06-07
申请人： Toshiba Corp , 株式会社東芝
发明人： HONDA SATOSHI , HONDA TOMOKO , KUROIWA NOBUYOSHI , NAKAHATA MASAOMI , MORIMOTO ATSUSHI , HATA YOSHIKAZU , SATO KOICHI , TSUJIMURA TERUHIRO , TABATA MAKOTO , SAKURAI MINORU , KATO SHOJI
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/24 , H01Q1/38 , H01Q1/46 , H04M1/02
CPC分类号： H01Q9/0407 , H01Q1/42 , Y10T29/49016
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment which can be made compact while maintaining good antenna characteristics, and a manufacturing method thereof. SOLUTION: The electronic equipment includes: a first molding which has a conductive pattern in an outer surface thereof and has a first frame part; a second molding which is closed with the first molding and has a second frame part; a wiring sheet having a connection pattern provided in an insulating sheet; a circuit board having a feed point; and a feeder which has one end extended to a junction surface of the first frame part facing the second frame part and has the other end connected to the conductive pattern; wherein one end of the connection pattern and the one end of the feeder are connected, and the other end of the connection pattern and the feed point are connected. The manufacturing method thereof is also provided. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够保持良好的天线特性的小型化的电子设备及其制造方法。解决方案：电子设备包括：在其外表面具有导电图案并具有第一框架部分的第一模制件; 第二模制件，用第一模制件封闭并具有第二框架部分; 布线板，其具有设置在绝缘片中的连接图案; 具有馈电点的电路板; 以及馈电器，其一端延伸到所述第一框架部分的面向所述第二框架部分的接合表面，并且另一端连接到所述导电图案; 其中连接图案的一端和馈送器的一端相连，连接图案和馈电点的另一端连接。还提供了其制造方法。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008182517A Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：JP2008182517A
公开(公告)日：2008-08-07
申请号：JP2007014724
申请日：2007-01-25
申请人： Toshiba Corp , 株式会社東芝
发明人： HATA YOSHIKAZU , HONDA TOMOKO , HONDA SATOSHI , KUROIWA NOBUYOSHI , NAKAHATA MASAOMI , MORIMOTO ATSUSHI , SATO KOICHI , TSUJIMURA TERUHIRO , TABATA MAKOTO , SAKURAI MINORU , KATO SHOJI
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H05K7/06 , H01Q1/22 , H01Q1/243 , H01Q1/40 , H01Q9/0407
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment that can be made compact and thin while maintaining stable electrical connection. SOLUTION: The electronic equipment is provided with a first molded body made of insulating material, a second molded body made of insulating material to be bound together with the first molded body, a substrate provided with a first conductive pattern and fixed to the first molded body or the second molded body, and a conductive member for connecting a second conductive pattern provided on an outer surface of at least either the first or the second molded body to the first conductive pattern, wherein the conductive member is provided so as to penetrate in a gap of matching faces of the first molded body and the second molded body. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以保持稳定的电连接的可以紧凑和薄的电子设备。解决方案：电子设备设置有由绝缘材料制成的第一成型体，由与第一成型体结合在一起的绝缘材料制成的第二成型体，设置有第一导电图案并固定到第一成型体的基板第一成型体或第二成型体，以及用于将设置在第一或第二成型体的至少任一个的外表面上的第二导电图案与第一导电图案连接的导电部件，其中，导电部件设置成穿过第一成型体和第二成型体的匹配面的间隙。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2010245895A Mobile terminal 审中-公开
标题翻译：移动终端
公开(公告)号：JP2010245895A
公开(公告)日：2010-10-28
申请号：JP2009093330
申请日：2009-04-07
申请人： Toshiba Corp , 株式会社東芝
发明人： IHARA AKIO , SAKURAI MINORU , TABATA MAKOTO
IPC分类号： H01Q1/24 , H01Q1/38 , H01Q21/30 , H04M1/02
CPC分类号： H01Q1/243 , H01Q21/28 , H04W88/02
摘要： PROBLEM TO BE SOLVED: To provide a mobile terminal formed into a structure, which forms a first antenna and a second antenna as separate pieces and stably connects both antennas to a feed point while mounting both antennas to the mobile terminal, and also allows the first antenna to be stably connected to the feed point even while mounting only the first antenna to the mobile terminal by eliminating the second antenna with the same structure.
SOLUTION: In a state that a first case 1 and a second case 20 are fitted to each other, a feed point 3 of a printed board 2, a spring-like first contact 4a of a first antenna 4, a second contact 5a of a second antenna 5, and a sponge 6 are arranged while being pressed overlappingly in a direction vertical to the main face of the first case 1, thereby electrically connecting the feed point 3, the first contact 4a, and the second contact 5a to each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供形成为结构的移动终端，其形成第一天线和第二天线作为分离的部件，并且将两个天线稳定地连接到馈电点，同时将两个天线安装到移动终端，并且还即使在通过消除具有相同结构的第二天线将第一天线安装到移动终端的同时，也允许第一天线稳定地连接到馈电点。解决方案：在第一壳体1和第二壳体20彼此配合的状态下，印刷板2的馈电点3，第一天线4的弹簧状第一触点4a，第二触点 5a的第二天线5和海绵6被布置成在与第一壳体1的主面垂直的方向上重叠地按压，从而将馈电点3，第一接触件4a和第二接触件5a电连接到彼此。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009027019A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2009027019A
公开(公告)日：2009-02-05
申请号：JP2007189686
申请日：2007-07-20
申请人： Toshiba Corp , 株式会社東芝
发明人： KUROIWA NOBUYOSHI , HONDA TOMOKO , HATA YOSHIKAZU , HONDA SATOSHI , MORIMOTO ATSUSHI , NAKAHATA MASAOMI , TSUJIMURA TERUHIRO , SATO KOICHI , SAKURAI MINORU , TABATA MAKOTO , KATO SHOJI
IPC分类号： H05K7/14 , H01Q1/38 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide an electronic device capable of surely conducting a case body outer surface and the inside while keeping excellent appearance.
SOLUTION: The electronic device includes: a first molded body composed of an insulator and provided with a hole part; a second molded body composed of the insulator and including a rib projected from an inner bottom surface closed together with the first molded body; a substrate installed to come into contact with the inner surface of the second molded body and provided with a conducting line; a cylindrical first conductive member inserted to the hole part; a conducting pattern held between the hole part and the first conductive member and fixed; a second conductive member connecting the end on the opposite side of the one in contact with the conducting pattern of the first conductive member and the conducting line; and a screw for fixing the rib from the hole part through the first conductive member.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够可靠地导引壳体外表面和内部同时保持优异外观的电子设备。解决方案：电子设备包括：第一成型体，由绝缘体构成并设有孔部; 第二成型体，由绝缘体构成，包括从与第一成型体封闭的内底面突出的肋; 安装成与第二成型体的内表面接触并设置有导线的基板; 插入孔部的圆筒状的第一导电部件; 固定在所述孔部与所述第一导电部件之间的导电图案; 第二导电构件，其连接与所述第一导电构件的导电图案和所述导电线接触的所述另一侧的端部; 以及用于通过第一导电构件将孔从孔部分固定的螺钉。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008160216A Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：JP2008160216A
公开(公告)日：2008-07-10
申请号：JP2006343485
申请日：2006-12-20
申请人： Toshiba Corp , 株式会社東芝
发明人： NAKAHATA MASAOMI , HONDA TOMOKO , HATA YOSHIKAZU , HONDA SATOSHI , MORIMOTO ATSUSHI , KUROIWA NOBUYOSHI , TSUJIMURA TERUHIRO , SATO KOICHI , SAKURAI MINORU , TABATA MAKOTO , KATO SHOJI
IPC分类号： H01Q1/24 , H01M2/10 , H01Q1/38 , H01Q1/46
CPC分类号： H01Q1/243
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment which can be miniaturized and thinned while securing stable electric connection.
SOLUTION: The electronic equipment is provided with: a first molding composed of an insulator; a second molding which is composed of an insulator and combined with the first molding for seaming; a substrate which has a first conductive pattern and a second conductive pattern, are formed on the outer surface of the first molding, and fixed on the second molding; and conductive pins which is formed so as to be penetrated into the first molding and connects the first conductive pattern and the second conductive pattern.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以在确保稳定的电连接的同时小型化和减薄的电子设备。解决方案：电子设备设有：由绝缘体构成的第一模塑件; 第二模制品，由绝缘体组成并与第一模制件组合以用于缝合; 在第一成型体的外表面上形成具有第一导电图案和第二导电图案的基板，并固定在第二成型体上; 以及形成为穿透到第一模制件中并连接第一导电图案和第二导电图案的导电销。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008159636A Electronic apparatus 有权
标题翻译：电子设备
公开(公告)号：JP2008159636A
公开(公告)日：2008-07-10
申请号：JP2006343486
申请日：2006-12-20
申请人： Toshiba Corp , 株式会社東芝
发明人： HONDA TOMOKO , KUROIWA NOBUYOSHI , NAKAHATA MASAOMI , MORIMOTO ATSUSHI , HONDA SATOSHI , HATA YOSHIKAZU , SATO KOICHI , TSUJIMURA TERUHIRO , TABATA MAKOTO , SAKURAI MINORU , KATO SHOJI
IPC分类号： H05K7/14 , H01L25/00 , H01Q1/24 , H01Q1/38 , H04B1/38 , H04B1/3822
CPC分类号： H01Q9/40 , H01Q9/42 , H01Q21/28 , H05K1/0284 , H05K1/144 , H05K3/325 , H05K2201/048 , H05K2201/0999 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus for reducing a connection space or loading space between a conductor pattern and a substrate while maintaining or improving electrical characteristics. SOLUTION: The electronic apparatus is provided with a casing 10 including conductor patterns 12a to 12c, a substrate 20 provided with a wiring layer 22 at the front surface thereof and fixed to the casing 10, and conductor member 30 for connecting the conductor patterns 12a to 12c and the wiring layer 20. The conductor patterns 12a to 12c are extended over the external front surface 10a and the internal front surface 10c of the casing 10 and the conductor members 12a to 12c are respectively in contact with at least a part of the conductor patterns 12a to 12c extended to the internal surface 10c and the end part of the wiring layer 22. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减小导体图案和基板之间的连接空间或加载空间的电子装置，同时保持或改善电特性。解决方案：电子设备设置有包括导体图案12a至12c的壳体10，在其前表面上设置有布线层22并固定到壳体10的基板20，以及用于连接导体的导体构件30 图案12a至12c和布线层20.导体图案12a至12c在壳体10的外部前表面10a和内部前表面10c上延伸，并且导体构件12a至12c分别与至少一部分的导体图案12a至12c延伸到内表面10c和布线层22的端部。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2010239211A Wireless device 有权
标题翻译：无线设备
公开(公告)号：JP2010239211A
公开(公告)日：2010-10-21
申请号：JP2009082341
申请日：2009-03-30
申请人： Toshiba Corp , 株式会社東芝
发明人： SATO KOICHI , TABATA MAKOTO
IPC分类号： H01Q1/24 , H01Q1/52 , H01Q9/04 , H04M1/02
CPC分类号： H01Q1/243 , G06F1/1626 , G06F1/1698 , H01Q9/0421 , H01Q9/30 , H01Q9/42 , H01Q21/28
摘要： PROBLEM TO BE SOLVED: To provide a wireless device configured so that the characteristic of an antenna of the wireless device in which the area ratio of a touch panel occupied in a casing is small does not deteriorate. SOLUTION: When the wireless device 1 is viewed from the rear surface side, a touch sensor 13 is mounted so as to occupy relatively large area ratio on the front side of the casing 10. A first substrate 15, a battery 16, and a second substrate 18, etc. are mounted near the rear side of the casing 10. A first antenna element 31, a second antenna element 32 are connected to a first feeding point 21, and the second feed point 22 is provided on the first substrate 15, respectively. A third antenna element 33 is connected to a third feed point 23 provided on the second substrate 18. An open terminal of the third antenna element 33, in which voltage with relatively large amplitude is distributed, when power is fed to the third antenna element 33 via the third feeding point 23 is mounted at a position which is not hidden by the touch sensor 13, when the casing 10 is viewed from the direction perpendicular to the front of the casing. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种无线设备，其被配置为使得在壳体中占据的触摸面板的面积比率小的无线设备的天线的特性不会劣化。解决方案：当从后表面侧观察无线设备1时，安装触摸传感器13，以在壳体10的前侧占据相对大的面积比。第一基板15，电池16，并且第二基板18等安装在壳体10的后侧附近。第一天线元件31，第二天线元件32连接到第一馈电点21，第二馈电点22设置在第一馈电点21上。基板15。第三天线元件33连接到设置在第二基板18上的第三馈电点23.当功率被馈送到第三天线元件33时，第三天线元件33的开路端子分布有相对大的振幅的电压当从垂直于壳体前部的方向观察壳体10时，通过第三馈电点23被安装在未被触摸传感器13隐藏的位置。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009021932A Electronic equipment, and manufacturing method thereof 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2009021932A
公开(公告)日：2009-01-29
申请号：JP2007184385
申请日：2007-07-13
申请人： Toshiba Corp , 株式会社東芝
发明人： HONDA SATOSHI , HONDA TOMOKO , KUROIWA NOBUYOSHI , NAKAHATA MASAOMI , MORIMOTO ATSUSHI , HATA YOSHIKAZU , SATO KOICHI , TSUJIMURA TERUHIRO , TABATA MAKOTO , SAKURAI MINORU , KATO SHOJI
IPC分类号： H01Q1/40 , H01Q1/38 , H04M1/02
CPC分类号： H01Q1/243 , H01Q9/0421 , H01Q9/16 , H01Q9/26 , H01Q9/30 , H01Q9/42
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment which can be made compact while keeping good antenna characteristics, and to provide a manufacturing method thereof.
SOLUTION: The electronic equipment includes a first molded body having a concave cross-sectional shape and made of resin, a second molded body which is fit inside the first molded body and has a concave cross-sectional shape and is made of resin, and an antenna pattern held between the first and second molded bodies. Out of the surfaces of the first molded body, the surface not adjacent to the antenna pattern is an external surface. Also provided is a manufacturing method of the electronic equipment.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供可以制造紧凑的电子设备，同时保持良好的天线特性，并提供其制造方法。解决方案：电子设备包括具有凹形截面形状并由树脂制成的第一模制体，第二模制体装配在第一模制体内并且具有凹形横截面形状并由树脂制成以及保持在第一和第二成型体之间的天线图案。在第一成型体的表面之外，与天线图案不相邻的表面是外表面。还提供了一种电子设备的制造方法。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008160215A Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：JP2008160215A
公开(公告)日：2008-07-10
申请号：JP2006343484
申请日：2006-12-20
申请人： Toshiba Corp , 株式会社東芝
发明人： MORIMOTO ATSUSHI , HONDA TOMOKO , KUROIWA NOBUYOSHI , NAKAHATA MASAOMI , HONDA SATOSHI , HATA YOSHIKAZU , SATO KOICHI , TSUJIMURA TERUHIRO , TABATA MAKOTO , SAKURAI MINORU , KATO SHOJI
IPC分类号： H04M1/02 , H01Q1/46
摘要： PROBLEM TO BE SOLVED: To provide electronic equipment for surely performing conduction between the external surface of a casing and the interior while satisfactorily maintaining its appearance.
SOLUTION: This electronic equipment is provided with a first molded body made of an insulator, and including a substrate press part bent from the outside face to the inside and a rib projected from the internal bottom face; a second molded body made of an insulator, and engaged with the first molded body; a substrate equipped with a wiring layer, and fixed to the first molded body; a conductive pattern formed on the external surface of the first molded body; and a first conductive layer formed on the external surface of the first molded body, and connected to the conductive pattern. The first conductive layer is extended between at least the substrate press part and the substrate, and the substrate is pushed against the rib and the substrate press part, and the wiring layer and the conductive pattern are connected through the first conductive layer.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供电子设备，以确保在外壳的外表面与内部之间进行导通，同时令人满意地保持其外观。解决方案：该电子设备设置有由绝缘体制成的第一成型体，并且包括从外表面向内侧弯曲的基板挤压部和从内底面突出的肋; 第二成型体，由绝缘体制成并与第一成型体接合; 配备有布线层的基板，并固定在第一成型体上; 形成在第一成型体的外表面上的导电图案; 以及形成在所述第一成型体的外表面上并与所述导电图案连接的第一导电层。第一导电层在至少基板挤压部和基板之间延伸，并且基板被推压抵靠肋和基板挤压部，并且布线层和导电图案通过第一导电层连接。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2008079201A Electronic device, and manufacturing method thereof 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：JP2008079201A
公开(公告)日：2008-04-03
申请号：JP2006258636
申请日：2006-09-25
申请人： Toshiba Corp , 株式会社東芝
发明人： NAKAHATA MASAOMI , HONDA TOMOKO , HONDA SATOSHI , KUROIWA NOBUYOSHI , HATA YOSHIKAZU , SAKURAI MINORU , TABATA MAKOTO , AMANO TAKASHI , TSUJIMURA TERUHIRO , SATO KOICHI
IPC分类号： H01Q1/38 , H01Q9/16 , H01Q9/30 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To provide an electronic device in which an antenna is disposed efficiently in space, and to provide a manufacturing method thereof.
SOLUTION: An electronic device comprises a support member provided with an antenna element, a lid member fixed to the support member, and a bottom surface member fixed to the support member to face the lid member. Furthermore, in another embodiment of the present invention, a manufacturing method of the electronic device includes the steps of: forming the antenna element on at least one of a first side, second side and inner side surface of the support member by any one of printing, MID molding, insert molding and sheet metal lamination; and fixing the support member, the lid member and the bottom surface member.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种天线在空间中有效地布置的电子设备，并提供其制造方法。解决方案：一种电子设备，包括一个设置有天线元件的支撑元件，固定在该支撑元件上的盖子，以及一个固定在该支撑元件上面对该盖元件的底面元件。此外，在本发明的另一个实施例中，电子设备的制造方法包括以下步骤：通过任何一种打印方式在支撑构件的第一侧面，第二侧面和内侧表面中的至少一个上形成天线元件，MID成型，嵌入成型和钣金层压; 并且固定支撑构件，盖构件和底面构件。版权所有（C）2008，JPO＆INPIT

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