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1. 发明专利

JP2004249589A Copper-molybdenum composite material and heat sink using the same 审中-公开
公开(公告)号：JP2004249589A
公开(公告)日：2004-09-09
申请号：JP2003042435
申请日：2003-02-20
申请人： Toshiba Corp , 株式会社東芝
发明人： NAKAJIMA HITOSHI
IPC分类号： B32B15/01 , H01L23/373 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a copper-molybdenum composite material which enables low-cost manufacture of a component such as a heat sink necessitating heat dissipating properties and which is excellent in flatness and linearity and in workability, causes little nonuniformity in the accuracy of shape and has a high quality, and the heat sink using the same. SOLUTION: This copper-molybdenum composite material is formed by laminating seven or more layers in total of pure copper or an alloy constituted mainly of the copper, and of molybdenum or an alloy constituted mainly of the molybdenum. The thickness of each one of the molybdenum and copper layers is 25% or less of the total plate thickness. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004063132A Electrode lead 有权
公开(公告)号：JP2004063132A
公开(公告)日：2004-02-26
申请号：JP2002216776
申请日：2002-07-25
申请人： Toshiba Corp , 株式会社東芝
发明人： NAKAJIMA HITOSHI , TAKADO TEIJI
IPC分类号： H01B1/02 , H01M2/32
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide an electrode lead having corrosion resistance against electrolyte and excellent electric property capable for a large current, being prevented from generating flash and burr, and capable of improving the sealing property of a sealing part of a laminated sheet while preventing the loss of energy and damage caused by heat generation.
SOLUTION: The electrode lead has a three-layer structure composed of a first, a second, and a third layers, and the second layer as a core material is made of copper or an alloy containing copper as a main component which is excellent in conductivity and relatively cheap. The first and the third layer to be jointed to both surfaces of the second layer is made of a clad material composed of nickel or an alloy containing nickel as the main component with excellent corrosion resistance.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2000077006A Color picture tube 有权
标题翻译：彩色图像管
公开(公告)号：JP2000077006A
公开(公告)日：2000-03-14
申请号：JP23707299
申请日：1999-08-24
申请人： Sony Corp , Toshiba Corp , ソニー株式会社 , 株式会社東芝
发明人： MATSUKI TOSHIHARU , HABU SATORU , NAKAJIMA HITOSHI
IPC分类号： H01J29/02 , H01J31/20
摘要： PROBLEM TO BE SOLVED: To improve color purity and reliabilty of a color picture tube and to reduce manufacturing cost by using a thermal deformation member for an electron tube which can reduce manufacturing cost and improve processability without impairing strength and long-term reliability.
SOLUTION: A thermal deformation section 15b of a frame holder 15 is fixed at its one end to a panel 11 of a color picture tube and at its the other end to a mask frame 14 of a shadow mask 13. The thermal deformation section 15b is composed of a thermal deformation member for an electron tube comprising an intermediate member whose coefficient of thermal expansion is α3(α1>α3>α2) intervened between a high thermal expansion member composed of Fe-Ni-Cr alloy whose coefficient of thermal expansion is α1 and a low thermal expansion member composed of Fe-Ni alloy whose coefficient of thermal expansion is α2. In the thermal deformation member for the electron tube, a board thickness ratio between the high thermal expansion member and the low thermal expansion member is 55:45-45:55, and a board thickness o the intermediate member is within 80% of a total board thickness of the thermal deformation member.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了提高彩色显像管的色纯度和可靠性，并且通过使用电子管的热变形构件来降低制造成本，这可以降低制造成本并且在不损害强度和长期可靠性的情况下提高加工性。解决方案：框架架15的热变形部分15b的一端固定在彩色显象管的面板11上，另一端固定在荫罩13的荫罩框架14上。热变形部分15b是由热膨胀系数为α1的Fe-Ni-Cr合金构成的高热膨胀构件之间插入的热膨胀系数为α3（α1>α3>α2）的中间构件的电子管用热变形构件构成，以及由热膨胀系数为α2的Fe-Ni合金构成的低热膨胀构件。在电子管的热变形构件中，高热膨胀构件和低热膨胀构件之间的板厚比为55:45-45:55，中间构件的板厚度在总热量的80％以内热变形构件的板厚度。

4. 发明专利

JP2960099B2 For tantalum capacitor leads 失效
公开(公告)号：JP2960099B2
公开(公告)日：1999-10-06
申请号：JP6973190
申请日：1990-03-22
申请人：株式会社東芝
发明人： YASUI TAKESHI , NAKAJIMA HITOSHI , HAYASHI KEISUKE
IPC分类号： H01G9/012

5. 发明专利

JPH09274814A GLASS SEALING MEMBER AND GLASS SEALED ELECTRONIC PARTS 失效
公开(公告)号：JPH09274814A
公开(公告)日：1997-10-21
申请号：JP8015296
申请日：1996-04-02
申请人： TOSHIBA CORP , TOSHIBA ELECTRONIC ENG
发明人： NAKAJIMA HITOSHI , YAMAZOE HIROSHI
IPC分类号： H01L23/29 , H01B7/02 , H01L23/31 , H01L29/861
摘要： PROBLEM TO BE SOLVED: To facilitate the sealing of glass by forming a glass sealing member into a plate-shape 7 which is formed by polymerizing a conductive metal and low-expansion metal. SOLUTION: A diode 21 has electrodes 21a in both ends thereof. A glass case 22 formed into a cylindrical shape, of which both ends are opened, houses the diode 21 therein. A cap-shaped glass sealing member 23 is fitted in the openings of the both ends of the glass case 22 so as to be connected to the case 22. An external circuit member is connected to a member 11 made of other conductive metal. The glass sealing member 23 is fitted in the openings of the ends of the glass case 22, and the glass case 22 is heated to a temperature for welding the glass sealing member 23 so as to connect the glass case 22 to the glass sealing member 23.

6. 发明专利

JPH06140539A HEAT SINK AND SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JPH06140539A
公开(公告)日：1994-05-20
申请号：JP28759992
申请日：1992-10-26
申请人： TOSHIBA MATERIAL ENG KK , TOSHIBA CORP
发明人： YAMAZOE HIROSHI , NAKAJIMA HITOSHI
IPC分类号： H01L23/12 , H01L23/373
摘要： PURPOSE:To reduce occurrence of warp caused by resin mold by cladding copper or copper alloy member at a part of a substrate comprising Al or Al alloy abutting on a semiconductor element. CONSTITUTION:A heat sink 10 has a substrate 1 and a copper plate or a copper alloy plate 2. The substrate 1 is formed of an aluminum plate. A recess part 1c is formed at the central part of an upper surface 1a, to which a power IC 3 is fixed. The copper plate 2 is compressed to the recess part. The upper surface of the substrate 1 and the surface of the copper plate 2 form the same plane. The power IC 3 is arranged at the central part of the copper plate 3 and rigidly fixed to the copper plate by the soldering to the copper plate 2 having the excellent wettability with solder metal. The power IC 3 is connected to a lead frame 5 through a bonding wire 4. Therefore, the warp, which is generated in the heat sink 10 when the power IC 3 is molded with resin is less, and the semiconductor device having the high dimensional accuracy can be obtained.

7. 发明专利

JPH03281096A CLAD MATERIAL FOR BRAZING AND PRODUCTION THEREOF 失效
公开(公告)号：JPH03281096A
公开(公告)日：1991-12-11
申请号：JP6973090
申请日：1990-03-22
申请人： TOSHIBA CORP
发明人： YASUI TAKESHI , NAKAJIMA HITOSHI
IPC分类号： B23K20/04 , B23K1/00 , B23K35/22 , B23K35/40 , B23K101/14
摘要： PURPOSE:To integrate a base material and a material to be joined with high joint strength by integrally joining a cladding metal as a brazing martial to the surface of the base material and expelling the diffused layer formed on the joint surfaces. CONSTITUTION:The clad material for brazing is used in order to braze the material to another member via the brazing material. The cladding metal as the brazing material is integrally joined to the surface of the base material of such clad material for brazing and the diffused layer formed on the joint surfaces is substantially expelled. The base material is formed of iron or iron alloy and the brazing material is formed of metals, such as silver, copper and aluminum or the alloys thereof. The base material and the cladding metal as the brazing material are superposed on each other and are subjected to roll press welding at >=50% reduction of sectional area. The man-hours for the assembly of equipment and the man-hours for brazing are drastically decreased in this way.

8. 发明专利

JP2003203622A LEAD MATERIAL INSIDE BATTERY AND BATTERY USING THE SAME 审中-公开
公开(公告)号：JP2003203622A
公开(公告)日：2003-07-18
申请号：JP2002000568
申请日：2002-01-07
申请人： TOSHIBA CORP
发明人： NAKAJIMA HITOSHI
IPC分类号： H01M2/32 , H01M2/26 , H01M10/40
摘要： PROBLEM TO BE SOLVED: To realize compactness and high energy density of a battery by providing a positive electrode lead and a negative electrode lead with excellent electric characteristics capable of passing large current which are free from an edge burr or a ride up and can prevent damages due to energy loss or heat generation. SOLUTION: With the battery provided with a metal can containing electrolyte solution, a power-generating body formed by laminating a positive electrode, a separator and a negative electrode in that order, a positive electrode lead connecting the positive electrode and a positive electrode terminal, and a negative electrode lead connecting the negative electrode and a negative electrode terminal, the positive electrode lead and the negative electrode lead are formed of a clad material which has a plied material formed of an alloy with pure nickel or nickel as a main component integrally bonded to both sides of a core material formed of an alloy with pure copper or copper as a main component. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2002184925A LEAD TERMINAL MEMBER FOR SEMICONDUCTOR MODULE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR MODULE USING THE SAME 失效
公开(公告)号：JP2002184925A
公开(公告)日：2002-06-28
申请号：JP2000377742
申请日：2000-12-12
申请人： TOSHIBA CORP
发明人： NAKAJIMA HITOSHI
IPC分类号： H01L25/07 , H01L23/48 , H01L23/50 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To improve the adhesion strength of Al wire, to suppress the peeling of the surface layer of a bonding part bringing such effect and to more securely prevent disconnection from the connection part of a lead pin and the Al wire in a lead terminal member for semiconductor module. SOLUTION: The lead terminal member for semiconductor module, the Al wire is bonded to an inner side and wiring, a circuit and a terminal are directly solder-connected to an outer side or through a plating layer. The member is provided with a lead terminal main body 2 constituted of Cu or Cu alloy and a bonding part 3 which is partially buried/connected into the lead terminal main body 2 and is constituted of Al or Al alloy whose thickness is not less than 15 μm and which is not more than 50% of the total thickness of the lead terminal member 1. The semiconductor module has the lead pin constituted of the lead terminal member 1.

10. 发明专利

JP2002110136A ELECTRODE TERMINAL MATERIAL AND SECONDARY BATTERY USING IT 失效
公开(公告)号：JP2002110136A
公开(公告)日：2002-04-12
申请号：JP2000302229
申请日：2000-10-02
申请人： TOSHIBA CORP
发明人： NAKAJIMA HITOSHI
IPC分类号： H01R13/03 , H01M2/30
摘要： PROBLEM TO BE SOLVED: To provide an electrode terminal material capable of suppressing a contact failure caused by impact and like. SOLUTION: The electrode terminal material is provided which comprises a contact surface that contacts an external terminal for electrical continuity with it. The electrode terminal material comprises nickel of purity 98% or more while a surface roughness Ra of the contact surface being 0.12 μm or less. At least a part of the contact surface is plated with what comprises gold as a main component, with thickness 0.1-5 μm.

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