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1. 发明专利

JP2011103438A Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium having substrate liquid processing program stored therein 有权
标题翻译：基板液体处理装置，基板液体处理方法以及具有基板液化处理程序的计算机可读存储介质
公开(公告)号：JP2011103438A
公开(公告)日：2011-05-26
申请号：JP2010180668
申请日：2010-08-12
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TANAKA YUJI , MINAMI TERUOMI , KAWABUCHI YOSUKE , ITO KIKO , KAMIMURA FUMIHIRO , YABUTA TAKASHI , KOSAI KAZUKI , UNO TAKASHI , SEKIGUCHI KENJI , FUJII YASUSHI
IPC分类号： H01L21/304 , H01L21/306
CPC分类号： H01L21/02057 , H01L21/67051
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of electrostatic breakdown caused by the discharge of electric charges accumulated in a substrate. SOLUTION: The invention relates to a substrate liquid processing apparatus (1), a substrate liquid processing method for processing the substrate (2) with a liquid, and a computer-readable storage medium (48) having a substrate liquid processing program stored therein. Prior to processing a circuit-forming surface of the substrate (2) with the substrate processing chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate (2) by an anti-static liquid, thereby emitting the electric charges on the substrate (2). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止由堆积在基板中的电荷的放电引起的静电破坏的发生。解决方案：本发明涉及一种基板液体处理装置（1），一种用液体处理基板（2）的基板液体处理方法，以及具有基板液体处理程序的计算机可读存储介质（48）存储在其中。在利用基板处理化学液体处理基板（2）的电路形成表面之前，基板液体处理装置对与基板（2）的电路形成表面相反的表面进行防静电处理防静电液体，从而在基板（2）上发射电荷。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2008041794A Method and device for blending chemical 有权
标题翻译：用于混合化学品的方法和装置
公开(公告)号：JP2008041794A
公开(公告)日：2008-02-21
申请号：JP2006211732
申请日：2006-08-03
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TANAKA YUJI , HIROKI KOKICHI , KAMIMURA FUMIHIRO
IPC分类号： H01L21/304 , C11D7/08 , C11D7/18 , C11D11/00
CPC分类号： B01F3/088 , B01F3/0861 , B01F3/0865 , B01F5/10 , B01F15/00253 , B01F15/00331 , B01F15/00396 , B01F15/0243 , B01F15/0412 , B01F15/0437 , B01F15/06 , B01F2015/062 , B01F2215/0036 , B01J19/24 , B01J2219/00103 , B01J2219/24 , C01B15/08 , C11D3/3947 , C11D11/0047 , H01L21/67057
摘要： PROBLEM TO BE SOLVED: To provide a chemical blending method and device for forming a Caro's acid, which is effective in removing resist from a substrate sufficiently when a sulphuric acid and a hydrogen peroxide solution are mixed together. SOLUTION: First of all, an inner tank 10 is filled up with a sulphuric acid, and an outer tank 12 is provided so as to make the sulphuric acid overflowing the inner tank 10 flow into the outer tank 12. Then, a hydrogen peroxide solution is supplied to the inner tank 10 to flow into the outer tank 12, and two kinds of liquid, hydrogen peroxide solution and sulphuric acid, are kept in the outer tank 12. A return pump 16 is actuated just when hydrogen peroxide solution is made to flow in. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于形成Caro酸的化学共混方法和装置，当将硫酸和过氧化氢溶液混合在一起时，其可以有效地从基板上去除抗蚀剂。解决方案：首先，用硫酸填充内罐10，并且设置外罐12，以使溢出内罐10的硫酸流入外罐12.然后，过氧化氢溶液被供应到内罐10以流入外罐12中，并且两种液体，过氧化氢溶液和硫酸被保存在外罐12中。回流泵16刚好在过氧化氢溶液进入。（C）2008，JPO＆INPIT

3. 发明专利

JP2011009300A Apparatus and method for processing liquid 有权
标题翻译：用于处理液体的装置和方法
公开(公告)号：JP2011009300A
公开(公告)日：2011-01-13
申请号：JP2009149033
申请日：2009-06-23
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： MINAMI TERUOMI , KAMIMURA FUMIHIRO , KOSAI KAZUKI , YABUTA TAKASHI , YOKOMIZO KENJI , MIZOTA SHOGO
IPC分类号： H01L21/306 , H01L21/027 , H01L21/304 , H01L21/768
CPC分类号： H01L21/67051 , H01L21/6708
摘要： PROBLEM TO BE SOLVED: To provide a liquid processing apparatus or the like for removing a film from a surface of a substrate with the use of a new method.SOLUTION: In a liquid processing apparatus 3 for removing a first film and a second film from a substrate on which the second film is formed on the upper layer of the first film, a first chemical supply part 51 supplies the first chemical for dissolving the first film to the substrate W, a second chemical supply part 51 supplies a second chemical for reducing the strength of the second film, and a fluid supply part 52 serving also as an impact giving part gives a physical impact to the second film to break the second film and supplies a fluid for washing away fragments of the second film having been broken. A control unit 7 controls the respective parts such that, after the second chemical has been supplied and then the fluid has been supplied from the fluid supply part 52, the first chemical is supplied.
摘要翻译：要解决的问题：提供一种液体处理装置等，用于利用新的方法从基板的表面除去膜。解决方案：在用于从第一膜和第二膜移除的液体处理装置3中，在第一膜的上层上形成有第二膜的基板，第一化学品供给部51将第一膜溶解的第一化学品供给到基板W，第二化学品供给部51供给用于还原的第二化学品第二膜的强度以及也用作冲击赋予部的流体供给部52对第二膜产生物理冲击，从而破坏第二膜，并且供给用于洗涤已经破裂的第二膜的碎片的流体。控制单元7控制各部分，使得在供应第二化学品之后，然后从流体供应部分52供应流体，供应第一化学品。

4. 发明专利

JP2014103297A Substrate processing apparatus and substrate processing method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2014103297A
公开(公告)日：2014-06-05
申请号：JP2012255056
申请日：2012-11-21
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KIYOSE HIROMI , KAMIMURA FUMIHIRO , AZUMA AKIHIRO
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To accurately control a temperature of a process liquid for processing a substrate.SOLUTION: A substrate processing apparatus (1) of the invention processes a substrate (2) with a process liquid heated to a predetermined temperature and comprises: a container (a storage tank 8, a heating tank 22) which stores the process liquid; process liquid heating means (6) where a heater (34) is provided on a heating wall (33) formed at the container, the process liquid heating means (6) which heats the process liquid with the heater (34) through the heating wall (33); a temperature control sensor control (36) which is provided on the heating wall (33) and measures a temperature of the heating wall (33); and control means (7) which controls the process liquid heating means (6) on the basis of a temperature measured by the temperature control sensor (36). The control means (7) controls the process liquid heating means (6) on the basis of the temperature of the heating wall (33) measured by the temperature control sensor (36).
摘要翻译：要解决的问题：精确地控制用于处理基板的处理液的温度。解决方案：本发明的基板处理装置（1）用加热到预定温度的处理液处理基板（2），并包括：储存处理液的容器（储罐8，加热槽22）处理液体加热装置（6），其中加热器（34）设置在形成在容器上的加热壁（33）上，处理液体加热装置（6）通过加热壁（34）加热加工液（33）; 温度控制传感器控制器（36），设置在加热壁（33）上并测量加热壁（33）的温度; 以及基于由温度控制传感器（36）测量的温度来控制处理液体加热装置（6）的控制装置（7）。控制装置（7）基于由温度控制传感器（36）测量的加热壁（33）的温度控制处理液体加热装置（6）。

5. 发明专利

JP2013093478A Substrate processing device, substrate processing method, and computer readable storage medium storing substrate processing program 有权
标题翻译：基板处理装置，基板处理方法和计算机可读存储介质存储基板处理程序
公开(公告)号：JP2013093478A
公开(公告)日：2013-05-16
申请号：JP2011235563
申请日：2011-10-27
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： TANAKA YUJI , MOMOTAKE HIRONOBU , UNO TAKASHI , KAMIMURA FUMIHIRO
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To prevent an increase in treatment liquid concentration due to treatment liquid replenishment.SOLUTION: A substrate processing device (1) for adjusting treatment liquid concentration to saturation concentration at a preset temperature by boiling the treatment liquid obtained by diluting the chemical with a dilution liquid at the preset temperature and processing a substrate by immersing it in the treatment liquid comprises: a processing tank (2) for processing a substrate (10) with the treatment liquid; treatment liquid heating means (5) for heating the treatment liquid accumulated in the processing tank (2) to the preset temperature; treatment liquid discharge means (6) for discharging the treatment liquid from the processing tank (2); treatment liquid replenishment means (7) for replenishing the processing tank (2) with the treatment liquid; preset temperature changing means (8) for changing the preset temperature; and control means (9) for controlling the treatment liquid discharge means (6) and the treatment liquid replenishment means (7). The control means (9) controls the treatment liquid so that the treatment liquid discharge means (6) discharges a predetermined amount of the treatment liquid from the processing tank (2) and the treatment liquid replenishment means (7) replenishes the processing tank (2) with the treatment liquid of saturation concentration at the preset temperature changed by the preset temperature changing means (8).
摘要翻译：要解决的问题：为了防止由于处理液体补充而导致的处理液浓度的增加。解决方案：一种基板处理装置（1），用于通过将通过在预设温度下稀释化学品而获得的处理液通过将处理液浓度浸入其中的浓度来调节处理液浓度至饱和浓度处理液包括：用处理液处理基板（10）的处理槽（2）; 处理液加热装置（5），用于将积存在处理罐（2）中的处理液体加热到预设温度; 处理液排出装置（6），用于从处理罐（2）排出处理液; 处理液补充装置（7），用于用处理液补充处理罐（2）; 用于改变预置温度的预置温度改变装置（8）以及用于控制处理液排出装置（6）和处理液补充装置（7）的控制装置（9）。控制装置（9）控制处理液，使得处理液排出装置（6）从处理罐（2）排放预定量的处理液，并且处理液补充装置（7）补充处理槽（2）），预置温度改变装置（8）改变了预设温度下的饱和浓度处理液。版权所有（C）2013，JPO＆INPIT

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