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    • 2. 发明专利
    • Process for manfacturing multilayer ceramic electronic component
    • 制造多层陶瓷电子元件的工艺
    • JP2007288145A
    • 2007-11-01
    • JP2007032735
    • 2007-02-13
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMINAKANO YUKIE
    • H01G4/12H01G4/30
    • PROBLEM TO BE SOLVED: To enhance the yield even in a case where thinning and multilayering of a dielectric layer have progressed without causing increase in material cost, fall of manufacturing efficiency or degradation in characteristics.
      SOLUTION: A multilayer ceramic electronic component with a dielectric layer and an electrode layer laminated alternately is manufactured by laminating an interior green sheet containing dielectric powder and an electrode precursor layer containing a conductive material alternately to form an interior. Then an exterior green sheet is laminated on the opposite sides of the interior in the laminating direction, they are burnt, and dielectric powder is added to the electrode precursor layer. It is assumed that the mean particle diameter of the dielectric powder contained in the interior green sheet is Ra, and the mean particle diameter of the dielectric powder added to the electrode precursor layer is Rb. Consequently, following relation is set; Rb/Ra≤1/2, and dielectric powder similar to that of the electrode precursor layer is also added to the exterior green sheet. Preferably, the dielectric powder similar to that of the electrode precursor layer is added to the exterior green sheet by 0.1 to 20 mass%.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:即使在介电层的薄化和多层化进行而不引起材料成本增加,制造效率下降或特性劣化的情况下,也提高产量。 解决方案:通过层压含有电介质粉末的内部生片和包含导电材料的电极前体层以交替形成内部,制造具有电介质层和交替层叠的电极层的多层陶瓷电子部件。 然后,在层叠方向的内侧的相对侧层叠外部生片,将其烧成,将电介质粉末添加到电极前体层。 假设内部生片中包含的电介质粉末的平均粒径为Ra,添加到电极前体层的电介质粉末的平均粒径为Rb。 因此,设定以下关系: Rb /Ra≤1/ 2,并且与电极前体层类似的电介质粉末也加入到外部生片中。 优选将电极前体层的电介质粉末与外部生片相加0.1〜20质量%。 版权所有(C)2008,JPO&INPIT
    • 3. 发明专利
    • Laminate ceramic electronic component, and manufacturing method thereof
    • 层压陶瓷电子元件及其制造方法
    • JP2007258279A
    • 2007-10-04
    • JP2006077744
    • 2006-03-20
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMINAKANO YUKIE
    • H01G4/12H01G4/30
    • PROBLEM TO BE SOLVED: To improve a yield by establishing compatibility between suppression of non-lamination defect and reduction of short circuit failure in a laminate and suppressing the occurrence of delamination defect on an interface between an exterior portion and interior portion in a baking process, even if a dielectric layer is further thinned and multilayerd. SOLUTION: A laminate ceramic electronic component has the interior portion 8 formed by alternately laminating the dielectric layer 2 and an electrode layer 3, and an exterior dielectric layer 6 arranged on both sides of the laminate direction of the interior portion 8. In the electronic component, where the width of a widest electrode layer 3 of the electrode layer 3 is Wf 1 and the width of a narrowest electrode layer 3 is Wf 2 , 1.00 1 /Wf 2 1 is Tf 1 and the thickness of a dielectric layer 2 adjacent to the electrode layer 3 having the width Wf 2 is Tf 2 , 0.85 1 /Tf 2 COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:通过建立抑制非层压缺陷和减少层压体中的短路故障之间的相容性来提高产量,并且抑制层压体中的外部和内部之间的界面上的分层缺陷的发生 即使电介质层进一步薄化和多层化, 解决方案:层压陶瓷电子部件具有通过交替层叠电介质层2和电极层3而形成的内部部分8和布置在内部部分8的层叠方向两侧的外部电介质层6.在 其中电极层3的最宽电极层3的宽度为Wf 1 的电子部件和最窄电极层3的宽度为Wf 2 Wf 1 / Wf 2 <1.23,其中与电极层3相邻的具有宽度Wf 1 的电介质层2的厚度为 Tf 1 ,与电极层3相邻的电介质层2的宽度Wf 2 的厚度为Tf 2 ,0.85 < SB> 1 / TF 2 <1.15。 版权所有(C)2008,JPO&INPIT
    • 5. 发明专利
    • Resistor paste, resistor and electronic component
    • 电阻浆,电阻和电子元件
    • JP2006261244A
    • 2006-09-28
    • JP2005073938
    • 2005-03-15
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01C7/00C03C8/16H01C17/06
    • C03C8/00C03C3/064
    • PROBLEM TO BE SOLVED: To satisfy both the temperature characteristics (TCR) and the withstand voltage characteristics (STOL) of resistance, and to enhance reliability of thermal stability, heat cycle, and the like. SOLUTION: The resistor paste is produced by dispersing a conductive material, a glass composition, and an additive into an organic vehicle wherein the additive contains a composite oxide represented by AX 2 O 4 (in the formula, A is at least one selected from Mg, Ca, Sr, and Ba, and X is at least one selected from trivalent elements). X is at least one selected from Al, In, Fe, Sc, Y, and elements of element number 57-71. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了满足电阻的温度特性(TCR)和耐电压特性(STOL),并且提高热稳定性,热循环等的可靠性。 解决方案:电阻浆料是通过将导电材料,玻璃组合物和添加剂分散在有机载体中而制备的,其中添加剂含有由AX O 4表示的复合氧化物 (式中,A为选自Mg,Ca,Sr和Ba中的至少一种,X为选自三价元素中的至少一种)。 X是选自Al,In,Fe,Sc,Y和元素号57-71的元素中的至少一种。 版权所有(C)2006,JPO&NCIPI
    • 6. 发明专利
    • Resistor paste, resistor and electronic component
    • 电阻浆,电阻和电子元件
    • JP2006165348A
    • 2006-06-22
    • JP2004355970
    • 2004-12-08
    • Tdk CorpTdk株式会社
    • TANAKA HIROBUMIIGARASHI KATSUHIKO
    • H01C7/00
    • PROBLEM TO BE SOLVED: To realize a resistor which is Pb-free, excellent in TCR or STOL and has small variation in resistance value. SOLUTION: A resistor paste contains a substantially lead-free conductive material, a glass composite and an additive, wherein these are dispersed in an organic vehicle. As the additive, the resistor paste contains a composite oxide containing two kinds of alkali-earth metal elements and titanium. The composite oxide can be represented by a general formula ATiO 3 (where A is the alkali-earth metal element). In this general formula, the alkali-earth metal element A is two or more kinds selected from Mg, Ca, Sr and Ba. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了实现无铅的电阻器,在TCR或STOL中具有优异的电阻值变化小。 解决方案:电阻浆料包含基本上无铅的导电材料,玻璃复合材料和添加剂,其中它们分散在有机载体中。 作为添加剂,电阻浆料含有含有两种碱土类金属元素和钛的复合氧化物。 复合氧化物可以由通式ATiO 3 SB 3表示(其中A是碱土金属元素)。 在该通式中,碱土金属元素A为选自Mg,Ca,Sr和Ba中的两种以上。 版权所有(C)2006,JPO&NCIPI
    • 7. 发明专利
    • Resistor paste and resistor using the same
    • 使用该电阻的电阻和电阻
    • JP2005244117A
    • 2005-09-08
    • JP2004055275
    • 2004-02-27
    • Tdk CorpTdk株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMI
    • H01C7/00
    • PROBLEM TO BE SOLVED: To reduce variations in resistance by suppressing sintering by the contact of noble metal particles for controlling to a desired resistance. SOLUTION: The resistor paste contains an inorganic component. The resistor paste contains a noble metal particle as the inorganic component. The surface of the noble metal particle is covered with a coupling agent. The noble metal particle is made of at least one type selected from Ag, Au, Pt, Pd, Ru, Rh, and Ir. The coupling agent is at least one type selected from a silane-based coupling agent, a titanate-based coupling agent, and an aluminum-based coupling agent. The resistor paste contains RuO 2 as a conductive material. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:通过抑制由用于控制的贵金属微粒接触到期望电阻的烧结来减小电阻的变化。 电解质浆料含有无机成分。 电阻浆料含有作为无机成分的贵金属粒子。 贵金属颗粒的表面被偶联剂覆盖。 贵金属颗粒由选自Ag,Au,Pt,Pd,Ru,Rh和Ir中的至少一种形成。 偶联剂为选自硅烷系偶联剂,钛酸酯类偶联剂和铝系偶联剂中的至少一种。 电阻浆料含有RuO 2 作为导电材料。 版权所有(C)2005,JPO&NCIPI
    • 9. 发明专利
    • Thick-film structure, paste therefor, and method for manufacturing the thick-film structure
    • 厚膜结构及其制造方法及制造薄膜结构的方法
    • JP2005244113A
    • 2005-09-08
    • JP2004055254
    • 2004-02-27
    • Tdk CorpTdk株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMI
    • H01C17/06H01C7/00
    • PROBLEM TO BE SOLVED: To provide a thick-film structure having improved resistance, its temperature characteristics (TCR), C/V values, and the like, by optimizing the dispersed state of conductor constituents and semiconductor constituents. SOLUTION: In the thick-film structure, a conductive constituent and further a semiconductor constituent as needed are dispersed into an insulator constituent. The distance between the conductive constituents, and that between the conductive constituent and the semiconductor constituent are 5nm or smaller. When observing the section of the thick-film structure, the area ratio in which the conductive and semiconductor constituents in the insulator constituent are added should become 5%-70% of the total area. The ratio D/d of an average diameter (d) of the conductive constituent to that D of the semiconductor constituent is set to 2-400. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:通过优化导体成分和半导体成分的分散状态,提供具有改进的电阻,其温度特性(TCR),C / V值等的厚膜结构。 解决方案:在厚膜结构中,根据需要,导电成分和另外的半导体成分分散在绝缘体成分中。 导电成分与导电性成分与半导体成分之间的距离为5nm以下。 当观察厚膜结构的部分时,添加绝缘体组分中的导电和半导体组分的面积比应该占总面积的5%-70%。 导电成分与半导体成分的D的平均直径(d)的比D / d为2-400。 版权所有(C)2005,JPO&NCIPI
    • 10. 发明专利
    • Thick film resistor and its production process, thick film resistor paste and its production process
    • 厚膜电阻及其生产工艺,厚膜电阻及其生产工艺
    • JP2005209740A
    • 2005-08-04
    • JP2004012477
    • 2004-01-20
    • Tdk CorpTdk株式会社
    • IGARASHI KATSUHIKOTANAKA HIROBUMI
    • H05K1/16C03C8/04C03C8/08C03C8/12H01C7/00H01C17/06
    • PROBLEM TO BE SOLVED: To provide a highly reliable lead-free high resistance thick film resistor exhibiting excellent withstand voltage characteristics. SOLUTION: The thick film resistor containing a glass composition and RuO 2 as a conductive material is produced by calcinating them on a substrate. Lattice constant of contained RuO 2 on the a-axis and b-axis is between 4.4919-4.5000 Å. Since lattice constant of RuO 2 on the a-axis and b-axis is set within a predetermined range, withstand voltage characteristics of the thick film resistor are enhanced greatly. When such a thick film resistor is formed, thick film resistor paste containing RuO 2 having a lattice constant on the a-axis and b-axis between 4.4919-4.4994 Å is employed. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供具有优异耐压特性的高可靠性无铅高电阻厚膜电阻器。

      解决方案:含有玻璃组合物的厚膜电阻器和作为导电材料的RuO 2 通过在基底上煅烧而制备。 在a轴和b轴上包含的RuO 2 的晶格常数在4.4919-4.5000之间。 由于在a轴和b轴上的RuO 2 的晶格常数设定在预定范围内,所以厚膜电阻器的耐电压特性被大大提高。 当形成这样的厚膜电阻器时,使用含有在a轴上的晶格常数和b轴在4.4919-4.4994之间的RuO 2 的厚膜电阻膏。 版权所有(C)2005,JPO&NCIPI