专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005256035A Plating method for electronic components and member for mask used for the same 有权
标题翻译：用于电子元件和用于其的掩模用构件的镀层方法
公开(公告)号：JP2005256035A
公开(公告)日：2005-09-22
申请号：JP2004066612
申请日：2004-03-10
申请人： Tdk Corp , Tdk株式会社
发明人： SATO HIROSHI , MORI KANEO , YANO KENZO , NARISAWA YUKI
IPC分类号： C23C18/06
摘要： PROBLEM TO BE SOLVED: To provide a plating method for electronic components having excellent packaging strength and component destruction strength and a member for a mask used for the same relating to a plating method for electronic components used for portable equipment, such as personal computers, digital video camera (DVC) equipment, digital still camera (DSC) equipment, mini-disk (MD) equipment, and mobile communication equipment and a member for a mask used for the same.
SOLUTION: An internal electrode 11 is formed by inserting a ferrite core 17b into a hole 21 disposed at the member 19 for the mask formed of an elastic body to immerse the core in the plating liquid, and plating a collar part 17a of the ferrite core 17b not in contact with the member 19 for the mask with the member 19 for the mask as a mask by an electroless plating method.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的包装强度和组分破坏强度的电子部件的电镀方法和用于与用于便携式设备的电子部件的电镀方法相同的掩模用部件，例如个人计算机，数字摄像机（DVC）设备，数码相机（DSC）设备，微型磁盘（MD）设备和移动通信设备以及用于其的面罩的成员。解决方案：通过将铁氧体磁芯17b插入设置在用于由弹性体形成的掩模的构件19上的孔21中以将芯浸入电镀液中，并且将铁氧体磁芯17b不与用于掩模的构件19接触，其中掩模用构件19通过化学镀方法作为掩模。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005042140A Method and apparatus for barrel plating 有权
标题翻译：棒材镀层的方法与装置
公开(公告)号：JP2005042140A
公开(公告)日：2005-02-17
申请号：JP2003200918
申请日：2003-07-24
申请人： Tdk Corp , Tdk株式会社
发明人： MORI KANEO , SATO DAIKI , SAKURAI TAKASHI , KONNO MASAHIKO
IPC分类号： C25D17/20 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To secure the thickness uniformity of a plated film and reduce a poor appearance, by devising a cross sectional shape of a cathode body and thereby inhibiting the reduction of the flowability and the mixing rate of chips.
SOLUTION: A barrel plating method comprises arranging the main part of an electrode body 51 of a cathode in a barrel 40, using a barrel unit having a freely rotatable barrel body 40, accommodating a chip component group 10 in the barrel body, moving the chip component group with respect to the electrode body 51 by rotating the barrel body 40. The electrode body 51 has a horizontal section 52 parallel to the rotation center axis of the barrel body and a vertical section 53, wherein the cross sectional area of the vertical section 53 is formed smaller than that of the horizontal section 52, and the horizontal section 52 has a cross sectional shape which has the thickness in the direction perpendicular to the moving direction of the chip component group smaller than the width in the moving direction, and which has a round tip in a direction against the flow of the chip component group.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过设计阴极体的横截面形状，从而抑制芯片的流动性和混合速率的降低，可以确保镀膜的厚度均匀性，减少外观差。解决方案：滚镀方法包括使用具有可自由旋转的筒体40的筒体单元将阴极的电极体51的主要部分设置在筒体40中，筒体40容纳筒体中的芯片部件组10，通过旋转筒体40使芯片组件相对于电极体51移动。电极体51具有与筒体的旋转中心轴线平行的水平部分52和垂直部分53，其中横截面积垂直部分53形成为小于水平部分52的垂直部分53，并且水平部分52具有与芯片部件组的移动方向垂直的方向上的厚度小于移动方向上的宽度的横截面形状并且在朝向芯片部件组的流动的方向上具有圆形尖端。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004250716A Barrel plating method and apparatus 审中-公开
标题翻译： BARREL镀层方法和装置
公开(公告)号：JP2004250716A
公开(公告)日：2004-09-09
申请号：JP2003039104
申请日：2003-02-18
申请人： Tdk Corp , Tdk株式会社
发明人： MORI KANEO , ONODERA AKIRA , SATO DAIKI , SAKURAI TAKASHI
IPC分类号： C25D17/20 , C25D21/00
摘要： PROBLEM TO BE SOLVED: To perform a plating treatment good in yield and reliability and capable of improving the uniformity of plating film thicknesses of chip parts and eliminating the occurrence of a so-called "carbon trumpet phenomenon of plating" on the electrode surface in a barrel cylindrical member.
SOLUTION: A plurality of electrode bodies 60 are disposed within the barrel cylindrical member 40 having a nonconductive internal surface in the positions parallel to a horizontal central axis of rotation of the barrel cylindrical member 40 and offcentered from the central axis of rotation and a barrel unit 30 freely rotatably having the barrel cylindrical member 40 is used. Chip part groups are housed in the barrel cylindrical member 40 and the electrode bodies 60 are rotated together with the barrel cylindrical member 40 and are moved in the chip part groups. Electricity preferably fed only to the electrode bodies 60 passing he region where the chip part groups are stored among the plurality of the electrode bodies.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了进行良好的成品率和可靠性的电镀处理，能够提高芯片部件的电镀膜厚度的均匀性，并且消除了在电极上发生所谓的“电镀碳小喇叭现象” 表面在桶形圆柱形构件中。解决方案：多个电极体60设置在筒状圆筒形构件40内，该圆筒形构件40具有不平行于圆筒形圆柱形构件40的水平中心旋转轴线并且偏离中心旋转轴线偏离的位置的非导电内部表面，使用可自由旋转地具有筒形圆筒形构件40的圆筒单元30。芯片部分组被容纳在筒形圆筒形构件40中，并且电极体60与圆筒形构件40一起旋转并且在芯片部件组中移动。优选仅将电流馈送到多个电极体之间通过存储芯片部分组的区域的电极体60。版权所有（C）2004，JPO＆NCIPI

4. 发明专利

JP2005327876A Coil component and its manufacturing method 审中-公开
标题翻译：线圈组件及其制造方法
公开(公告)号：JP2005327876A
公开(公告)日：2005-11-24
申请号：JP2004144091
申请日：2004-05-13
申请人： Tdk Corp , Tdk株式会社
发明人： SATO HIROSHI , MORI KANEO , YANO KENZO , NARISAWA YUKI
IPC分类号： H01F41/04 , H01F17/00 , H01F27/29
摘要： PROBLEM TO BE SOLVED: To provide a coil component in which a height is lowered and the deterioration of magnetic characteristics can be suppressed, and to provide its manufacturing method.
SOLUTION: The coil component 1 is provided with a core 13, a winding wire 21, an internal electrode layer 23, an exterior resin 25, and an external electrode layer 11. The core 13 is provided with a winding core 15 and a pair of flanges 17, and the winding wire 21 is wound around the winding core 15. The internal electrode layer 23 is formed so as to cover the end face 17a and peripheral side face 17b of the flange 17 and the end of the winding wire 21 is connected. The exterior resin 25 is formed so as to cover the winding wire 21 and a part formed on the peripheral side face 17b of the internal electrode layer 23. The external electrode layer 11 includes a lower layer electrode layer 11a and an upper layer electrode layer 11b. The lower layer electrode layer 11a is formed so as to cover the exposed part of the internal electrode layer 23, and the end of the exterior resin part 25. The upper layer electrode layer 11b is formed so as to cover the exposed part of the lower layer electrode layer 11a.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供高度降低的线圈部件，并且可以抑制磁特性的劣化，并提供其制造方法。解决方案：线圈部件1设置有芯13，绕组线21，内部电极层23，外部树脂25和外部电极层11.芯部13设置有绕组芯15和一对凸缘17和绕组21卷绕在卷绕芯15上。内部电极层23形成为覆盖凸缘17的端面17a和周边侧面17b以及绕组线的端部 21连接。外部树脂25形成为覆盖绕组线21和形成在内部电极层23的周边侧面17b上的部分。外部电极层11包括下层电极层11a和上层电极层11b 。下层电极层11a形成为覆盖内部电极层23的露出部分和外部树脂部分25的端部。上层电极层11b形成为覆盖下部电极层的暴露部分层电极层11a。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2002045802A CHIP TYPE ELECTRONIC COMPONENT SEPARATING, WASHING AND DRYING DEVICE 失效
公开(公告)号：JP2002045802A
公开(公告)日：2002-02-12
申请号：JP2000239497
申请日：2000-08-08
申请人： TDK CORP , IMAIZUMI TEKKOSHO KK
发明人： MORI KANEO , ONODERA AKIRA , SAKURAI TAKASHI , HIRAKAWA YOSHIHIRO
IPC分类号： B08B3/02 , B08B3/12 , C23G3/00 , C25D17/00 , F26B21/00
摘要： PROBLEM TO BE SOLVED: To continuously and efficiently perform the operation of transferring a chip component and a medium from a barrel to a different container, then separating the chip component and the medium while continuously and linearly carrying the container and washing and drying the chip component. SOLUTION: This device is provided with the container 10 provided with a mesh pot for housing the chip type electronic component and the medium, carrying chains 7A and 7B for carrying the container in a fixed direction and a medium separation part 30 for separating the medium inside the container, an ultrasonic washing part 40 for ultrasonically washing the chip type electronic component inside the container, a pure water rinsing part 50 for rinsing the chip type electronic component inside the container with pure water, and a drying part 60 for drying the chip type electronic component inside the container successively in the direction of carrying the container on the carrying chains 7A and 7B.

6. 发明专利

JPH0774570A ELECTRONIC PART AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0774570A
公开(公告)日：1995-03-17
申请号：JP21591193
申请日：1993-08-31
申请人： TDK CORP
发明人： TANIGUCHI MASAAKI , SASAKI SATORU , KONNO HISAO , MORI KANEO
IPC分类号： H03H3/02 , H03H3/04 , H03H9/17
摘要： PURPOSE:To provide electronic parts with improved reliability for which no fear for thermal characteristic deterioration is present. CONSTITUTION:This electronic part 1 is provided with a piezoelectric substrate 2, first electrode layers 3a and 3b whose thickness is 0.1-0.5mum formed on the periphery of the piezoelectric substrate 2 by a sputtering processing and second electrode layers 4a and 4b for setting a frequency formed on the periphery of the first electrode layers 3a and 3b by electrolytic copper plating. By the constitution, the reliability is improved and also thermal deterioration can be prevented.

7. 发明专利

JPH02185004A PERMANENT MAGNET 失效
公开(公告)号：JPH02185004A
公开(公告)日：1990-07-19
申请号：JP556389
申请日：1989-01-12
申请人： TDK CORP
发明人： SHINOURA OSAMU , MIYASHITA MASATAKA , MORI KANEO
IPC分类号： C22B7/00 , C22C38/00 , C23C18/28 , C25D7/00 , H01F7/02
摘要： PURPOSE:To obtain a subject permanent magnet having a full covering property while being excellent in an anticorrosion property by laminating a protection layer having an electroplating layer and an electroless plating layer on the surface. CONSTITUTION:In a permanent magnet containing R (R denotes one kind or more of rare earth elements including Y), Fe and B while being provided with a protection layer on the surface of the permanent magnet material having substantially a tetragonal system main phase, unevenness is formed on the surface of the permanent magnet material while being provided with the protection layer having a metal-plated layer formed by metal plating and an electroless lating layer formed by electroless plating on this permanent magnet material surface where unevenness is formed. Thereby, the permanent magnet having a full covering property and being in a anticorrosion property can be obtained.

8. 发明专利

JPH02130002A ELECTRODE FORMING METHOD FOR FERROELECTRIC RESONATOR FOR HIGH FREQUENCY 失效
公开(公告)号：JPH02130002A
公开(公告)日：1990-05-18
申请号：JP28411488
申请日：1988-11-09
申请人： TDK CORP
发明人： KIKUCHI TATSUYA , TANIGUCHI MASAAKI , MORI KANEO , YAHAGI MASAHIRO , SHIKAUCHI SHINICHI
IPC分类号： H01G4/12 , H01G4/012 , H01P7/04 , H01P11/00
摘要： PURPOSE:To ensure the baking of copper coat, and to raise a Q-value by forming the copper coat on ferroelectric ceramic for high frequency by electroless plating, and turning this copper coat into an electrode by heat- treating it in the atmosphere consisting of nitrogen and hydrogen of specified oxygen partial pressure. CONSTITUTION:The copper coats 3 to 5 are formed on the ferroelectric ceramic for high frequency by the electroless plating, and these copper coats 3 to 5 are turned in the electrodes by heat-treating them at temperature from 500 deg.C to 700 deg.C in the mixture gas atmosphere consisting of nitrogen and hydrogen of the oxygen partial pressure from 10 ppm to 10 ppm. The baking of a Cu electrode is executed in such a way in the mixture gas atmosphere of nitrogen and hydrogen of the oxygen partial pressure from 10 ppm to 10 ppm. Thus, the surely baked Cu electrode can be obtained, and in addition, a ferroelectric resonator for high frequency 1 to show a Qu-factor higher than the Q-factor before baking of the electrode can be obtained.

9. 发明专利

JPS6127003A Conductive paste composition 失效
标题翻译：导电胶组合物
公开(公告)号：JPS6127003A
公开(公告)日：1986-02-06
申请号：JP14816784
申请日：1984-07-17
申请人： Tdk Corp
发明人： MORI KANEO , OIKAWA YASUNOBU
IPC分类号： H01C1/14 , H01B1/16 , H01B1/22 , H01C7/02 , H01C7/10 , H01G4/008 , H01G4/12 , H01L21/28 , H01L21/283 , H01L21/288

10. 发明专利

JPS60142503A VARISTOR 失效
公开(公告)号：JPS60142503A
公开(公告)日：1985-07-27
申请号：JP25100583
申请日：1983-12-28
申请人： TDK CORP
发明人： MORI KANEO , OIKAWA YASUNOBU , SASAKI AKIRA
IPC分类号： H02K13/14 , H01C7/10

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式