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1. 发明专利

JP2008241588A Mark position recognizer and mark position recognition method 有权
标题翻译：标记位置识别器和标记位置识别方法
公开(公告)号：JP2008241588A
公开(公告)日：2008-10-09
申请号：JP2007084990
申请日：2007-03-28
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , MINAGAWA KEIJI , HIROOKA TOMOHARU
IPC分类号： G01B11/00 , G01B11/08 , G01B11/24
摘要： PROBLEM TO BE SOLVED: To provide a mark position recognizer and a mark recognition method capable of highly accurately detecting a gravity position of a mark.
SOLUTION: The mark position recognition method has: a process for specifying a mark constituent 22a of a prescribed area or more arranged to be neared from an image of a periphery of the imaged mark 22; a process for obtaining a temporary gravity Gp from a figure circumscribed on an aggregate of the obtained mark constituent 22a; a process for extracting a contour region 32 including the outer peripheral part of the aggregate of the mark constituent 22a by centering the obtained temporary gravity Gp; a process for distinguishing colors generating the difference of brightness in the inside and outside of a closed curve by forming the closed curve composed of the contour of the mark constituent 22a positioned in the inside of the contour region 32 and an inside boundary 32a of the contour region; a process for obtaining aggregation of center points 42c, 44c by scanning a contour shape 34 of the closed curve by scanning lines 40x, 40y in one direction toward a center direction of the temporary gravity, from the outside and successively calculating the center point of change points of a pair of brightness positioned on both sides of the scanning lines; and a process for calculating the gravity G0 of the mark from the aggregation of the obtained center points.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够高精度地检测标记的重力位置的标记位置识别器和标记识别方法。标记位置识别方法具有：用于指定从成像标记22的周围的图像布置成接近的规定区域或更多的标记构成物22a的处理; 从所获得的标记部件22a的集合体上限定的图形中获得临时重力Gp的工序; 通过使获得的临时重力Gp居中来提取包括标记构件22a的集合体的外周部的轮廓区域32的处理; 通过形成由位于轮廓区域32的内侧的标记构成物22a的轮廓和轮廓区域32的内侧边界32a构成的闭合曲线来区别产生闭合曲线内外的亮度差的颜色的处理地区; 通过从外部向临时重力的中心方向扫描线40x，40y扫描线40x，40y，并通过扫描闭合曲线的轮廓形状34来连续计算中心点，从而获得中心点42c，44c的聚集的处理位于扫描线两侧的一对亮度点; 以及从获得的中心点的聚集计算标记的重力G0的处理。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009282040A Device and method for mark position recognition 有权
标题翻译：用于标记位置识别的装置和方法
公开(公告)号：JP2009282040A
公开(公告)日：2009-12-03
申请号：JP2009178817
申请日：2009-07-31
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , MINAGAWA KEIJI , HIROOKA TOMOHARU
IPC分类号： G01B11/00 , G01B11/24
摘要： PROBLEM TO BE SOLVED: To provide a device and method for mark position recognition for highly accurately detecting a gravity position of a mark.
SOLUTION: The device for mark position specifies a mark constituent of a prescribed area or more from an image of a periphery of the imaged mark, obtains a temporary gravity Gp from a figure circumscribed on the obtained mark constituent, extracts a contour region of the mark constituent by centering the temporary gravity Gp, distinguishing colors generating the difference of brightness in the inside and outside of a closed curve by forming the closed curve composed of the contour of the mark constituent positioned in the inside of the contour region and an inside boundary of the contour region with a contour shape specifying means, obtains aggregation of center points 42c by scanning a contour shape 34 of the closed curve toward a center direction of the temporary gravity Gp and successively calculating the center point of change points of a pair of brightness positioned on both sides of the scanning lines, and calculates the gravity G0 of the mark from the aggregation of the obtained center points.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供用于高精度地检测标记的重力位置的标记位置识别的装置和方法。解决方案：用于标记位置的装置从成像标记的周边的图像中指定规定区域或更多的标记成分，从获得的标记成分所界定的图形中获得临时重力Gp，提取轮廓区域通过使临时重力Gp居中，通过形成由位于轮廓区域的内侧的标记构件的轮廓构成的闭合曲线来区分产生闭合曲线的内部和外侧的亮度差的颜色，以及具有轮廓形状指定装置的轮廓区域的内边界，通过沿着临时重力Gp的中心方向扫描闭合曲线的轮廓形状34并连续计算一对的变化点的中心点，获得中心点42c的聚集的亮度位于扫描线的两侧，并且根据观察者的聚集计算标记的重力G0 指定中心点。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2008238587A Screen printing method and screen printing equipment 审中-公开
标题翻译：屏幕打印方法和屏幕打印设备
公开(公告)号：JP2008238587A
公开(公告)日：2008-10-09
申请号：JP2007082614
申请日：2007-03-27
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , KUDO KOJI , YODOGAWA YOSHIMI , SHIMAKURA YOSHIHIRO , KIYOKAWA SABURO
IPC分类号： B41M1/12 , B41F15/08
摘要： PROBLEM TO BE SOLVED: To provide a screen printing method, in which laborsaving can be contrived and, at the same time, the waste of material is reduced as much as possible and the deformation of printing pattern developing at the early stage of screen printing can be surely prevented from developing, and screen printing equipment. SOLUTION: This printing method screen prints the predetermined pattern on an object by a screen plate. The area of the mark 60 of the predetermined pattern after printing is measured. By repeating the printing and measurement of the mark 60 and comparing the area of the mark 60 obtained as the result of the printing at the present point of time with that obtained as the result of the printing executed just before that at the present point of time, the amount of change δ1 indicating the degree of change is obtained so as to output a normal printing signal when the amount of change δ1 becomes not larger than the predetermined value. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种丝网印刷方法，其中可以设计劳动者，并且同时尽可能地减少材料的浪费，并且在早期阶段形成印刷图案的变形可以肯定地防止丝网印刷，丝网印刷设备。
解决方案：该打印方法屏幕通过屏幕板将预定图案打印在对象上。测量打印后的预定图案的标记60的面积。通过重复标记60的打印和测量，并将作为当前时间点的打印结果获得的标记60的面积与在当前时间点之前执行的打印结果获得的面积进行比较获得指示变化度的变化量δ1，以便当变化量δ1变得不大于预定值时输出正常打印信号。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008085176A Chip component separation apparatus 有权
标题翻译：芯片组件分离设备
公开(公告)号：JP2008085176A
公开(公告)日：2008-04-10
申请号：JP2006265302
申请日：2006-09-28
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , ITO MASATOSHI , TATSUMI SUMIYUKI , YODOGAWA YOSHIMI , SHINDO HIROSHI , YAGI HIROSHI , TAKASHIMA TAKESHI
IPC分类号： H01G13/00 , H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a chip component separation apparatus which reduces damage to chip components and can separate the chip components from one another with high accuracy and efficiency even if dimensions of the chip component shrink to an infinitesimal.
SOLUTION: A chip component separation apparatus 100 comprises: an adhesive sheet 1 adhesively holding a flexible green sheet 80 which is flexible and given cutting treatment; a curved member 90 having curved surfaces 51, 61 for incurvating the green sheet 80 which is adhesively held to the adhesive sheet 1; and a drive means 92 increasing tension to the adhesive sheet 1 intermittently when the curved surfaces 51, 61 of the curved member 90 incurvate the green sheet 80. Therefore, the chip components are not damaged, a yield in a separation step is increased, and especially a separation rate of the chip component in a minimum size is improved. Furthermore, since the drive means 92 can increase the tension to the adhesive sheet 1 intermittently when the curved surfaces 51, 61 of the curved member 90 incurvate the green sheet 80, the chip components can be separated from one another with higher reliability.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种芯片部件分离装置，其即使芯片组件的尺寸收缩到无穷小，也能够以高精度和高效率将芯片部件的损坏相互分离，从而降低芯片部件的损坏。解决方案：芯片部件分离装置100包括：粘合剂片1，其粘合地保持柔性生坯片80，其柔性并进行切割处理; 具有弯曲表面51,61的弯曲构件90，用于使粘接在粘合片1上的生片80粘接; 以及驱动装置92，当弯曲构件90的弯曲表面51,61产生生坯片80时，间歇地增加了粘合片1的张力。因此，芯片部件不被损坏，分离步骤的成品率增加，特别是提高了最小尺寸的芯片部件的分离率。此外，由于当弯曲构件90的弯曲表面51,61产生生片80时，由于驱动装置92可以间歇地增加粘合片1的张力，所以可以将芯片部件彼此分离，并具有更高的可靠性。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007273601A Ceramic sheet laminate cutting method, ceramic electronic component manufacturing method using the same and cutting device 有权
标题翻译：陶瓷片层压切割方法，使用其的陶瓷电子元件制造方法和切割装置
公开(公告)号：JP2007273601A
公开(公告)日：2007-10-18
申请号：JP2006095496
申请日：2006-03-30
申请人： Tdk Corp , Tdk株式会社
发明人： MINAGAWA KEIJI , ABE TATSU , ITO MASATOSHI , TATSUMI SUMIYUKI , SHINDO HIROSHI
IPC分类号： H01G4/30 , H01G4/12 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a ceramic sheet laminate cutting method high in cutting accuracy and cutting efficiency, a cutting device, and a ceramic electronic component manufacturing method using the cutting method.
SOLUTION: A ceramic sheet laminated body 100 is composed so that a plurality of cutting marks are formed on the end face at regular intervals, and internal electrodes are exposed on the four side faces. An inspection part 10 images the cutting marks and the internal electrodes so as to calculate a distance between a cutting position passing through a middle point between the internal electrodes adjacent to each other and each cutting mark as a relative cutting position. A cutting part 50 calculates a gravity center of each cutting mark by imaging each cutting mark so as to cut the ceramic sheet laminated body 100 at the cutting position corresponding to the relative cutting position calculated by the inspection part 10 and the calculated gravity center. It is possible to execute parallel processing of inspection and cutting while improving the cutting accuracy, since it is required to image only the cutting marks during cutting. Consequently, it achieves high work efficiency.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种切割精度和切割效率高的陶瓷片层压切割方法，切割装置和使用该切割方法的陶瓷电子部件制造方法。＆lt; P＆gt;解决方案：陶瓷片层压体100被构成为在端面上以规则的间隔形成多个切割痕迹，并且在四个侧面上露出内部电极。检查部分10对切割标记和内部电极进行成像，以计算穿过彼此相邻的内部电极之间的中间点的切割位置与每个切割标记之间的距离作为相对切割位置。切割部分50通过对每个切割标记进行成像来计算每个切割标记的重心，以便在对应于由检查部分10计算的相对切割位置和计算的重心的切割位置处切割陶瓷片层叠体100。由于只需要在切割时对切割标记进行成像，因此可以在提高切割精度的同时进行检查和切割的并行处理。因此，其工作效率高。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008153276A Method of manufacturing electronic component 审中-公开
标题翻译：制造电子元件的方法
公开(公告)号：JP2008153276A
公开(公告)日：2008-07-03
申请号：JP2006336951
申请日：2006-12-14
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , ITO MASATOSHI , TATSUMI SUMIYUKI , YODOGAWA YOSHIMI , SHINDO HIROSHI , YAGI HIROSHI
IPC分类号： H01G4/30 , H01G4/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component by which the position of an internal electrode of a green sheet laminate can be recognized more accurately, and both material waste and cost can be reduced.
SOLUTION: The method of manufacturing the electronic component includes a lamination step of stacking a first green sheet wherein an internal electrode layer comprised of a plurality of internal electrodes is formed on its surface, as well as a second green sheet wherein a margin pattern layer thicker than the internal electrode layer is formed on its surface in a manner to bury a gap of the internal electrode layer; a crimping step of crimping the laminated first and second green sheets and form a green sheet laminated body; a detection step of detecting a projection part produced on the green sheet laminate due to the margin pattern layer; a step of determining the cutting position according to the detected projection part; and a cutting step of cutting the green sheet laminated body along the cutting position.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件的制造方法，通过该方法可以更准确地识别生片层压板的内部电极的位置，并且可以减少材料浪费和成本。解决方案：电子部件的制造方法包括堆叠在其表面上形成由多个内部电极构成的内部电极层的第一生片以及第二生片，其中边缘在其表面上形成比内部电极层厚的图案层，以埋入内部电极层的间隙; 压接层压的第一和第二生片的卷曲步骤，并形成生片层压体; 检测步骤，检测由于所述边缘图案层而在所述生片层叠体上产生的突出部分; 根据检测到的投影部分确定切割位置的步骤; 以及沿切割位置切割生片层压体的切割步骤。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007015344A Green sheet laminate cutting device 有权
标题翻译：绿色层压切割装置
公开(公告)号：JP2007015344A
公开(公告)日：2007-01-25
申请号：JP2005201944
申请日：2005-07-11
申请人： Tdk Corp , Tdk株式会社
发明人： SHINDO HIROSHI , OHATA OSAMU , TATSUMI SUMIYUKI , ABE TATSU , SUKAI MASANORI
IPC分类号： B28B11/14 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet laminate cutting device capable of efficiently preventing the cut surfaces of a cut green sheet laminate from sticking to each other.
SOLUTION: This green sheet laminate cutting device 1 comprises a loading plate 14, a cutting blade 10, an actuator 24 and an air supply member 22. The loading plate 14 comprises a loading surface S for the green sheet laminate 2 to be loaded on. The cutting blade 10 cuts the green sheet laminate 2 in the thickness direction. The actuator 24 transfers the cutting blade 10 straight in the almost vertical direction to the loading surface S. The air supply member 22 takes air inside from the outside in a flow path 44 formed in each lower end part 22a and also forces out the air to the outside, to thereby generate an air current in the neighborhood of the cut surface of the green sheet laminate 2.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供能够有效地防止切割的生片层压板的切割面彼此粘附的片材层压切割装置。解决方案：该生片层压切割装置1包括装载板14，切割刀片10，致动器24和空气供应构件22.装载板14包括用于生片层叠体2的装载面S 加载切割刀片10在厚度方向切割生片层叠体2。致动器24在几乎垂直方向上直接将切割刀片10传送到装载表面S.供气构件22在形成在每个下端部22a中的流路44中从外部吸入空气，并且将空气迫使从而在生片层叠体2的切割面附近产生气流。（C）2007，JPO＆INPIT

8. 发明专利

JP2008235742A Method for cutting sheet laminate 有权
标题翻译：切割片层压方法
公开(公告)号：JP2008235742A
公开(公告)日：2008-10-02
申请号：JP2007076013
申请日：2007-03-23
申请人： Tdk Corp , Tdk株式会社
发明人： ABE TATSU , TATSUMI SUMIYUKI , SHINDO HIROSHI , YAGI HIROSHI
IPC分类号： H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method of cutting a sheet laminate for cutting a sheet laminate according to the position of an internal electrode in the sheet laminate. SOLUTION: A sheet laminate 10 having an internal electrode 21 is manufactured. Then, the sheet laminate 10 is pressurized. Then, positioning marks 23 and 25 are formed on a face 100 of the sheet laminate 10. Then, the image of the sheet laminate 10 is taken by an X ray so that the position of an internal electrode 21 and the positions of the positioning marks 23 and 25 can be detected. Then, reference data are created by associating the position of the internal electrode 21 with the positions of the positioning marks 23 and 25. Then, the sheet laminate 10 is cut based on the verification results of the positions of the positioning marks 23 and 25 with the reference data. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种根据片材层压体中的内部电极的位置切割片材层压体的方法。解决方案：制造具有内部电极21的片状层压体10。然后，片材层压体10被加压。然后，在片层叠体10的面100上形成定位标记23,25。然后，通过X射线取得片状叠层体10的图像，使得内部电极21的位置和定位标记的位置可以检测到23和25。然后，通过将内部电极21的位置与定位标记23和25的位置相关联来创建参考数据。然后，基于定位标记23和25的位置的验证结果切割片材层压体10，参考数据。版权所有（C）2009，JPO＆INPIT

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