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1. 发明专利

JP2003041399A Continuous transport barrel plating equipment 有权
标题翻译：连续运输棒式涂装设备
公开(公告)号：JP2003041399A
公开(公告)日：2003-02-13
申请号：JP2002070093
申请日：2002-03-14
申请人： Tdk Corp , ティーディーケイ株式会社
发明人： MORI KANEO , KONNO TADAYOSHI , ONODERA AKIRA , SAKURAI TAKASHI , KUDO JUN , KONNO MASAHIKO
IPC分类号： C25D17/16 , C25D17/12 , C25D17/20 , C25D21/00 , C25D21/08
摘要： PROBLEM TO BE SOLVED: To provide a continuous-transport barrel plating equipment, which automatically performs operations such as electrolytic plating of a chip component, or separation and cleaning of the chip component and the media, to reduce the human operations, improves quality of a plated film, and can shorten the treatment time.
SOLUTION: This continuous-transport barrel plating equipment comprises barrel plating parts 1, 2, and 3 which use a barrel unit 5; a delivery part 20 for receiving the barrel unit 5 which has been barrel plated in the barrel plating parts 1, 2, and 3, taking out the chip components and the media from the barrel unit 5, and transporting them into a cleaning pot 30 which passes the media, but not the chip component; and a separating and cleaning part 25 for receiving the pot 30 from the above delivery part 20, separating the media by spraying cleaning liquid to the pot 30 and dropping off the media from the pot 30, and cleaning the chip component.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种自动执行诸如芯片部件的电解电镀或芯片部件和介质的分离和清洁的操作的连续输送滚镀装置，以减少人的操作，提高了镀膜，可缩短处理时间。解决方案：这种连续运输的滚镀设备包括使用桶装置5的滚筒电镀部件1,2和3; 输送部20，用于接收已经在圆筒电镀部分1,2和3中滚镀的筒单元5，从筒单元5取出芯片部件和介质，并将它们运送到清洗罐30中，通过媒体，但不是芯片组件; 以及用于从上述输送部分20接收罐30的分离和清洁部分25，通过向罐30喷射清洗液体并从罐30中脱落介质并清洁芯片部件来分离介质。

2. 发明专利

JP2002004096A METHOD AND APPARATUS FOR BARREL PLATING 失效
公开(公告)号：JP2002004096A
公开(公告)日：2002-01-09
申请号：JP2000180995
申请日：2000-06-16
申请人： TDK CORP
发明人： MORI KANEO , ONODERA AKIRA , KONNO TADAYOSHI , KUME HISASHI , SAKURAI TAKASHI
IPC分类号： C25D17/16
摘要： PROBLEM TO BE SOLVED: To reduce the variance of the plating deposition, and to reduce the number of workers and the installation area of a barrel plating apparatus by intermittently moving barrel units successively from an end in a plating tank, and implementing the plating while the barrel units are stopped. SOLUTION: The barrel units 8 are intermittently moved and carried in the transverse direction in the plating tank 2 by using the barrel units 8 with electronic components stored in a barrel and an electrode brought into electric contact with a medium led to a current collector 9 outside the barrel, a power supplier 7 with the current collector 9 brought into contact therewith at the stop position of the intermittently carried barrel units 8, and a power supplying means to conduct the current arbitrarily set for each electric supplier to the current collector, and the predetermined current is conducted to the electrode of the stopped barrel units 8 at the stopped position via the power supplier 7 and the current collector 9.

3. 发明专利

JP2002105694A METHOD AND APPARATUS FOR BARREL PLATING 审中-公开
公开(公告)号：JP2002105694A
公开(公告)日：2002-04-10
申请号：JP2001208646
申请日：2001-07-10
申请人： TDK CORP
发明人： MORI KANEO , ONODERA AKIRA , SAKURAI TAKASHI , KONNO MASAHIKO , KONNO TADAYOSHI
IPC分类号： C25D17/20
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for barrel plating of a terminal electrode without using any media by solving problems that, if the shape of chip parts becomes small, not only the terminal electrode but also the medium is barrel-plated in the barrel plating using the medium, and it is difficult to separate the chip parts from the medium after the plating is completed. SOLUTION: In this method and this apparatus for barrel plating, an electric insulation film is formed on an outer side of the barrel 11 comprising a cylindrical body 111 using a wire net or a conductive porous plate, the cylindrical body 111 is connected to a negative (-) terminal of a power source 3, only the chip parts 1 are accommodated within the barrel 11, and the chip parts 1 are agitated by the rotation of the barrel 11. The terminal electrode of the chip parts 1 in contact with the inner side of the cylindrical body 111 is conducted to the negative (-) terminal, and the terminal electrode of other chip parts 1 in contact with the terminal electrode is also conducted to the negative (-) terminal. A conductive chain is formed only by the terminal electrodes of the adjacent chip parts 1, and the terminal electrodes of the chip parts 1 are conducted to the negative (-) terminal to perform the plating.

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