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1. 发明专利

JP2013101395A Photocurable resin composition and cured material thereof 有权
标题翻译：光固化树脂组合物及其固化材料
公开(公告)号：JP2013101395A
公开(公告)日：2013-05-23
申请号：JP2013025814
申请日：2013-02-13
申请人： Taiyo Holdings Co Ltd , 太陽ホールディングス株式会社 , Taiyo Ink (Suzhou) Co Ltd , 太陽油墨(蘇州)有限公司
发明人： IWAYAMA HARUTO , KIMURA NORIO , ARIMA MASAO
IPC分类号： G03F7/004 , G03F7/027 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance due to tarnish by oxidation of a copper circuit.SOLUTION: The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; (C) a compound having two or more ethylenically unsaturated groups in a molecule; and (D) a red colorant, excluding anthraquinone one.
摘要翻译：要解决的问题：提供一种着色的光固化树脂组合物，其能够形成由于铜电路的氧化而导致的由于腐蚀而隐藏的外观不良的阻焊层。光固化树脂组合物可用稀碱溶液显影，并包含：（A）含羧酸的树脂; （B）光聚合引发剂; （C）分子中具有两个以上烯属不饱和基团的化合物; 和（D）红色着色剂，不包括蒽醌。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2008281652A Photocurable resin composition and cured product thereof 有权
标题翻译：光固化树脂组合物及其固化产品
公开(公告)号：JP2008281652A
公开(公告)日：2008-11-20
申请号：JP2007123828
申请日：2007-05-08
申请人： Taiyo Ink (Suzhou) Co Ltd , Taiyo Ink Mfg Ltd , 太陽インキ製造株式会社 , 太陽油墨(蘇州)有限公司
发明人： IWAYAMA HARUTO , KIMURA NORIO , ARIMA MASAO
IPC分类号： G03F7/004 , C08F290/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance of a copper circuit attributed to tarnish by oxidation. SOLUTION: The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; (C) a compound having two or more ethylenically unsaturated groups per molecule; and (D) a red colorant. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种着色的光固化树脂组合物，其能够形成由于氧化而导致的腐蚀的铜电路隐藏不良外观的性质优异的阻焊层。光固化树脂组合物可用稀碱溶液显影，并包含：（A）含羧酸的树脂; （B）光聚合引发剂; （C）每分子具有两个以上烯属不饱和基团的化合物; 和（D）红色着色剂。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2011040530A Printed wiring board and method of manufacturing the same 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2011040530A
公开(公告)日：2011-02-24
申请号：JP2009185685
申请日：2009-08-10
申请人： Taiyo Holdings Co Ltd , Yonezawa Dia Electronics Kk , 太陽ホールディングス株式会社 , 米沢ダイヤエレクトロニクス株式会社
发明人： ITO KEIICHI , TAKEUCHI YOSHIFUMI , ARIMA MASAO , IWAYAMA HARUTO
IPC分类号： H05K3/18 , H05K3/26 , H05K3/38
CPC分类号： H05K3/045 , H05K3/184 , H05K2203/1415
摘要： PROBLEM TO BE SOLVED: To provide a high-density printed wiring board including a precise and extremely fine copper circuit pattern formed on a substrate surface, and to provide a method of manufacturing the printed wiring board.
SOLUTION: The method of manufacturing a printed wiring board includes: (a) a process for performing selective exposure and development to a photosensitive resist film formed on the substrate surface to form a resist pattern (5) that has a formed groove pattern of a portion for circuit formation and can be subjected to nonelectrolytic copper plating; (b) a process for performing nonelectrolytic copper plating to an exposure surface of a substrate of the groove pattern portion and to the entire surface of a patterned resist film and then performing electrolytic copper plating until the surface becomes nearly smooth to form a copper plating layer (7) covering the resist pattern; and (c) a process for uniformly reducing the copper plating layer by mechanical polishing and/or chemical polishing, or etching until the surface of the resist film is exposed to expose a copper circuit pattern (8) on the surface. Preferably, ultraviolet irradiation, heating treatment, and/or plasma treatment are performed to the resist film after pattern formation.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种包括形成在基板表面上的精确且极细的铜电路图案的高密度印刷布线板，并提供制造印刷线路板的方法。解决方案：制造印刷电路板的方法包括：（a）对形成在基板表面上的光敏抗蚀剂膜进行选择性曝光和显影的方法，以形成具有形成的凹槽图案的抗蚀剂图案（5）电路形成的一部分，可以进行非电解镀铜; （b）对槽图形部分的基板的曝光表面和图案化抗蚀剂膜的整个表面进行非电解铜电镀，然后进行电解铜电镀直到表面几乎平滑以形成镀铜层的工艺（7）覆盖抗蚀剂图案; 以及（c）通过机械抛光和/或化学抛光均匀地还原铜镀层的方法或蚀刻直到抗蚀剂膜的表面暴露以露出表面上的铜电路图案（8）。优选地，在图案形成之后对抗蚀剂膜进行紫外线照射，加热处理和/或等离子体处理。版权所有（C）2011，JPO＆INPIT

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