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    • 1. 发明专利
    • Lead-free copper-based sliding material
    • 无铅铜箔滑动材料
    • JP2006307284A
    • 2006-11-09
    • JP2005131339
    • 2005-04-28
    • Taiho Kogyo Co Ltd大豊工業株式会社
    • MUKAI AKIRATSUZUKI TSUNEYAKIRA TOSHIHIKO
    • C22C9/02B22F5/00C22C1/05C22F1/00C22F1/08F16C33/10
    • F16C2204/12
    • PROBLEM TO BE SOLVED: To solve such a problem that, when Cu-plated solid lubricant is mixed with Cu-Sn alloy powder and sintered, the solid lubricant is firmly joined with a copper alloy matrix since Sn in the alloy powder is diffused into the Cu plated layer in a process where the ordinary sintering phenomena such vacancy elimination and grain boundary migration are developed however the conformability of the sintered copper alloy is deteriorated.
      SOLUTION: A lead-free copper-based sintered sliding material is obtained by dispersing the solid lubricant grains with copper-based coating, of MoS
      2 , graphite, WS
      2 , Bn, etc., into the matrix composed of Cu-Sn based alloy grains containing 0.1-15mass% Sn and the balance essentially Cu, wherein the hardness of the copper-based coating under sintered state is lower than the hardness of the matrix.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 解决这样的问题:为了解决这样的问题,当将Cu镀固体润滑剂与Cu-Sn合金粉末混合并烧结时,固体润滑剂与铜合金基体牢固地接合,因为合金粉末中的Sn是 在这样的空穴消除和晶界迁移的普通烧结现象发展的过程中,扩散到Cu镀层中,烧结铜合金的一致性变差。

      解决方案:通过将固体润滑剂颗粒分散在具有MoS 2 ,石墨,WS 2 的铜基涂层而获得的无铅铜基烧结滑动材料 >,Bn等添加到由含有0.1〜15质量%的Sn且余量基本上为Cu的Cu-Sn系合金粒子构成的基体中,其中,烧结状态下的铜系被膜的硬度低于基体的硬度 。 版权所有(C)2007,JPO&INPIT