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1. 发明专利

JP2004082276A Metal bond grinding tool 审中-公开
公开(公告)号：JP2004082276A
公开(公告)日：2004-03-18
申请号：JP2002247005
申请日：2002-08-27
申请人： Tadao Ishikawa , Tenryu Saw Mfg Co Ltd , 天龍製鋸株式会社 , 石川唯夫
发明人： TAKEMURA SOKICHI , ISHIKAWA TADAO
IPC分类号： B23F21/03 , B23F21/23 , B24D3/00 , B24D3/02 , B24D3/06
CPC分类号： B24D3/06
摘要： PROBLEM TO BE SOLVED: To provide a grinding tool having a long service life and high grinding performance, and free from the deterioration of the grinding performance for a long time by firmly holding the abrasive by metal bond.
SOLUTION: This metal bond grinding tool 3 includes a base metal 4 and the abrasive 8 adhered to the base metal by means of a bonding member 6 mainly composed of a Cu alloy. The bonding member 6 includes a mixture of Zr and Ti of 3.8-19.2 wt. %.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004017276A Wire saw and its manufacturing method 审中-公开
公开(公告)号：JP2004017276A
公开(公告)日：2004-01-22
申请号：JP2002211792
申请日：2002-06-17
申请人： Tadao Ishikawa , 石川唯夫
发明人： ISHIKAWA TADAO
IPC分类号： B24B27/06 , B24D3/00 , B24D3/06 , B24D11/00
摘要： PROBLEM TO BE SOLVED: To provide a wire saw which is independent of self-dressing action of an object to be ground, safe, free from fluctuation of grinding performance for a long time, quiet and excellent in the grinding performance and its manufacturing method. SOLUTION: A wire is formed of a rope-shaped core wire and a single or a plurality of lines of cylindrical coil-shaped base metal wires 10, and a cutting surface shape of the base metal wires is made in a continuous structure of a recessed shape and a protruded shape. A groove 11 is formed on a front face part in a cutting direction of a recessed part, and abrasive grains 2 are firmly adhered with metal. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2001025969A METAL BOND GRINDING TOOL, AND ITS MANUFACTURE 失效
公开(公告)号：JP2001025969A
公开(公告)日：2001-01-30
申请号：JP19663799
申请日：1999-07-09
申请人： TENRYU SAW MFG CO LTD , ISHIKAWA TADAO
发明人： TAKEMURA SOKICHI , ISHIKAWA TADAO
IPC分类号： B24D3/00 , B24D3/02 , B24D3/06 , B24D5/12
摘要： PROBLEM TO BE SOLVED: To provide a metal bond grinding tool which is long in service life, excellent in grinding performance, and free from fluctuation in grinding performance for a long time by firmly maintaining abrasive grains by a metal bond. SOLUTION: This metal bond grinding tool 2 comprises a base metal 4 and abrasive grains bonded by a bond member 6 mainly consisting of Cu alloy on the base metal 4. The bond member 6 is selected from the group consisting of Ti, Al and a mixture thereof. Preferably, the mean abrasive grain height is at least 30% of the mean abrasive grain diameter, and the mean abrasive grain interval is at least 200% of the mean abrasive grain diameter.

4. 发明专利

JP2012067573A Surface planted type diamond bit capable of adjusting projection height of diamond abrasive grains from matrix and strongly maintaining inner and outer diameters 审中-公开
标题翻译：表面抛光型金刚石钻头，可以调整金刚石磨料颗粒从基质和强力内部和外径的投影高度
公开(公告)号：JP2012067573A
公开(公告)日：2012-04-05
申请号：JP2010230966
申请日：2010-09-24
申请人： Tadao Ishikawa , Kurisutensen Maikai:Kk , 株式会社クリステンセン・マイカイ , 唯夫石川
发明人： HIRANO HIDEO , ANDO HIROYUKI , ISHIKAWA TADAO
IPC分类号： E21B10/48 , B24D3/00 , B24D7/18 , E21B10/02
摘要： PROBLEM TO BE SOLVED: To secure a space for circulating cooling water for the purpose of cooling a bore hole and removing scraps by taking a large clearance between a matrix surface for holding the diamond of a surface planted type bit and a rock to be drilled.SOLUTION: The matrix 20 for holding diamond abrasive grains 10 to be a blade tip is turned to a two-story structure in a height direction, a second floor layer comprises a pedestal sufficiently larger than a diamond particle, and the pedestal of the second floor layer projected from the matrix is constructed. Manufacturing is performed by an impregnation method, and a female die made of graphite is processed and configured. For the second floor layer part, a diamond implanting hole is processed and molded on the graphite die by a drill, an end mill or a ball end mill. At the center of the pedestal of the first stage for mounting the diamond, processing is performed to a depth corresponding to a diamond size further.
摘要翻译：要解决的问题：为了固定用于冷却钻孔的冷却水循环的空间，并且通过在用于将表面种植型钻头的金刚石与岩石保持的基质表面之间留有大的间隙来去除碎屑被钻解决方案：用于将金刚石磨粒10保持为刀片尖端的基体20在高度方向上转变为两层结构，第二层层包括足够大于金刚石颗粒的基座，并且底座构建从矩阵投影的二层层。通过浸渍法进行制造，并且对由石墨制成的阴模进行处理和构造。对于二层部分，通过钻头，立铣刀或球头铣刀在金属模具上加工和模制金刚石注入孔。在用于安装钻石的第一阶段的基座的中心处，进一步进行与钻石尺寸对应的深度。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2007276073A Resinoid cutting grinding wheel and manufacturing method thereof 有权
标题翻译：树脂切割砂轮及其制造方法
公开(公告)号：JP2007276073A
公开(公告)日：2007-10-25
申请号：JP2006107855
申请日：2006-04-10
申请人： Heiwa Technical Kk , Tadao Ishikawa , 平和テクニカ株式会社 , 唯夫石川
发明人： KOIKE TATSUO , ISHIKAWA TADAO
IPC分类号： B24D3/00 , B24D3/28
摘要： PROBLEM TO BE SOLVED: To facilitate the manufacturing of a resinoid cutting grinding wheel capable of preventing the infiltration of a water soluble cutting liquid into a grinding wheel side surface, reduce cutting resistance in cutting, improve cutting performance, enhance the strength of both side surfaces of the resinoid cutting grinding wheel, and hardly generate unevenness or cracks such as burrs on the surface to be cut of a workpiece.
SOLUTION: After abrasive grains 10, thermoplastic resin and a filler are mixed, the mixture is processed to form a plate-shape, and a grinding wheel body 1 is formed, organic synthetic films 2 are coated on both side surfaces 6 of the grinding wheel body 1, calcination is performed, and the organic synthetic films 2 are fixed to the both side surfaces 6 of the grinding wheel body 1 to form an organic synthetic film layer 4.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了便于制造能够防止水溶性切削液浸入砂轮侧表面的树脂切削砂轮，降低切削中的切削阻力，提高切削性能，提高切削性能树脂切割砂轮的两侧面，并且几乎不产生工件表面上的毛刺等不均匀或龟裂。解决方案：在磨料颗粒10，热塑性树脂和填料混合之后，将混合物加工成板状，并且形成砂轮体1，将有机合成膜2涂覆在进行研磨轮体1的煅烧，将有机合成膜2固定在砂轮主体1的两侧面6上，形成有机合成膜层4.版权所有（C）2008，JPO＆INPIT

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