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    • 5. 发明专利
    • DEVICE FOR FORMING THIN FILM USING NOZZLE MOLECULAR BEAM
    • JPS6381812A
    • 1988-04-12
    • JP22641086
    • 1986-09-25
    • TOYOTA MOTOR CORP
    • IGUCHI SATORUFURUNO SHIGEOHANABUSA MITSUGI
    • H01L31/04C23C16/24C23C16/48G03G5/08H01L21/205
    • PURPOSE:To easily replace material gas, to increase film-forming speed and to easily obtain the thin film having excellent film quality by a method wherein a plurality of nozzles, from which the gas containing thin film forming material in the state of molecular beam will be spouted out to a heated up substrate, are provided. CONSTITUTION:Three nozzles 2 are arranged on the same circular arc in a vacuum chamber 1 at the same intervals. Also, on the position opposing to the nozzles 2, the substrate holder 4 on which a glass substrate 3 will be placed is provided on a pedestal 6 in such a manner that the substrate holer 4 is supported by a supporting pole 5 and rotated concentrically with the circular arc. Also, a circular tungsten heater 10 is supported by the supporting pole 5 in such a manner that the molecular beam 9, emitted from the nozzle 2, is surrounded by the heater 10. Using the above-mentioned device, N-type amorphous silicon is deposited using the molecular beam of phosphine gas and monosilane gas. Then, i-type amorphous silicon is deposited using the molecular beam of monosilane gas, and then a solar battery is formed by depositing P-type amorphous silicon using diborane gas and monosilane gas.
    • 7. 发明专利
    • FORMATION OF THIN FILM USING NOZZLE MOLECULAR BEAM
    • JPS6381810A
    • 1988-04-12
    • JP22640886
    • 1986-09-25
    • TOYOTA MOTOR CORP
    • FURUNO SHIGEOIGUCHI SATORUHANABUSA MITSUGI
    • H01L31/04C23C16/24C23C16/48G03G5/08H01L21/205
    • PURPOSE:To contrive improvement in film forming speed by a method wherein the gas, containing thin film forming material, is spouted out in the state of molecular beam through the intermediary of a nozzle, and the gas is allowed to reach a substrate by directly applying an electric field between a heater and the substrate while the gas is being heated. CONSTITUTION:A nozzle 2 is arranged above a glass substrate 3 in the vacuum chamber 1 which is brought in the state of high vacuum atmosphere of 0.1 Torr or thereabout using a vacuum pump 11, and the monosilane gas diluted by hellium is supplied from a cylinder 5. Also, a tungsten heater 9 is arranged at a point almost in the middle of the nozzle 2 and the substrate 3, and the temperature of the gas is adjusted to 1800 deg.C or thereabout. Also, DC 150V is applied between the stand 4, whereon the substrate is placed, and the heater 9 with the stand 4 side as positive pole. Besides, the substrate 3 is heated up to about 250 deg.C using the heater 14 arranged on the back side of the substrate 3. By using the above-mentioned device, amorphous silicon thin film can be formed at low cost. Also, a polycrystalline or single crystal thin film can be obtained by controlling the temperature of the substrate 3.
    • 10. 发明专利
    • FORMATION OF CRYSTAL THIN FILM USING LASER ABLATION METHOD
    • JPH1032166A
    • 1998-02-03
    • JP18625896
    • 1996-07-16
    • TOYOTA MOTOR CORP
    • NAKAMURA NAOKIHASEGAWA HIROSHIHANABUSA MITSUGI
    • C23C14/28C23C14/58C30B13/00C30B13/24C30B23/02H01L21/20H01L21/203
    • PROBLEM TO BE SOLVED: To prevent the generation of a crack in a crystal thin film, to uniformize a recrystallization of the crystal thin film and to enable forming the crystal thin film with large particle diameters by a method, wherein an emission from a target, using a laser beam irradiation is deposited on a substrate, and a laser beam is irradiated on this deposited layer to conduct a plurality of times of deposition-recrystallization cycles for recrystallizing the deposited layer by melting. SOLUTION: A first laser beam 1 is irradiated on a target 8 for a short time, the plume 14 of an emission from a target material is made to reach a substrate 5, and a thin deposited layer is made to form on the substrate 5. Immediately after the deposited layer is made to be formed, a second laser beam 12 for melt recrystallization use is irradiated on the deposited layer to recrystallize the deposited layer by melting. This deposition-melt crystallization cycle is repeated. That is, a crystal thin film of a prescribed film thickness is formed by a process of formation of the first deposited layer, using the first laser beam irradiation → the melt recrystallization of the first deposited layer using the second laser beam irradiation → the formation of a second deposited layer using the first laser beam irradiation → the melt recrystallization of the second deposited layer using the second laser beam irradiation....