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    • 1. 发明专利
    • WAFER HANDLING DEVICE FOR CLEANING WAFER
    • JPH0290522A
    • 1990-03-30
    • JP24075988
    • 1988-09-28
    • TOSHIBA CORPKURITA WATER IND LTD
    • KAMETANI SHIGEJIIMAIZUMI MASABUMIINAGAKI KIYOHIKOOTANI TAIICHIMASHITA NORIYOSHI
    • B65H1/28B25J15/00B65G1/00B65G1/07H01L21/304
    • PURPOSE:To obtain a high cleaning effect, to cut down the time of dipping, and to reduce the flow rate of a cleaning fluid by a method wherein a large number of wafers are held in a line maintaining space in forward and backward directions in an almost exposed condition by the four-point contact using a part of guide arms and a pair of chuck arms. CONSTITUTION:In order to grab up a wafer from an auxiliary means 13, a pair of chuck arms 12a and 12b are opened maximum by moving them in separating direction, the chuck arms and guide arms are lowered, and the pair of guide arms 11a and 11b are brought close to the upper surface of the left and right supporting walls A and B of the auxiliary means. Then, a pusher 14 is lifted up and erected in the auxiliary means 13, all the arranged wafers are pushed up, and when they are placed in the supporting grooves 11 and 11 opposing to the guide arms, the twin guide arms and the chuck arms begin to rise at the same speed as the rising speed of the pusher 14. Then, when the pusher pushed up almost whole of the wafers and its rising is stopped, the rising of the twin guide arms and the chuck arms is also stopped, the chucks 12a and 12b are shifted to approaching direction, And the right and left side edges of the wafer lower than the largest diameter part are inserted into and pinched by the supporting grooves 12 and 12. Then, the pusher is lowered and returned to its original condition, and the wafers are grabbed up above the auxiliary means by the guide arms and the chuck arms.
    • 10. 发明专利
    • WASHING AND DRYING APPARATUS FOR WAFER
    • JPH03242932A
    • 1991-10-29
    • JP3844490
    • 1990-02-21
    • KURITA WATER IND LTD
    • KAMETANI SHIGEJIIMAIZUMI MASABUMIINAGAKI KIYOHIKO
    • H01L21/304
    • PURPOSE:To prevent formation of an oxide film, abrasion by a spinner jig, etc. by a method wherein a nitrogen gas is supplied into and discharged from a tank body made of quartz which supports a carrier holding a plurality of wafers set up in juxtaposition vertically inside the tank body, and a space inside the tank body is filled up with the nitrogen gas. CONSTITUTION:A tank body 1 is made of silica glass and has an immersion part 8 of a carrier and a corridor-shaped inundation part 9 so provided around the immersion part 8 as to project from the upper part of the outside, and a cover body 2 closes up the upper side of the inundation part 9 and covers it up. Wafers 4 to be washed are set up vertically and juxtaposed in the carrier 3, which is set on a support rack 15 in the immersion part 8. Next, the upper side of the inundation part 9 is covered up with the cover body 2, the inside of the tank body 1 is shut off from the outside air and washing water is supplied into the immersion part 8 from an introduction port 10 provided in the bottom. At the same time, a nitrogen gas is introduced into the tank body and filled up in a space above the immersion part 8 in the tank body 1. According to this constitution, formation of an oxide film on the wafers, abrasion with the carrier, production of dust and impairment are eliminated.