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    • 1. 发明专利
    • Nonaqueous electrolyte battery
    • 非电解电解质电池
    • JP2005276672A
    • 2005-10-06
    • JP2004089299
    • 2004-03-25
    • Toshiba Corp株式会社東芝
    • KUBOKI TAKASHIKISHI TAKASHISARUWATARI HIDESATOOKUYAMA TETSUOTAKAMI NORIOHORIKE SATOSHI
    • H01M2/08H01M6/16H01M10/05H01M10/0568H01M10/058H01M10/0585H01M10/40
    • Y02E60/122
    • PROBLEM TO BE SOLVED: To provide a nonaqueous electrolyte battery using a nonaqueous electrolyte mainly composed of salt that melts at room temperature, having a housing formed of a laminate, and suppressing leakage of a liquid.
      SOLUTION: The nonaqueous electrolyte battery comprises: a positive electrode; a separator formed to be adjacent to the positive electrode; the nonaqueous electrolyte 7 mainly composed of salt that melts at room temperature and impregnated into the separator; a negative electrode opposed to the positive electrode with the separator in between and adjacent to the separator; and a sheath material accommodating the positive electrode, the negative electrode and the separator. The sheath material has a sealing portion to be sealed with a thermoplastic resin layer that melts and adheres thereto. A bonding surface protection layer 6 made of wax is formed around the thermoplastic resin layer.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种使用主要由室温熔化的盐形成的非水电解质的非水电解质电池,具有由层叠体形成的壳体,并且抑制液体的泄漏。 解决方案:非水电解质电池包括:正极; 形成为与正极相邻的隔板; 主要由盐组成的非水电解质7,其在室温下熔化并浸渍到隔膜中; 与正极相对的负极,分离器在隔板之间并与隔板相邻; 以及容纳正极,负极和隔膜的护套材料。 护套材料具有用热熔树脂层密封并密封的密封部分。 在热塑性树脂层周围形成由蜡制成的接合表面保护层6。 版权所有(C)2006,JPO&NCIPI
    • 5. 发明专利
    • Manufacture of ic card and ic card
    • IC卡和IC卡的制造
    • JPH11272831A
    • 1999-10-08
    • JP7080798
    • 1998-03-19
    • Toshiba Corp株式会社東芝
    • OTA HIDEOOKUYAMA TETSUO
    • G06K19/077B29C35/00B29C65/02B29C69/00B42D15/10G06K19/07
    • PROBLEM TO BE SOLVED: To manufacture the IC card which has a flat surface by evading adverse influence on the production line of the IC card even if the production line stops owing to trouble and preventing voids at the time of resin filling and wrinkles at the time of resin setting.
      SOLUTION: The manufacture of the IC card includes a process for sandwiching a core sheet having an IC module embedded in is opening part with two cover sheets coated with resin containing a microcapsule type latent catalyst, a process for filling the opening part of the core sheet with the resin and breaking microcapsules containing the latent catalyst by heading and pressing the core sheet and cover sheets at 120 to 180°C and fusing the resin, and a process for setting the resin by putting the core sheet and cover sheets in a heating furnace and cooling the sheets by drawing them out of the heating furnace exit set below 110°C.
      COPYRIGHT: (C)1999,JPO
    • 要解决的问题:为了制造具有平坦表面的IC卡,即使生产线由于故障而停止,并且防止树脂填充时的空隙和当时的皱纹,因此避免对IC卡的生产线的不利影响 的树脂设定。 解决方案:IC卡的制造包括将具有嵌入有IC模块的芯片夹在开口部分中的方法,其中两个盖板涂覆有含有微胶囊型潜在催化剂的树脂,用于填充芯片的开口部分的方法 通过在120〜180℃下进行芯压片和覆盖片的拉伸和压制,并使树脂熔融而使含有潜催化剂的树脂破碎微胶囊,以及将芯片和覆盖片加热加热树脂的方法 并将其从设置在110℃以下的加热炉出口中拉出来冷却片材。