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    • 1. 发明专利
    • Ultraviolet rays irradiation device
    • 超紫外线辐射装置
    • JP2009226273A
    • 2009-10-08
    • JP2008072564
    • 2008-03-19
    • Toppan Forms Co Ltdトッパン・フォームズ株式会社
    • TANAKA TAKASHI
    • B05C9/12H01L33/00
    • PROBLEM TO BE SOLVED: To extend the limits within which an ultraviolet rays irradiation device can deal with a curing initiator contained in an ultraviolet-curing member and promote a curing process, with regard to the ultraviolet rays irradiation device which can cure the ultraviolet-curing member formed on a substrate by irradiating the member with ultraviolet rays.
      SOLUTION: This ultraviolet rays irradiation device is arranged inside an enclosure 12 with the open ultraviolet-curing member side in the way that the device is opposed to the ultraviolet-curing member. In addition, the device has an opposed LED substrate 13 comprising multiwavelength LED groups 22 arranged in a specified phase, LEDs 21A to 21C having differing peak wavelengths of e.g. 365 nm, 370 nm and 375 nm as one set of multiwavelength LED groups 22.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题为了延长紫外线照射装置能够处理紫外线固化部件中所含的固化引发剂的极限,促进固化过程,关于能够固化紫外线照射装置的紫外线照射装置 紫外线固化部件通过用紫外线照射部件而形成在基板上。 解决方案:该紫外线照射装置以与该紫外线固化部件相对的方式配置在具有开口紫外线固化部件侧的外壳12的内部。 此外,该器件具有包括以特定相位布置的多波长LED组22的相对的LED衬底13,具有例如不同峰值波长的LED 21A至21C。 365nm,370nm和375nm作为一组多波长LED组22.版权所有(C)2010,JPO&INPIT
    • 2. 发明专利
    • Rf-id manufacturing device
    • RF-ID制造设备
    • JP2006330991A
    • 2006-12-07
    • JP2005152354
    • 2005-05-25
    • Toppan Forms Co Ltdトッパン・フォームズ株式会社
    • SUZUKI HIDEKITANAKA TAKASHI
    • G06K19/077B42D15/10G06K19/07
    • PROBLEM TO BE SOLVED: To keep the mounting direction of an inlet on a surface sheet constant regardless of a direction where the inlet is supplied. SOLUTION: When an inlet 110 supplied from a roller 1b, and cut into pieces by a laser beam 2a is mounted on a surface sheet 130b in this direction, the inlet 110 is absorbed and conveyed by a vacuum part 5a of an inlet mounting unit 5, and mounted on a surface sheet 130b as it is. When the inlet 110 supplied from the roller 1b, and cut into pieces by the laser beam 2a is mounted on the surface sheet 130b in a direction vertical to the direction where the inlet 110 is supplied, the inlet 110 is absorbed and conveyed by the vacuum part 5a of the inlet mounting unit 5 by rotating the vacuum part 5a by 90 degrees to an in-plane direction on the absorption surface of the inlet 110. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了保持入口在表面片上的安装方向不受入口方向的影响。 解决方案:当从辊1b供应并且通过激光束2a切割成的入口110在该方向上安装在表面片130b上时,入口110被入口110的真空部分5a吸收并输送 安装单元5,并且原样安装在表面片130b上。 当从辊1b供给并且被激光束2a切割成的入口110在与供给入口110的方向垂直的方向上安装在表面片130b上时,入口110被真空吸收并输送 通过在吸入口110的吸收表面上使真空部分5a向面内方向旋转90度而使入口安装单元5的部分5a旋转。(C)2007,JPO&INPIT
    • 4. 发明专利
    • Circuit pattern forming method and circuit pattern forming module, and mounting module manufacturing method and mounting module
    • 电路图形成型方法和电路图形成模块,以及安装模块制造方法和安装模块
    • JP2005136233A
    • 2005-05-26
    • JP2003371310
    • 2003-10-30
    • Toppan Forms Co Ltdトッパン・フォームズ株式会社
    • TANAKA TAKASHI
    • G06K19/07G06K19/077H05K1/02H05K1/11H05K3/40
    • PROBLEM TO BE SOLVED: To provide a method for forming a circuit pattern for forming a circuit, by making predetermined pattern lines cross and a circuit pattern forming module for reducing a manufacturing method, for reducing costs and for improving the through put. SOLUTION: A circuit pattern forming module 11 is configured by forming through-parts 16A, 16B, 17A and 18A at corresponding parts connecting an antenna 15 to extended parts 17 and 18 on first and second insulating base materials 12 and 13 whose one of faces is formed with adhesive layers 14, filling the conductive materials in the through-parts, when the antenna and the extended parts are formed of conductive members, as a pair on the other faces of the first and second base materials, arranging the adhesive layers of the first and second base materials opposite to each other, and overlapping and bonding them so that these base materials are put in a conductive status through the conductive members filled in the opposite through-parts. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种用于形成电路形成用电路图案的方法,通过制作预定图案线和用于减少制造方法的电路图形形成模块,以降低成本并改善通过放置。 解决方案:电路图案形成模块11通过在第一绝缘基材12和第二绝缘基材13上将天线15连接到延伸部分17和18的相应部分上形成贯穿件16A,16B,17A和18A, 的表面形成有粘合剂层14,当天线和延伸部分由导电构件形成在第一和第二基底材料的另一面上时,填充导电材料中的导电材料,将粘合剂 第一和第二基材的层彼此相对,并且它们重叠并结合,使得这些基材通过填充在相对的通孔中的导电构件而处于导电状态。 版权所有(C)2005,JPO&NCIPI
    • 7. 发明专利
    • Pressure-sensitive adhesive coater
    • 压敏胶粘剂
    • JP2003340342A
    • 2003-12-02
    • JP2002157206
    • 2002-05-30
    • Toppan Forms Co Ltdトッパン・フォームズ株式会社
    • TANAKA TAKASHIYONEYAMA TAKAHIROMINAMI YOSHIAKI
    • B05B1/04B05C5/02
    • PROBLEM TO BE SOLVED: To increase the loading of a pressure-sensitive adhesive and upgrade the quality by preventing the adhesive from sticking on an undesired part, in a pressure-sensitive adhesive coater equipped with a coating head for discharging/coating the adhesive to an object to be coated.
      SOLUTION: This device has the coating head 11 formed by joining an upper head 12 and a lower head 13 together. Discharge apertures 22 formed on the upper head 12 are formed on a discharge face 21 which is continuously of a single planar shape. The pressure-sensitive adhesive to be discharged from a space area 23C formed on the joint face 23B of a protrusion part of the lower head 13, is kept as it is by projecting out the face 26, which comes into contact with the object to be coated, of the lower head 13 to the object side from the discharge face 21 and transferred to the object.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:为了增加压敏粘合剂的负载并且通过防止粘合剂粘附在不期望的部分上来提高质量,在装有用于排出/涂覆的涂布头的压敏粘合剂涂布机中 粘合到待涂覆的物体上。 解决方案:该装置具有通过将上头部12和下头部13接合在一起而形成的涂覆头11。 形成在上头12上的放电孔22形成在连续地形成为单一平面形状的排出面21上。 从形成在下部头部13的突出部的接合面23B上的空间区域23C排出的压敏粘合剂通过将与物体接触的面26突出地保持原状 将下头部13从放电面21涂覆到物体侧并转移到物体。 版权所有(C)2004,JPO