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1. 发明专利

JPH06320260A METHOD AND DEVICE FOR EXECUTING VAPOR PHASE SOLDERING 失效
公开(公告)号：JPH06320260A
公开(公告)日：1994-11-22
申请号：JP11295893
申请日：1993-05-14
申请人： TOKUYAMA SODA KK , TAMURA SEISAKUSHO KK
发明人： OBA SEIICHIRO , ABE NOBUHIDE , KURANARI SHINSAKU , YAMASHITA FUMIHIRO
IPC分类号： B23K1/015 , B23K31/02 , H05K3/34
摘要： PURPOSE:To provide a method and a device for executing vapor phase soldering where the soldering can be surely executed while the amount of use of the flux blended in the solder is remarkably reduced in executing the vapor phase soldering. CONSTITUTION:The unsaturated vapor region of

2. 发明专利

JP2905564B2 失效
公开(公告)号：JP2905564B2
公开(公告)日：1999-06-14
申请号：JP14364590
申请日：1990-06-01
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , SOTONO KAZUO
IPC分类号： B23K3/00 , H05K3/34

3. 发明专利

JPH0555227B2 失效
公开(公告)号：JPH0555227B2
公开(公告)日：1993-08-16
申请号：JP11469985
申请日：1985-05-28
申请人： TAMURA SEISAKUSHO KK
发明人： MASUDA TSUGUNORI , KIMOTO HISASHI , ABE NOBUHIDE
IPC分类号： B23K1/08 , H05K3/34

4. 发明专利

JPH0437473A SPRAY FLUXER 失效
公开(公告)号：JPH0437473A
公开(公告)日：1992-02-07
申请号：JP14364790
申请日：1990-06-01
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , SOTONO KAZUO
IPC分类号： B23K3/00 , H05K3/34
摘要： PURPOSE:To improve the recovery rate of the flux mists sprayed from nozzles by providing a gate plate around the spraying range of flux mists and providing a flux mist suction pipe in the outer peripheral part of this gate plate. CONSTITUTION:Since a work 15 is small in the width size, a width adjusting frame 31 is shifted to a stationary frame 34 side and the shielding plate 29 integral with this width adjusting frame 33 is also moved up to the position above the left nozzle 14a. The upper half of the spraying port 26 of the left nozzle 14a is covered by this shielding plate 29. Of the flux mists 51 sprayed from this spraying port 26, the flux mists 51a of the spraying range deviating from the work 15 are shielded by the shielding plate 29 right after the spraying and are recovered without being diffused. On the other hand, the flux mists 51 which are sprayed without being shielded by this shielding plate 29 are limited in the spraying range by the ambient gate plate 41 and the flux mists leaking from the spacing between the work 15 and the gate plate 41 are sucked into a mist suction slit 44 of the flux mist suction pipe 42 and are thereby recovered.

5. 发明专利

JPH0320303B2 失效
公开(公告)号：JPH0320303B2
公开(公告)日：1991-03-19
申请号：JP8193286
申请日：1986-04-09
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , OKANO TERUO
IPC分类号： B23K1/015 , H05K3/34

6. 发明专利

JPH02174192A PRINTING OF CREAM SOLDER 失效
公开(公告)号：JPH02174192A
公开(公告)日：1990-07-05
申请号：JP32845988
申请日：1988-12-26
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , ONOZAKI JUNICHI , TAKAHASHI TAKAO
IPC分类号： B41F15/40 , B23K3/06 , H05K3/12 , H05K3/34
摘要： PURPOSE:To immediately print and coat with cream solder of optimum viscosity at the time of restarting after printing is started or interrupted by moving the cream solder by a squeegee and a spatula at the time of waiting for printing, and maintaining a printable cream solder viscosity state. CONSTITUTION:Both a squeegee 18 and a spatula 20 are reciprocated at a waiting position of the corner of a screen in contact with a screen in a waiting state for printing such as before the start of printing or at the time of interruption of printing (at the time of supply of cream solder 22, at the time of trouble) to apply similar motion (viscosity managing motion) to that at the time of printing to the cream solder 22 held between the squeegee 18 and the spatula 20 to prevent the viscosity of the cream solder 22 from varying. Thus, printing can be immediately started or restarted with the cream solder 22 of optimum viscosity.

7. 发明专利

JPH0281689A SCREEN MASK FOR CREAM SOLDER PRINTING 失效
公开(公告)号：JPH0281689A
公开(公告)日：1990-03-22
申请号：JP23456988
申请日：1988-09-19
申请人： TAMURA SEISAKUSHO KK
发明人： ONOZAKI JUNICHI , ABE NOBUHIDE
IPC分类号： B41N1/24 , H05K3/12
摘要： PURPOSE:To remove an angled part to which paste is liable to stick from an opening part and besides, to achieve improvement of a printing characteristic by improving passing of paste by a method wherein the opening part of a screen mask is made circular and at least one or more circular opening parts are made to correspond to a printing pattern. CONSTITUTION:All shapes of opening parts 12 of a screen mask 11 are formed into a circular form, and one or more opening parts 12 are arranged to a form of a printing pattern 1 based on its design. Then, three same opening parts are disposed in an array to a narrow long rectangular printing pattern 1. When paste 4 is adhered to a printed circuit substrate, which is not given in the figure, arranged on the other side surface of the screen mask 11 via the opening part 12 by transferring the paste 4 along the screen mask 11 by using a squeegee 5, the paste 4 can be printed like the form of the opening part 12. Therefore, an obtained printing characteristic is good. Further, even though printing is repeated, the printing characteristic is hardly deteriorated since the paste 4 is difficult to remain at the opening part 12.

8. 发明专利

JPS63115674A GASEOUS PHASE TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS63115674A
公开(公告)日：1988-05-20
申请号：JP26241486
申请日：1986-11-04
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , HIRONO SHUNICHI
IPC分类号： B23K1/015
摘要： PURPOSE:To prevent vapor from leaking out to the outside by connecting a stored liquid enclosed tank to a liquid reservoir part of a vapor tank through a pipe line, discharging a high temperature liquid to the enclosed tank from the liquid reservoir part after a work is ended, and making the vapor tank empty, in a gaseous phase type soldering device. CONSTITUTION:A gaseous phase type soldering device heats and evaporates a liquid 13 contained in a liquid reservoir part 12, and executes reflow soldering by evaporation latent heat of a saturated vapor phase 15 formed in the inside of a vapor tank 11. When the soldering work is ended and heating of the liquid 13 is stopped, an opening/closing valve 31 or 41 is opened immediately and the liquid 13 of a high temperature is discharged to a stored liquid enclosed tank 33 from the liquid reservoir part 12. In this regard, the liquid 13 is stored until it is stabilized to a low temperature state that at least evaporation does not occur in the tank 33. In such a way, it can be prevented that vapor leaks out to the outside after the work is ended.

9. 发明专利

JPS6340691A LASER MARKING DEVICE 失效
公开(公告)号：JPS6340691A
公开(公告)日：1988-02-22
申请号：JP18394286
申请日：1986-08-05
申请人： TAMURA SEISAKUSHO KK
发明人： KATO HIROSHI , MASUDA TSUGUNORI , ABE NOBUHIDE , KATSUSE JUNICHI , HIRONO SHUNICHI
IPC分类号： B23K26/00 , B23K26/066 , B41F17/00 , B41J2/00 , B41J2/435 , B41J2/44 , B41J2/47
摘要： PURPOSE:To enable the marking by the letter of a different combination by selecting the mask hole of the peripheral edge part of a discoid mask closest to a laser light source and arranging in order the mask hole of the other discoid mask inside the transmission window adjacent the mask hole thereof. CONSTITUTION:The 1st mark hole 14 of the mask plate 13a closest to a laser light is located at the left end part of the inside of the marking area 20 by a laser light. The 2nd mark hole 14 of the mark plate 13b of the next step is then located at the left end part located inside the transmission window 18 of the right-hand neighbor of the mark hole 14 of this mask plate 13a. The mark hole 14 corresponding to the next step mask plate 13 is arranged in order at the left end part inside the transmission window 18 of the right-hand neighbor of the mark hole 14 located similarly thereafter. The laser light is projected inside the marking area 20 and the laser light passing through the mark hole 14 is reduced by a reduction lens, projected on the surface of a marking body and the marking is performed.

10. 发明专利

JPS62238068A VAPOR TYPE SOLDERING DEVICE 失效
公开(公告)号：JPS62238068A
公开(公告)日：1987-10-19
申请号：JP8193186
申请日：1986-04-09
申请人： TAMURA SEISAKUSHO KK
发明人： ABE NOBUHIDE , TAKAHASHI TAKAO , OKANO TERUO
IPC分类号： H05K3/34 , B23K1/015
摘要： PURPOSE:To prevent that the expensive vapor of the inside of a soldering device is leaked out to the external part by providing a main cooling part and sub- cooling part on the carry-in port part and carry-out port part of the part to be soldered in a vapor type soldering device. CONSTITUTION:A vapor phase 25 is formed by evaporating with heating by a heater 24 by inputting a fluorine inert solvent liquid 23 to the lower part of a vapor tank 21 in a vapor soldering device. The body 32 to be soldered is transferred from carry-in port part 31 therein and subjected to a reflow soldering with the latent heat of evaporation owned by the vapor phase 25 and carried out to the external part from the carry-out port part 34. In this device, the main cooling part 34 and sub cooling part 41 to prevent the leakage to the external part of the vapor phase 25 are provided in the inner part of the carry-in port part 31 and carry-out port part 33. In this way the bottom face of the carry-in port part and carry-out port part is cooled to prevent the leakage outside the vapor tank 21 from the carry-in port part 31 and carry-out port part 33 with the re-evaporation of the condensate of the vapor on the bottom face.

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