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1. 发明专利

JP2012165001A Arrangement structure of wiring body, mobile phone, and wiring component 有权
标题翻译：接线体，移动电话和接线组件的布置结构
公开(公告)号：JP2012165001A
公开(公告)日：2012-08-30
申请号：JP2012091151
申请日：2012-04-12
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： KOYAMA KEIJI , MISHIMA HIDEHIKO
IPC分类号： H05K7/00 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide an arrangement structure of a wiring body capable of imparting waterproofness while wiring in a housing without using a die, and to provide a mobile phone and a wiring component using it.SOLUTION: The arrangement structure of a wiring body includes a heat-shrinkable tube 5, and wiring body insertion openings 41h and 43h of projections 41d and 43d provided in housings 41 and 43. A flexible printed wiring board 3 is located to pass through the heat-shrinkable tube 5 and the wiring body insertion openings 41h and 43h. The heat-shrinkable tube shrinks and adheres to the projections 41d and 43d at the wiring body insertion openings, and the heat-shrinkable tube portion therebetween passes the wiring body in non-tight contact state.
摘要翻译：要解决的问题：提供一种能够在不使用模具的情况下在外壳中布线时赋予防水性的布线体的布置结构，并且提供使用它的移动电话和布线部件。解决方案：布线体的布置结构包括热收缩管5和设置在壳体41和43中的突起41d和43d的布线体插入孔41h和43h。柔性印刷布线板3位于通过通过热收缩管5和布线体插入口41h和43h。热收缩管在布线体插入口处收缩并粘附到突起41d和43d，并且其中的热收缩管部分在非紧密接触状态下通过布线体。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011048981A Light guide plate, printed wiring board, key module, and electronic equipment 审中-公开
标题翻译：光导板，印刷线路板，钥匙模块和电子设备
公开(公告)号：JP2011048981A
公开(公告)日：2011-03-10
申请号：JP2009195461
申请日：2009-08-26
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , SAITO HIROHISA
IPC分类号： F21V8/00 , F21Y101/02 , H01H13/02 , H01H13/702
摘要： PROBLEM TO BE SOLVED: To provide a light guide plate in which a point desired to be illuminated can be illuminated precisely with a simple and easy constitution and brightness evenness can be aimed at, a printed wiring board equipped with the light guide plate, a key module equipped with the printed wiring board, and an electronic equipment equipped with the key module. SOLUTION: In the light guide plate 20 in which incident light is arranged to be guided through the thickness to an end side, and made to be emitted to the outside at one or a plurality of prescribed positions, a light reflecting and guiding device is installed that reflects and guides the light guided from the incident side to the end side and that guides the light toward a scheduled emitting direction on the way. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种导光板，其中可以以简单且容易的结构精确地照亮希望被照亮的点，并且可以瞄准亮度均匀性，配备有导光板的印刷线路板配备有印刷线路板的关键模块和配备有该键模块的电子设备。解决方案：在导光板20中，其中入射光被布置成通过厚度被引导到端侧，并且在一个或多个规定位置处被发射到外部，光反射和引导装置被安装成将从入射侧引导的光引导到端侧，并且将光引导到路上的排放方向。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010123303A Light guide plate, wiring module, and electronic equipment 审中-公开
标题翻译：光导板，接线模块和电子设备
公开(公告)号：JP2010123303A
公开(公告)日：2010-06-03
申请号：JP2008293991
申请日：2008-11-18
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： SAITO HIROHISA , MATSUBARA HIDEKI , MISHIMA HIDEHIKO
IPC分类号： F21S2/00 , F21Y101/02 , G02F1/13357 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a light guide plate for attaining power-saving and thinness by enhancing utilization efficiency of light, a wiring module using the light guide plate, and an electronic equipment using the light guide plate or the wiring module. SOLUTION: This is the light guide plate for backlight of an electronic equipment which includes nearly flat plate shape and introduces illumination light emitted from a light source from a light receiving face provided at the side face, and extracts to the outside from a light outgoing part formed on at least one of main faces of a first main face and a second main face on the opposite side. The light guide plate includes a deflection structure which deflects the advancing direction of the illumination light and includes an inclined face to the main face on at least one of the main faces of the first main face and the second main face. Thereby, the illumination light is propagated in the light guide plate by making total reflection and the light is extracted efficiently from the light outgoing part. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过提高光的利用效率来实现省电和薄度的导光板，使用导光板的布线模块和使用导光板或布线模块的电子设备。
解决方案：这是一种电子设备的背光导光板，它包括几乎平板的形状，并且引入从设置在侧面的光接收面的光源发出的照明光，并从侧面提取到外部光出射部分形成在相对侧的第一主面和第二主面的至少一个主面上。导光板包括使照明光的前进方向偏转的偏转结构，并且在第一主面和第二主面的至少一个主面上包括倾斜面到主面。因此，通过进行全反射，照明光在导光板中传播，并且从光出射部有效地提取光。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010034170A Wiring body, connection structure and electronic equipment 有权
标题翻译：接线体，连接结构和电子设备
公开(公告)号：JP2010034170A
公开(公告)日：2010-02-12
申请号：JP2008192923
申请日：2008-07-27
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , KOYAMA KEIJI , PARK JIN-JOO
IPC分类号： H05K7/00 , H04M1/02 , H05K5/06 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide a wiring body, etc. that can have a waterproof structure inexpensively while being flexibly adaptive to design change of a wiring member.
SOLUTION: The wiring body has a fitting portion 15 which is fitted in a through-hole of a housing of electronic equipment. The fitting portion 15 has first and second reinforcing plates 11a and 11b fixed to FPC 21 with first and second adhesive layers 14a and 14b. An O ring 13 is fitted in groove portions 12 of the reinforcing plates 11a and 11b. The O ring 13 clamps the reinforcing plates 11a and 11b with the FPC 21 interposed. An O type groove is formed in the through-hole of the housing. The O ring 13 in the fitting portion 15 is fit in the O type groove of the through-hole. The reinforcing plates 11a and 11b are flexibly adaptive to design change of the wiring member, and manufactured inexpensively.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够廉价地具有防水结构的布线体等，同时柔性地适应布线构件的设计变化。解决方案：接线体具有安装在电子设备的壳体的通孔中的嵌合部15。装配部分15具有第一和第二加强板11a和11b，其固定到具有第一和第二粘合层14a和14b的FPC21上。 O形环13安装在加强板11a和11b的槽部12中。 O型环13夹着FPC21夹持加强板11a，11b。在壳体的通孔中形成O型槽。装配部分15中的O形环13装配在通孔的O型槽中。加强板11a和11b灵活地适应布线构件的设计变化，并且廉价地制造。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010034169A Seal structure and electronic equipment 有权
标题翻译：密封结构和电子设备
公开(公告)号：JP2010034169A
公开(公告)日：2010-02-12
申请号：JP2008192922
申请日：2008-07-27
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , PARK JIN-JOO
IPC分类号： H05K7/00 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To achieve waterproofing with inexpensive and simple seal structure.
SOLUTION: A seal portion 60 is provided with a seal member 61 which covers FPC 21, and an adhesive sheet 65 for pressing the seal member 61. The FPC 21 is stuck on a housing with an adhesive double coated tape 63. The seal member 61 covers the FPC 21 and the whole through-hole. The adhesive sheet 65 seals a periphery of the seal member 61 while pressing the seal member 61 against the housing and FPC 21. The seal member 61 is made of a water-repellent porous resin. In this example, the seal member 61 uses a porous PTFE film manufactured by a stretching method as the porous resin. When the seal member 61 is pressed, a gap between the seal member 61, and the housing and FPC 21 becomes small because of elastic deformation to secure a waterproofing function.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：用廉价和简单的密封结构实现防水。解决方案：密封部分60设置有覆盖FPC21的密封构件61和用于按压密封构件61的粘合片65. FPC 21用粘合剂双面胶带63粘贴在壳体上。密封构件61覆盖FPC 21和整个通孔。粘合片65在将密封构件61压靠在壳体和FPC 21上的同时密封密封构件61的周边。密封构件61由防水多孔树脂制成。在该实施例中，密封部件61使用通过拉伸法制造的多孔PTFE膜作为多孔树脂。当密封构件61被按压时，密封构件61与壳体和FPC 21之间的间隙由于弹性变形而变小，以确保防水功能。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010021173A Wiring body, connection structure and electronic equipment 审中-公开
标题翻译：接线体，连接结构和电子设备
公开(公告)号：JP2010021173A
公开(公告)日：2010-01-28
申请号：JP2008177578
申请日：2008-07-08
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , KOYAMA KEIJI
IPC分类号： H05K7/00 , G06F1/16 , G06F1/18 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a wiring body etc., which actualize a waterproof structure at low cost while flexibly adapting to design change of a wiring board. SOLUTION: The wiring body 20 has FPC 21 and harness portions 25a and 25b. The FPC 21 has a wiring forming portion 21a provided with a wiring layer and an annular seal portion 21b. Both ends of the wiring forming portion 21a are enclosed with a seal portion 21b. The wiring forming portion 21a and seal portion 21b are formed integrally as one flat plate. An annular elastic packing member 23 is superposed on upper surfaces of part of the wiring forming portion 21a and the seal portion 23 which form one ring. A pair of partial housings 31a and 31b is coupled to each other with the wiring forming portion 21a and seal portion 21g, and the elastic packing member 23 interposed. The elastic packing member 23 is flexibly adaptive to change in design of the wiring board, and manufactured at low cost. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种以柔性地适应布线板的设计变化的低成本实现防水结构的布线体等。布线主体20具有FPC21和线束部25a，25b。 FPC21具有设置有布线层和环形密封部21b的布线形成部21a。布线形成部21a的两端被密封部21b包围。布线形成部21a和密封部21b一体地形成为一个平板。在布线形成部21a的一部分的上表面和形成一个环的密封部23上叠置有环状的弹性填充部件23。一对部分壳体31a和31b通过布线形成部分21a和密封部分21g彼此连接，并且弹性密封件23被插入。弹性包装部件23柔性地适应于布线板的设计变化，并且以低成本制造。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010205668A Using light guide plate, key module, and electronic equipment using light guide plate or key module 审中-公开
标题翻译：使用光导板，关键模块和使用光导板或键盘的电子设备
公开(公告)号：JP2010205668A
公开(公告)日：2010-09-16
申请号：JP2009052276
申请日：2009-03-05
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： SAITO HIROHISA , MATSUBARA HIDEKI , MISHIMA HIDEHIKO
IPC分类号： H01H13/02 , G06F3/02 , G09F13/18 , G09F13/20 , H01H13/702
摘要： PROBLEM TO BE SOLVED: To provide: a light guide plate capable of improving luminance of an input key by using a light-accumulating material and capable of reducing luminous intensity of a light source, thereby achieving energy saving; a key module; and electronic equipment using the light guide plate or the key module.
SOLUTION: In the key module 2 provided with the input key 11 for entering a designated instruction, the light guide plate 20 located below the input key 11 and illuminating light from a light source 40 in the input key 11 direction, and a circuit board 50 located below the light guide plate 20 and switching on and off by the input key 11, a light-accumulating means for accumulating and discharging light is arranged between the light guide plate 20 and the circuit board 50.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供：能够通过使用蓄积材料来提高输入键的亮度并能够降低光源的发光强度的导光板，从而实现节能; 一个关键模块; 以及使用导光板或按键模块的电子设备。
解决方案：在设置有用于输入指定指令的输入键11的键模块2中，导光板20位于输入键11下方并且在输入键11方向上照射来自光源40的光，以及电路板50位于导光板20的下方并通过输入键11接通和断开，在导光板20和电路板50之间配置有用于积聚和排出光的聚光装置。版权所有：（C）2010，JPO＆INPIT

8. 发明专利

JP2010186610A Key module and electronic device 审中-公开
标题翻译：关键模块和电子设备
公开(公告)号：JP2010186610A
公开(公告)日：2010-08-26
申请号：JP2009029243
申请日：2009-02-12
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： SAITO HIROHISA , MATSUBARA HIDEKI , MISHIMA HIDEHIKO
IPC分类号： H01H13/02 , H01H13/712 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a key module that improves a click feeling even while enhancing luminosity of input keys, and to provide an electronic device using the key module as an input means.
SOLUTION: The key module includes input keys, a light-guide plate arranged below the input keys so as to illuminate the input keys, and a printed wiring board arranged below the light-guide plate. A translucent sheet, in which each position corresponding to each input key has a domed shape, is provided between the input keys and the light-guide plate. By this, if each input key is depressed, the pressing force is directly transmitted to each dome-shaped part, thereby deforming each dome-shaped part. Consequently, it achieves an excellent click feeling and improvement in input certainty.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供即使在提高输入键的亮度的同时提高点击感的键模块，并且提供使用该键模块作为输入装置的电子设备。解决方案：按键模块包括输入键，布置在输入键下方的导光板以照亮输入键，以及布置在导光板下方的印刷线路板。在输入键和导光板之间设置有半透明片，其中与每个输入键对应的每个位置具有圆顶形状。由此，如果每个输入键被按下，则按压力被直接传递到每个圆顶形部分，从而使每个圆顶形部分变形。因此，它实现了良好的点击感和输入确定性的提高。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009224362A Wiring board, wiring board connection body, wiring board module, and electronic equipment 审中-公开
标题翻译：接线板，接线板连接体，接线板模块和电子设备
公开(公告)号：JP2009224362A
公开(公告)日：2009-10-01
申请号：JP2008063968
申请日：2008-03-13
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , KOYAMA KEIJI , MARUYAMA KAZUYA , MASUDA YASUHITO
IPC分类号： H05K1/11 , H01R9/05 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, a wiring board connection body, etc., that enable conductors having various cross-sectional shapes, such as a center conductor of a multicore to be easily and securely positioned with respect to electrodes on the wiring board. SOLUTION: The wiring board connection body A has a PWB 10 having signal electrodes 12a formed atop of signal wiring lines 12, and a multicore ultrafine coaxial cable 20 constituted by coupling a plurality of ultrafine coaxial cables 21 having center conductors 22 whose tip portions are exposed, in parallel. Each signal electrode 12a has a groove portion Rg, a center conductor 22 is engaged with (fitted in) the groove portion Rg, and the signal electrode 12a and center electrode 22 are soldered together to be electrically connected. An operation to position the center conductors 22 of the PWB 10 with respect to groove portions Rg respectively becomes easy and sure to achieve contactless connections with high reliability. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种布线板，布线板连接体等，其能够使具有各种截面形状的导体（诸如多芯的中心导体）相对于接线板上的电极。布线基板连接体A具有形成在信号布线12顶部的信号电极12a的PWB10以及多芯超细同轴电缆20，该多芯超细同轴电缆20通过将多个具有中心导体22的超细同轴电缆21连接而成，平行地暴露部分。每个信号电极12a具有槽部分Rg，中心导体22与凹槽部分Rg接合（嵌合），并且信号电极12a和中心电极22被焊接在一起以电连接。相对于凹槽部分Rg分别设置PWB 10的中心导体22的操作变得容易，并且确保以高可靠性实现非接触连接。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009224034A Method of forming wiring board connection assembly 审中-公开
标题翻译：形成接线板连接总成的方法
公开(公告)号：JP2009224034A
公开(公告)日：2009-10-01
申请号：JP2008063969
申请日：2008-03-13
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , KOYAMA KEIJI , MARUYAMA KAZUYA
IPC分类号： H01R9/05
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a wiring board connection assembly, capable of connecting central conductors of a multi-conductor cable to electrodes of a wiring board, using a connector of high reliability by using an adhesive film.
SOLUTION: Each central conductor 22 of a multi-conductor coaxial cable 20 of extra fine conductors is placed on each signaling electrode 12a of a PWB 10, and an adhesive film 32 is placed over all central conductors 22. A press head 36 is lowered to press the adhesive film 32, while heating the adhesive film. The adhesive film 32 melts, while the central conductors 22 are in close contact with the signaling electrodes 12a, and the molten part of the adhesive film 32 wraps around respective central conductors 22 and enters the clearance under the conductor. The adhesive fixes the central conductor 22 to the signaling electrode. This increases the reliability of connection between the central conductor 22 and the signaling electrode 12a, because the central conductor will not completely lift from the signaling electrode 12a and the contact between the central conductor 22, and the signaling electrode 12a is improved.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成布线板连接组件的方法，其能够使用通过使用粘合剂膜的高可靠性的连接器将多导体电缆的中心导体连接到布线板的电极。解决方案：将超细导体的多导体同轴电缆20的每个中心导体22放置在PWB 10的每个信号电极12a上，并且将粘合膜32放置在所有中心导体22上。压头36 在加热粘合剂膜的同时降低粘合剂膜32。粘合膜32熔化，同时中心导体22与信号电极12a紧密接触，并且粘合膜32的熔融部分卷绕在各个中心导体22周围并进入导体下的间隙。粘合剂将中心导体22固定到信号电极。这增加了中心导体22和信号电极12a之间的连接的可靠性，因为中心导体不会完全从信号电极12a升起，并且改善了中心导体22与信号电极12a之间的接触。版权所有（C）2010，JPO＆INPIT

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