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1. 发明专利

JP2007220967A Wiring structure, its manufacturing method, and semiconductor device 审中-公开
标题翻译：接线结构及其制造方法和半导体器件
公开(公告)号：JP2007220967A
公开(公告)日：2007-08-30
申请号：JP2006041024
申请日：2006-02-17
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/768 , H01L23/522
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring structure which has a good Cu diffusiveness and is excellent in a heat resistance, an electrical property, especially a dielectric constant and an adhesive property or the like, and to provide a semiconductor device which is equipped with the multilayer wiring structure and is excellent in the electrical property.
SOLUTION: A method of manufacturing a wiring structure comprises the steps of: (1) forming an alloy layer containing a copper layer or copper in a groove formed in an insulating film, and forming a barrier metal layer; (2) forming a cap layer constituted by a metallic layer containing Co, Ni or W on a front surface of the alloy layer containing the copper layer or copper; and (3) forming an organic system insulating material layer having a copper spread preventing ability. Wiring structure is disclosed having the alloy layer containing the copper layer or copper made by using the manufacturing method. The semiconductor device is also disclosed as equipped with the wiring structure.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种具有良好的Cu扩散性并且具有优异的耐热性，电性能，特别是介电常数和粘合性等的多层布线结构，并提供半导体器件其具有多层布线结构，并且电性能优异。解决方案：制造布线结构的方法包括以下步骤：（1）在形成在绝缘膜中的沟槽中形成含有铜层或铜的合金层，形成阻挡金属层; （2）在包含铜层或铜的合金层的表面上形成由含有Co，Ni或W的金属层构成的盖层; 和（3）形成具有铜扩散防止能力的有机系绝缘材料层。公开了具有通过使用该制造方法制造的包含铜层或铜的合金层的布线结构。还公开了配备有布线结构的半导体器件。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2004288749A Insulating film for semiconductor and semiconductor device using the same 审中-公开
公开(公告)号：JP2004288749A
公开(公告)日：2004-10-14
申请号：JP2003076495
申请日：2003-03-19
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI , FUNAOKA SOUHEI
IPC分类号： C08G73/22 , H01B3/30 , H01L21/312 , H01L21/768
摘要： PROBLEM TO BE SOLVED: To provide an insulating film used for semiconductors which is excellent in heat-resistant properties, kept high in mechanical characteristics, and reduced in permittivity; and to provide a semiconductor device using the same. SOLUTION: A film is formed of insulating film material containing polyamide (1) having a repetitive unit represented by formula (A), and a high-boiling solvent (2) having an evaporating temperature of 170°C or above under an atmospheric pressure; and is thermally treated at temperatures of 80 to 450°C and then subjected to heating and pressure processing, in a carbon dioxide gas atmosphere kept at a temperature of 31.1°C or above and under a critical pressure of 7.38 MPa or above so as to obtain the insulating film used for semiconductors, and the semiconductor device using the insulating film is provided. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2009256642A Composition for optical component, and optical component 审中-公开
标题翻译：光学组件和光学组件的组成
公开(公告)号：JP2009256642A
公开(公告)日：2009-11-05
申请号：JP2009070595
申请日：2009-03-23
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： HORIMOTO AKIHIRO , OKI HIROMI , SAITO HIDENORI
IPC分类号： C08L79/04 , C08G73/22 , C08K5/00 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a composition for an optical component excellent in optical properties, heat resistance, adhesiveness, and processability and the like, and further an optical component excellent in optical properties and heat resistance. SOLUTION: The composition for an optical component comprises a hydroxyamide polymer represented by formula (A) and a solvent, wherein the hydroxyamide polymer has a weight average molecular weight of not less than 5,000 and not greater than 15,000 in terms of standard polystyrene. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供光学性能，耐热性，粘合性和加工性等优异的光学部件组合物，以及光学性能和耐热性优异的光学部件。解决方案：用于光学部件的组合物包含由式（A）表示的羟基酰胺聚合物和溶剂，其中羟基酰胺聚合物以标准聚苯乙烯换算的重均分子量不小于5,000且不大于15,000 。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007081162A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2007081162A
公开(公告)日：2007-03-29
申请号：JP2005267572
申请日：2005-09-14
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： MATSUTANI MIHOKO , SAITO HIDENORI
IPC分类号： H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a multilayer interconnection structure excellent in a Cu diffusion, a heat resistance, an electrical performance, especially, a dielectric constant, and an adhesion; and to provide a semiconductor device having the structure and excellent in the electrical performance. SOLUTION: The semiconductor device comprises an insulating layer formed on a semiconductor substrate, an interconnection layer comprising a copper penetrating and buried in the insulating layer and an alloy including a copper, a nitrogenous layer having a function for preventing the diffusion of a copper for constituting an interconnection layer on at least the upper part of the interconnection layer and an alloy including a copper, and a layer comprising an organic insulating material having a function for preventing the diffusion of a copper constituting the interconnection layer and an alloy including a copper. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供Cu扩散，耐热性，电性能，特别是介电常数和粘合性优异的多层互连结构; 并且提供具有结构并且具有优异的电性能的半导体器件。解决方案：半导体器件包括形成在半导体衬底上的绝缘层，包括穿透并埋在绝缘层中的铜的互连层和包含铜的合金，具有防止扩散的功能的含氮层用于在互连层的至少上部构成互连层的铜和包含铜的合金，以及包含具有防止构成互连层的铜的扩散的功能的有机绝缘材料的层和包含铜。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2009256613A Optical component composition and optical component 审中-公开
标题翻译：光学元件组成和光学元件
公开(公告)号：JP2009256613A
公开(公告)日：2009-11-05
申请号：JP2009049514
申请日：2009-03-03
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI , OKI HIROMI , HORIMOTO AKIHIRO
IPC分类号： C08F299/02 , C08G81/00 , C08L77/10 , G02B1/04 , G02B6/12
摘要： PROBLEM TO BE SOLVED: To provide an optical component composition having excellent optical properties, heat resistance properties, adhesiveness properties and workability, and to provide an optical component having excellent optical properties and heat resistance. SOLUTION: The optical component composition contains a specific hydroxy amide polymer having a hydroxy group in an aromatic nucleus, a specific polyamide polymer having an ethynyl group on a side chain, and a solvent. The optical component is obtained when a film is formed by using the optical component composition, the hydroxy amide moiety of the hydroxy amide polymer in the optical component composition is subjected to a condensation reaction, and the amide polymer is subjected to a crosslinking reaction. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供具有优异的光学性能，耐热性，粘合性和加工性的光学组分组合物，并提供具有优异的光学性能和耐热性的光学组件。光学组合物组合物含有在芳香核中具有羟基的特定羟基酰胺聚合物，侧链上具有乙炔基的特定聚酰胺聚合物和溶剂。当通过使用光学组分组合物形成膜时获得光学组件，光学组件组合物中的羟基酰胺聚合物的羟基酰胺部分进行缩合反应，并且使酰胺聚合物进行交联反应。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009235385A Composition for optical component and optical component 审中-公开
标题翻译：光学元件和光学元件的组成
公开(公告)号：JP2009235385A
公开(公告)日：2009-10-15
申请号：JP2009029339
申请日：2009-02-12
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI , OKI HIROMI , HORIMOTO AKIHIRO
IPC分类号： C08L79/04 , C08G73/22 , C08L83/04 , G02B1/04 , G02B6/12 , G02B6/13
摘要： PROBLEM TO BE SOLVED: To provide a composition for optical components, excellent in optical characteristics, heat resistance, adhesive characteristics, processability and the like, and to provide the optical components excellent in optical characteristics and heat resistance. SOLUTION: The composition for the optical components comprises a hydroxyamide polymer represented by formula (A) [in formula (A), X represents a group selected from groups represented by following formula (B) (not shown) and two X's in the formula may be the same or different; Y represents at least one group selected from groups represented by following formula (C) (not shown), formula (D) (not shown), formula (E) (not shown)or formula (F) (not shown); Z represents a group selected from groups represented by formula (G) (not shown); m and n are 0 or an integer of ≥1 and m+n is an integer of ≥4; and the sequence of the recurring units in formula (A) is either of block-like and random-like], an alkoxysilane polymer represented by formula (I) and a solvent, wherein the hydroxyamide polymer has ≥5,000 but ≤15,000 weight-average molecular weight expressed in terms of standard polystyrene. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供光学特性，耐热性，粘合特性，加工性等优异的光学部件用组合物，提供光学特性和耐热性优异的光学部件。光学组分的组合物包含由式（A）表示的羟基酰胺聚合物[在式（A）中，X表示选自下式（B）表示的基团（未示出）和两个X' 该公式可以相同或不同; Y表示选自下列式（C）（未示出），式（D）（未示出），式（E）（未示出）或式（F）（未示出） Z表示选自式（G）表示的基团（未示出）的基团。 m和n为0或≥1的整数，m + n为≥4的整数; 式（A）中的重复单元的序列是块状和无规则的单体，式（I）表示的烷氧基硅烷聚合物和溶剂，其中羟基酰胺聚合物的重均分子量≥5,000，但≤15,000 分子量用标准聚苯乙烯表示。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009127045A Composition for optical component, optical component and optical device manufactured therefrom 审中-公开
标题翻译：光学元件，光学元件和光学器件的组成
公开(公告)号：JP2009127045A
公开(公告)日：2009-06-11
申请号：JP2007307453
申请日：2007-11-28
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI , OKI HIROMI , HORIMOTO AKIHIRO
IPC分类号： C08G69/26
摘要： PROBLEM TO BE SOLVED: To provide a composition for optical components, which is excellent in optical characteristics and heat resistance. SOLUTION: The composition for optical components comprises a solvent and the hydroxyamide polymer which has an unsaturated hydrocarbon group to be cross-linked by heat and/or active energy rays and is shown by formula (A) (wherein two Xs are selected from the groups shown by formula (B) and may be the same or different from each other; Y is selected from the groups shown by formula (C), formula (D), formula (E) and formula (F); Z is selected from the groups shown by formula (G); m is an integer of ≥1, n is an integer of ≥0 and (m+n) is an integer of ≥4, but the formulae (B) to (G) are not shown here). COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供光学特性和耐热性优异的光学部件用组合物。光学组分的组合物包括溶剂和具有通过加热和/或活性能量射线交联的不饱和烃基的羟基酰胺聚合物，并且由式（A）表示（其中选择两个X 从式（B）所示的基团可以相同或不同; Y选自式（C），式（D），式（E）和式（F）所示的基团; Z是选自由式（G）表示的基团; m为≥1的整数，n为≥0的整数，（m + n）为≥4的整数，式（B）〜（G）为这里未示出）。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2004303838A Method of forming organic insulating film 审中-公开
公开(公告)号：JP2004303838A
公开(公告)日：2004-10-28
申请号：JP2003092929
申请日：2003-03-28
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： FUNAOKA SOUHEI , SAITO HIDENORI , MURAYAMA MITSUMOTO
IPC分类号： H01L21/768 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a method of forming an organic insulating film which can be cured at a low temperature, has low relative permittivity, a low coefficient of water absorption, is high in heat-resistant properties, has a low leakage current, and is high in mechanical strength.
SOLUTION: The method of forming the organic insulating film comprises steps of obtaining a copolymer by making a compound having a structure represented by a formula (1) react on a reactive oligomer, dissolving the obtained copolymer into an organic solvent to obtain coating varnish, applying the coating varnish to form a film, subjecting the film to a condensation reaction and a crosslinking reaction by irradiating the film with an electron beam in a heated reduced-pressure atmosphere, and furthermore decomposing a part of the film formed of a reactive oligomer. In the formula, X Y denotes at least one kind of a tetravalent group and Y denotes one kind of a bivalent group. R
1 and R
2 denote hydrogen atoms or univalent groups, and m is an integer of 1 to 1,000.
COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2003277504A Material for insulating film, coating varnish for insulating film, insulating film and semiconductor device using it 审中-公开
标题翻译：绝缘膜绝缘材料，绝缘膜绝缘膜，绝缘膜和使用其的半导体器件
公开(公告)号：JP2003277504A
公开(公告)日：2003-10-02
申请号：JP2002082415
申请日：2002-03-25
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： MURATA MITSURU , HIRATA AKIHIRO , SAITO HIDENORI , TADA MASAHIRO , NAKAJIMA MICHIO
IPC分类号： C09D5/25 , C08G73/22 , C09D161/06 , C09D171/00 , C09D177/10 , H01B3/00 , H01B3/30 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for an insulating film and an insulating film using the resin composition in semiconductor applications that are excellent in thermal characteristics, electrical characteristics, mechanical characteristics and water absorption resistance and achieve the reduction of a dielectric constant.
SOLUTION: The insulating film is formed by using the resin composition for an insulating film produced by reacting (1) a polyamide containing an acetylene group with a repeating unit represented by formula (A) or (2) a bisaminophenol compound represented by formula (B): H
2 N-(X
3 )-NH
2 and (3) an activated modified polyalkylene glycol produced by reacting a dicarboxylic acid derivative having a group selected from the structures represented by formulae (C)-(F) with a polyalkylene glycol and its derivative in a molar ratio of the dicarboxylic acid derivative to the polyalkylene glycol and its derivative of 0.1-10 to 1.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种使用半导体应用中的树脂组合物的绝缘膜和绝缘膜的树脂组合物，其具有优异的热特性，电特性，机械特性和耐吸水性，并实现了介电常数。解决方案：通过使用通过使（1）含有乙炔基的聚酰胺与式（A）或（2）所示的重复单元反应制备的绝缘膜的树脂组合物形成绝缘膜，所述双胺基化合物由式（B）：H（SBB）N（X SB 3）-NH SB 2和（3）活化的改性聚亚烷基二醇，其通过使二羧酸衍生物，其具有选自式（C） - （F）所示结构的聚亚烷基二醇及其衍生物，其中二羧酸衍生物与聚亚烷基二醇及其衍生物的摩尔比为0.1-10:1。版权所有（C）2004，JPO

10. 发明专利

JP2014047200A Cyanate ester compound, resin composition, prepreg, laminated board, resin sheet, multilayer printed wiring board, and semiconductor device 有权
标题翻译：氰酸酯化合物，树脂组合物，PREPREG，层压板，树脂片，多层印刷线路板和半导体器件
公开(公告)号：JP2014047200A
公开(公告)日：2014-03-17
申请号：JP2012193880
申请日：2012-09-04
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： SAITO HIDENORI , EDAGAWA SATOSHI
IPC分类号： C07C261/02 , B32B15/08 , C08G59/40 , C08J5/24 , C08K3/00 , C08L63/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a cyanate ester compound and a resin composition which have excellent moisture absorption resistance, high heat resistance, low dielectric characteristics, low thermal expansion properties, and excellent flame retardancy, and to provide a prepreg, a resin sheet, a laminated board, a multilayer printed wiring board, and a semiconductor device that use the resin composition and have excellent balance among characteristics.SOLUTION: A fluorene cyan type acid ester compound has a predetermined structure. A resin composition, a prepreg, and a resin sheet use the resin.
摘要翻译：要解决的问题：提供具有优异的耐吸湿性，高耐热性，低介电特性，低热膨胀性和优异的阻燃性的氰酸酯化合物和树脂组合物，并且提供预浸料，树脂片，层压板，多层印刷线路板和使用该树脂组合物并具有优异的特性之间的平衡的半导体器件。解决方案：芴青酸型酸酯化合物具有预定的结构。树脂组合物，预浸料和树脂片使用树脂。

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