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1. 发明专利

JP2010238866A Method of manufacturing light-emitting apparatus 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2010238866A
公开(公告)日：2010-10-21
申请号：JP2009084420
申请日：2009-03-31
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： YAMAGUCHI SEIJI , MORIYAMA MIKI , WADA SATOSHI , SUEHIRO YOSHINOBU , AIDA KAZUYA , WATABE HIROMI
IPC分类号： H01L33/52 , H01L21/56 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting apparatus with which a glass material is prevented from being deposited on a metal die or an upper surface of the glass material is prevented from being deformed with respect to an expected shape. SOLUTION: The present invention relates to a method of manufacturing a light-emitting apparatus in which a light-emitting element 2 on a mounting part 3 is sealed by a glass material 60, and the method includes a coat film forming step of forming a coat film 7 of a non-glass material with a fusing point higher than that of the glass material 60 on an upper surface of the glass material 60, and a sealing step of bringing a molding surface 92a of a metal die 92 into contact with the upper surface of the glass material 60 via the coat film 7, bringing a lower surface of the glass material 60 into contact with the mounting part 3, and softening the glass material 60 by heating to seal the light-emitting element 2 on the mounting part 3. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种制造防止玻璃材料沉积在金属模具上的发光装置的方法，或者防止玻璃材料的上表面相对于金属模具变形预期形状。解决方案：本发明涉及一种制造发光装置的方法，其中安装部分3上的发光元件2被玻璃材料60密封，并且该方法包括：涂膜形成步骤在玻璃材料60的上表面上形成具有高于玻璃材料60的熔点的非玻璃材料的涂膜7，以及将金属模具92的模制表面92a接触的密封步骤与玻璃材料60的上表面通过涂膜7，使玻璃材料60的下表面与安装部3接触，并且通过加热软化玻璃材料60以将发光元件2密封在安装第3部分。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2009177131A Method for manufacturing phosphor-containing glass plate and method for manufacturing light-emitting device 有权
标题翻译：制造含磷玻璃板的方法和制造发光装置的方法
公开(公告)号：JP2009177131A
公开(公告)日：2009-08-06
申请号：JP2008253608
申请日：2008-09-30
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： YAMAGUCHI SEIJI , NONOKAWA TAKASHI , SUEHIRO YOSHINOBU , WATABE HIROMI , AIDA KAZUYA
IPC分类号： C03C8/24 , H01L21/56 , H01L23/29 , H01L23/31 , H01L33/32 , H01L33/42 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To obtain a light-emitting device excellent in thermal resistance, light stability, and gas impermeability, while preventing the degradation of phosphor which is inferior in humidity resistance. SOLUTION: The method of manufacturing a light-emitting device 1 (LED lamp) which seals a light-emitting element 2 by phosphor-containing glass includes: a mixing step of mixing a glass powder with a phosphor powder including at least one of sulfide phosphor and aluminate phosphor, and silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder; a step of producing glass, after heating and softening the mixed powder to provide an integrated material, subsequently solidifying the integrated material to provide a phosphor-dispersed glass; and a glass sealing step of fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light-emitting element is mounted by hot pressing and to seal the light-emitting element with the phosphor-dispersed glass on the mounting portion. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得耐热性，光稳定性和不透气性优异的发光装置，同时防止耐湿性差的荧光体的劣化。解决方案：通过含荧光体玻璃密封发光元件2的发光装置1（LED灯）的制造方法包括：将玻璃粉末与包含至少一个的荧光体粉末混合的混合步骤的硫化物荧光体和铝酸盐荧光体，以及硅酸盐荧光体，以产生其中荧光体粉末分散在玻璃粉末中的混合粉末; 在加热和软化混合粉末以提供一体化材料之后，随后固化一体化材料以提供荧光体分散玻璃的步骤; 以及玻璃密封步骤，通过热压将分散有荧光体的玻璃熔融到其上安装有发光元件的安装部分上，并将发光元件与分散有荧光体的玻璃密封在安装部分上。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2007080994A Solid element device and light emitting device employing it 有权
标题翻译：固体元件装置和使用其的发光装置
公开(公告)号：JP2007080994A
公开(公告)日：2007-03-29
申请号：JP2005264896
申请日：2005-09-13
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SAWANOBORI SHIGETO , OTSUKA MASAAKI , AIDA KAZUYA , SAKAJI HIROKO , WATABE HIROMI , YAMAGUCHI SEIJI , SUEHIRO YOSHINOBU , TAKAKU KOJI
IPC分类号： H01L33/32 , H01L33/40 , H01L33/46 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a solid element device capable of dispersing fluorescent body uniformly into glass, and the light emitting device employing it.
SOLUTION: An LED (light emitting diode) element 12 is mounted on a ceramic substrate 11 while the LED element 12 is sealed by a wavelength changing unit 20 consisting of a fluorescent layer 13 provided in sealing glass 14. The fluorescent layer 13 is formed by mixing fluorescent body into glass filler to apply or print it on the inner surface of one sheet in two sheets of sealing glasses before effecting hot press.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够将荧光体均匀地分散在玻璃中的固体元件装置和使用它的发光装置。解决方案：LED（发光二极管）元件12安装在陶瓷基板11上，而LED元件12被由设置在密封玻璃14中的荧光层13组成的波长改变单元20密封。荧光层13 通过将荧光体混合到玻璃填料中以在进行热压之前在两片密封玻璃的一片的内表面上进行涂布或印刷而形成。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2012064787A Method of manufacturing light-emitting device 审中-公开
标题翻译：制造发光装置的方法
公开(公告)号：JP2012064787A
公开(公告)日：2012-03-29
申请号：JP2010208147
申请日：2010-09-16
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： YAMAGUCHI SEIJI , TAKAKU KOJI , TAJIMA HIROYUKI , WADA SATOSHI , MORIYAMA MIKI , AIDA KAZUYA , WATABE HIROMI
IPC分类号： H01L33/56
CPC分类号： C03C27/00 , H01L33/56 , H01L2224/13 , H01L2933/005
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device in which thermal damage on a light-emitting element can be suppressed during hot press of the light-emitting device having a glass-sealed light-emitting element mounted on a substrate.SOLUTION: The method of manufacturing a light-emitting device comprises: a first step of heating a low melting point glass 4 arranged to face an upper die 61 by means of the upper die 61 heated to a temperature higher than the yield temperature of the low melting point glass 4; and a second step of sealing an LED element 2 mounted on an AlOsubstrate 3 with the low melting point glass 4 by pressing the low melting point glass 4 and the AlOsubstrate 3 supported on a lower die 51 while facing each other in a state where the low melting point glass 4 is heated above the yield temperature.
摘要翻译：解决的问题：提供一种制造发光器件的方法，其中在具有玻璃密封发光元件的发光器件的热压期间可以抑制发光元件的热损伤安装在基板上。解决方案：制造发光器件的方法包括：第一步骤，通过加热到高于屈服温度的上模61加热布置成面对上模61的低熔点玻璃4 的低熔点玻璃4; 以及用低熔点玻璃4密封安装在Al 2 O 3 衬底3上的LED元件2的第二步骤通过按压低熔点玻璃4和支撑在下模51上同时彼此面对的Al 2 O 3 在低熔点玻璃4被加热到高于屈服温度的状态下。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011097020A Method of manufacturing light emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2011097020A
公开(公告)日：2011-05-12
申请号：JP2010177034
申请日：2010-08-06
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： AIDA KAZUYA , WATABE HIROMI , YAMAGUCHI SEIJI , SUEHIRO YOSHINOBU
IPC分类号： H01L33/56
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting device, which suppresses peeling of a glass material from a mounting substrate, and can cause characteristics of each light emitting element to approach uniformity further, when two or more light emitting elements are collectively sealed by the glass material.
SOLUTION: The method of manufacturing the light emitting element includes: a mounting step in which two or more light emitting elements 2 are mounted on the mounting area of the mounting surface of a mounting substrate 3; a press preparation step in which a die 92 is placed opposite to the mounting surface of the mounting substrate 3 and a glass material is arranged between the mounting substrate 3 and the die 92 so as to cover at least the mounting area; and a press step in which the glass material softened by heating is pressed by the die 92 and each light emitting element 2 is collectively sealed by the glass material under the conditions where an outflow suppression section 921 is provided that suppresses outflow of the glass material to the outside of the mounting area.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造发光器件的方法，其抑制玻璃材料从安装基板的剥离，并且可以使得每个发光元件的特性进一步接近均匀性，当两个或更多个光发光元件由玻璃材料共同密封。解决方案：制造发光元件的方法包括：安装步骤，其中两个或更多个发光元件2安装在安装基板3的安装表面的安装区域上; 压模准备步骤，其中模具92与安装基板3的安装表面相对放置，玻璃材料布置在安装基板3和模具92之间，以至少覆盖安装面积; 以及通过加热软化的玻璃材料被模具92按压的压制工序，并且在设置有抑制玻璃材料流出的条件下，玻璃材料共同密封各发光元件2 外部安装区域。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2008085361A Solid-state element device 有权
标题翻译：固体元件装置
公开(公告)号：JP2008085361A
公开(公告)日：2008-04-10
申请号：JP2007299908
申请日：2007-11-19
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , INOUE MITSUHIRO , KATO HIDEAKI , JINME KUNIHIRO , TOUMON RYOICHI , WADA SATOSHI , OTA KOICHI , AIDA KAZUYA , WATABE HIROMI , YAMAMOTO YOSHINORI , OTSUKA MASAAKI , SAWANOBORI SHIGETO
IPC分类号： H01L33/32 , H01L33/44 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/16225 , H01L2224/45 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01057 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solid element device for manufacturing solid element device having a highly reliable sealing structure and realizing a low temperature glass sealing process. SOLUTION: A P 2 O 5 -ZnO based low temperature melting glass is placed in parallel to a glass containing Al 2 O 3 substrate 3 having a GaN based LED element 2 mounted thereon, then hot pressed in nitrogen atmosphere under a pressure of 60 kgf at a temperature of 415°C or higher. The low temperature melting glass is adhered on the glass containing Al 2 O 3 substrate 3 via an oxide formed thereon, while the viscosity of the low temperature melting glass is 10 9 poise at the condition. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造具有高可靠性密封结构并实现低温玻璃密封工艺的固体元件装置的固体元件装置。
解决方案：将AP 2 基于-ZnO的低温熔融玻璃平行于含有Al SB 2 O SB > 3 衬底3，其上安装有GaN基LED元件2，然后在氮气气氛中在60kgf的压力下在415℃或更高的温度下热压。低温熔融玻璃通过其上形成的氧化物粘附在含有Al 2 SB 3 O 3 SB 3基体3的玻璃上，而低温熔融玻璃的粘度为10 9 在条件下平静。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2006108621A Solid-state element device 有权
标题翻译：固态元件设备
公开(公告)号：JP2006108621A
公开(公告)日：2006-04-20
申请号：JP2005140284
申请日：2005-05-12
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , YAMAGUCHI SEIJI , SAWANOBORI SHIGETO , OTSUKA MASAAKI , AIDA KAZUYA , WATABE HIROMI
IPC分类号： H01L23/10 , H01L31/02 , H01L33/10 , H01L33/32 , H01L33/44 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L24/97 , H01L2224/16225 , H01L2924/12041 , H01L2924/15787 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solid-state element device with which the problem for embodying inorganic material sealing work is extracted and solved, and expected effect can actually be obtained by glass sealing, which is constituted of low expansion coefficient materials and can correspond to dense packaging of an optical element and to a solid-state element of a large size. SOLUTION: Since a coefficient of thermal expansion of an LED element 2 and that of a glass sealing part 6 are equivalent, the coefficients of thermal expansion of members comprising an Al 2 O 3 substrate 3 become equivalent. Increase of inner stress is suppressed in high temperature work in glass sealing and stable workability without a crack can be obtained. Inner stress can be made small. Thus, glass sealing-type LED whose shock resistance improves and which is superior in reliability can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提取和解决体现无机材料密封作业的问题的固态元件装置，并且由低膨胀系数材料构成的玻璃密封实际上可以获得预期的效果并且可以对应于光学元件和大尺寸的固态元件的致密封装。解决方案：由于LED元件2的热膨胀系数和玻璃密封部件6的热膨胀系数相等，所以包含Al 2 SB 3的构件的热膨胀系数衬底3变得相当。在玻璃密封的高温加工中，内应力的增加被抑制，并且可以获得稳定的加工性而不产生裂纹。内应力可小因此，可以获得耐冲击性提高且可靠性优异的玻璃密封型LED。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2010186887A Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2010186887A
公开(公告)日：2010-08-26
申请号：JP2009030360
申请日：2009-02-12
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： AIDA KAZUYA , WATABE HIROMI , YAMAGUCHI SEIJI , SUEHIRO YOSHINOBU
IPC分类号： H01L33/54 , H01L33/56
CPC分类号： H01L33/52 , H01L33/56 , H01L2224/05001 , H01L2224/05023 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device which never adheres a glass material to a metal mold and never deforms curved surfaces of the glass material with respect to their desired shape because of gas generated during sealing. SOLUTION: In the method of manufacturing the light emitting device 1, when light-emitting elements 2 on a mount 3 are sealed with the glass material 11 which is softened by heating, the glass material 11 is partially dented by partially bringing the metal mold 92 into contact with the top of the glass material 11 and pushing it into it. In this manner, parts of the top of the glass material 11 which are out of contact with the metal mold 92 are deformed and curved surfaces are formed in at least part of the top of the glass material 11. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造发光装置的方法，该发光装置不会将玻璃材料粘附到金属模具上，并且由于在密封期间产生的气体而不会使玻璃材料的弯曲表面相对于其所需形状变形。解决方案：在制造发光器件1的方法中，当通过加热软化的玻璃材料11密封安装件3上的发光元件2时，通过部分地使玻璃材料11部分地凹陷金属模具92与玻璃材料11的顶部接触并将其推入其中。以这种方式，与金属模具92不接触的玻璃材料11的顶部的部分变形，并且在玻璃材料11的顶部的至少一部分中形成弯曲表面。版权所有（C））2010，JPO＆INPIT

9. 发明专利

JP2006080317A Solid-state element device 有权
标题翻译：固态元件设备
公开(公告)号：JP2006080317A
公开(公告)日：2006-03-23
申请号：JP2004263098
申请日：2004-09-09
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SAWANOBORI SHIGETO , OTSUKA MASAAKI , AIDA KAZUYA , WATABE HIROMI , SUEHIRO YOSHINOBU
IPC分类号： H01L33/32 , H01L33/44 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a solid-state element device in which an expected effect can be actually obtained by performing glass sealing after extracting and solving a problem for realizing inorganic material sealing work, further, humidity resistance is improved, and losing of transparency in glass sealing and cloudiness in characteristic evaluation do not occur.
SOLUTION: In a light emitting device 1 as a solid-state element device, a glass sealing part 6 is formed by performing hot press working of low fusing point glass of P
2 O
5 -ZnO-Li
2 O in a predetermined atmosphere for a glass containing Al
2 O
3 substrate 3 with a GaN LED element 2 mounted thereon. The glass sealing part 6 is worked at a temperature sufficiently lower than the crystal growth temperature of the GaN LED element 2. Thus, the light emitting device 1 can be obtained with humidity resistance and transparency and without occurrence of thermal element destruction.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种固体元件装置，其中通过在提取之后进行玻璃密封并且解决实现无机材料密封作业的问题而实际获得预期效果，此外，提高了耐湿性，并且不会发生玻璃密封的透明性和特性评估中的混浊。解决方案：在作为固态元件装置的发光装置1中，通过对P 2 O 的低熔点玻璃进行热压加工，形成玻璃密封部6，在具有GaN LED的含有Al 2 SB 3 O 3 SB 3衬底3的玻璃的预定气氛中，5S-ZnO-Li 2 元件2安装在其上。玻璃密封部6在比GaN LED元件2的晶体生长温度充分低的温度下进行加工。因此，可以获得耐湿性和透明性而不发生热元件破坏的发光器件1。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2011210852A Method for manufacturing light emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2011210852A
公开(公告)日：2011-10-20
申请号：JP2010075609
申请日：2010-03-29
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： AIDA KAZUYA , WATABE HIROMI , YAMAGUCHI SEIJI , SUEHIRO YOSHINOBU
IPC分类号： H01L33/52
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting device capable of suppressing peeling of a glass material from a mounting substrate and allowing characteristics of respective light emitting elements to be further uniform in case a plurality of light emitting elements are collectively sealed using the glass material.SOLUTION: The method for manufacturing a light emitting element includes: a mounting step in which a plurality of light emitting elements 2 are mounted on a mounting region of a mounting surface 3a of a mounting substrate 3; a press preparation step in which a metal die 92 is arranged to face the mounting surface 3a of the mounting substrate 3, a glass material is arranged between the mounting substrate 3 and the metal die 92 such that at least the mounting region is covered, and a suppressing wall member 93 is arranged which suppresses flowing out of the glass material to the outside of the material region; and a pressing step to collectively sealing the light emitting elements 2 with the glass material by pressing the glass material that has been softened under heat by using the metal die 92.
摘要翻译：要解决的问题：提供一种制造能够抑制玻璃材料从安装基板剥离的发光装置的方法，并且在多个发光元件被集体密封的情况下允许各个发光元件的特性更加均匀使用玻璃材料。方案：用于制造发光元件的方法包括：安装步骤，其中多个发光元件2安装在安装基板3的安装表面3a的安装区域上; 其中金属模具92布置成面向安装基板3的安装表面3a的压制准备步骤，玻璃材料布置在安装基板3和金属模具92之间，使得至少安装区域被覆盖，并且抑制壁构件93被布置成抑制从玻璃材料流出到材料区域的外部; 以及通过使用金属模具92挤压已经在加热下软化的玻璃材料的方式将发光元件2与玻璃材料共同密封的压制步骤。

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