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1. 发明专利

JP2013232756A Optical module 审中-公开
标题翻译：光学模块
公开(公告)号：JP2013232756A
公开(公告)日：2013-11-14
申请号：JP2012103133
申请日：2012-04-27
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , EZAKI TAKAYUKI , OIDE TOMOSHI
IPC分类号： H04N5/225 , H01L27/14
CPC分类号： H01L25/18 , H01L24/45 , H01L24/49 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14634 , H01L27/14636 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/1434 , H01L2924/15787 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00 , H01L2224/45015 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To suppress occurrence of a ghost.SOLUTION: This optical module comprises: a sensor which images a subject; and a memory chip which stores pixel data read by the sensor and is joined with the sensor, the memory chip being connected with a substrate via a connection part of a flip chip. The sensor can be connected with the memory chip joined with the sensor, via a wire. Furthermore, the sensor can be so joined to the memory chip as to project toward the opening of the substrate. This technique can be applied to a camera module.
摘要翻译：要解决的问题：抑制鬼的发生。解决方案：该光学模块包括：对被摄体进行成像的传感器; 存储芯片，其存储由传感器读取并与传感器接合的像素数据，存储芯片经由倒装芯片的连接部与基板连接。传感器可以通过导线与与传感器连接的存储芯片连接。此外，传感器可以如此接合到存储器芯片，以向基板的开口突出。该技术可以应用于相机模块。

2. 发明专利

JP2013038628A Camera module, manufacturing apparatus, and manufacturing method 审中-公开
标题翻译：相机模块，制造设备和制造方法
公开(公告)号：JP2013038628A
公开(公告)日：2013-02-21
申请号：JP2011173694
申请日：2011-08-09
申请人： Sony Corp , ソニー株式会社
发明人： SHIMIZU MASAHIKO , IWABUCHI TOSHIAKI
IPC分类号： H04N5/225 , G02B7/02 , G02B7/04 , H04N5/232
CPC分类号： H04N5/2254 , Y10T29/49002 , Y10T29/5313
摘要： PROBLEM TO BE SOLVED: To realize the connection between an actuator for driving a lens of a camera and a printed board in a limited space.SOLUTION: An imaging sensor has a light receiving surface receiving light condensed by a lens unit composed of a lens and a driving part driving the lens. A conductive member connects with the driving part and supplies electric power to the driving part. The imaging sensor and the conductive member are disposed on the printed board, and a sealing member is formed by sealing the imaging sensor and the conductive member with a connection part of the conductive member, which connects with the driving part, and the light receiving surface exposed. The disclosed invention can be applied to a camera module having an imaging sensor and the like for example.
摘要翻译：要解决的问题：在有限的空间中实现用于驱动照相机的镜头的致动器与印刷电路板之间的连接。解决方案：成像传感器具有接受由透镜组成的透镜单元和驱动透镜的驱动部分聚光的光的受光面。导电构件与驱动部分连接，并向驱动部分供电。成像传感器和导电构件设置在印刷电路板上，并且密封构件通过用与驱动部分连接的导电构件的连接部分和受光面密封成像传感器和导电构件而形成裸露。所公开的发明可以应用于具有成像传感器等的相机模块。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013034046A Camera module, manufacturing apparatus, and manufacturing method 审中-公开
标题翻译：相机模块，制造设备和制造方法
公开(公告)号：JP2013034046A
公开(公告)日：2013-02-14
申请号：JP2011168024
申请日：2011-08-01
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , FURUSAWA TOSHIHIRO , HIGASHITSUTSUMI YOSHIHITO
IPC分类号： H04N5/335 , G02B7/02 , H04N5/225 , H04N5/232
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/13 , Y10T29/49117 , Y10T29/53204
摘要： PROBLEM TO BE SOLVED: To control the driving of a lens from a camera module.SOLUTION: An imaging sensor has a light receiving surface receiving light condensed by a lens, and through silicon vias (TSV) are formed on a surface of the imaging sensor, which has the light receiving surface, and conduct power supply. An electrode and a bump electrically connect each TSV with an electrode provided at an actuator driving the lens in response to the power supply from the TSV. A seal member is formed by sealing the electrode and the bump. This disclosed invention may be applied to a camera module or the like which has the imaging sensor.
摘要翻译：要解决的问题：控制从相机模块驱动镜头。解决方案：成像传感器具有接收由透镜聚光的光的光接收表面，并且在具有光接收表面的成像传感器的表面上形成硅通孔（TSV），并且进行电源供应。电极和凸块电连接每个TSV与响应于来自TSV的电源的驱动透镜的致动器处提供的电极。通过密封电极和凸起来形成密封构件。该公开的发明可以应用于具有成像传感器的相机模块等。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013030526A Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：JP2013030526A
公开(公告)日：2013-02-07
申请号：JP2011163935
申请日：2011-07-27
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H01L27/14 , H04N5/335
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L2224/16
摘要： PROBLEM TO BE SOLVED: To suppress the occurrence of flare and ghost.SOLUTION: A solid-state imaging device includes: a substrate having an opening; and a solid-state imaging element which is flip-chip mounted on a lower surface on the periphery of the opening of the substrate, receives light which is taken in by a lens disposed on an upper surface of the substrate and enters from the opening, and photoelectrically converts the light. The periphery of the opening of the substrate is formed with a thickness less than that of the other part of the substrate. This technique is applicable, for example, to a camera module mounted on a cellular phone with a camera.
摘要翻译：要解决的问题：抑制耀斑和鬼影的发生。固体成像装置包括：具有开口的基板; 以及在基板的开口的周围的下表面上倒装芯片的固体摄像元件，接收由设置在基板的上表面上的透镜吸收的光，并从开口进入，并对光进行光电转换。衬底的开口的周边形成的厚度小于衬底的另一部分的厚度。该技术适用于例如安装在具有相机的蜂窝电话上的相机模块。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008077100A Image display unit 有权
标题翻译：图像显示单元
公开(公告)号：JP2008077100A
公开(公告)日：2008-04-03
申请号：JP2007279366
申请日：2007-10-26
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , OHATA TOYOJI , DOI MASATO
IPC分类号： G09F9/33 , G09G3/20 , G09G3/32 , H01L33/32 , H01L33/38 , H01L33/52 , H01L33/56 , H01L33/62
CPC分类号： H01L24/75 , H01L24/95
摘要： PROBLEM TO BE SOLVED: To provide an image display unit which is excellent in various characteristics such as resolution, quality of image, and emission efficiency, whose screen size can be easily increased, whose manufacturing cost can be reduced, and by which problems such as wiring defect can be solved. SOLUTION: In the image display unit where a plurality of light emitting devices are arranged so as to display images in accordance with a required image signal, the occupied area of one light emitting device is set to 25 to 10,000 μm 2 , and the plurality of the light emitting devices are mounted on a substrate for wiring respectively and also embedded in sealants that are each solidified, an electrode pad which has a larger area than each of the light emitting devices and electrically connected to the light emitting element is formed on the flattened surface of the sealant. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种图像显示单元，其图像显示分辨率，图像质量和发光效率都是优异的，其屏幕尺寸可以容易地增加，其制造成本可以降低，并且由此可以解决布线缺陷等问题。解决方案：在其中布置多个发光器件以根据所需图像信号显示图像的图像显示单元中，一个发光器件的占用面积被设置为25至10,000μm 2，并且多个发光器件分别安装在用于布线的基板上，并且还嵌入每个固化的密封剂中，电极焊盘的面积大于每个发光器件并电连接在密封剂的扁平表面上形成发光元件。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007073995A Image display 有权
标题翻译：图像显示
公开(公告)号：JP2007073995A
公开(公告)日：2007-03-22
申请号：JP2006327155
申请日：2006-12-04
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , OHATA TOYOJI , DOI MASATO
IPC分类号： G09F9/33 , H01L33/32 , H01L33/36 , H01L33/48
CPC分类号： H01L24/75 , H01L24/95
摘要： PROBLEM TO BE SOLVED: To provide an image display that is excellent in various characteristics such as resolution, quality of image, and emission efficiency, easily enlarges a screen, can also realize the reduction of a manufacturing cost, and can solve problems such as wiring defect. SOLUTION: In the image display where a plurality of light emitting devices are arranged so as to indicate images in accordance with a required image signal, an occupied area of one light emitting device is set at 25 μm 2 or more and 10,000 μm 2 or less, a plurality of the light emitting devices are each mounted on a wiring substrate, a plurality of the light emitting devices are configured by being embedded in sealants that are each solidified, while having an area bigger than those of the light emitting devices on the flattened surfaces of the sealants and forming electrode pads 11, 12 electrically connected to the light emitting devices. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供分辨率，图像质量和排放效率等各种特性优异的图像显示器，可以容易地扩大屏幕，还可以实现制造成本的降低，并且可以解决问题如布线缺陷。解决方案：在其中布置多个发光器件以根据所需图像信号指示图像的图像显示器中，一个发光器件的占用面积被设置为25μm 2 < SP>以上且10,000μm以上的情况下，将多个发光元件分别安装在配线基板上，将多个发光元件嵌入密封剂中，固化，同时具有比密封剂的扁平表面上的发光器件的面积大的区域，并且形成电连接到发光器件的电极焊盘11,12。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007034315A Method of producing image display unit 有权
标题翻译：制作图像显示单元的方法
公开(公告)号：JP2007034315A
公开(公告)日：2007-02-08
申请号：JP2006224494
申请日：2006-08-21
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI , OHATA TOYOJI , DOI MASATO
IPC分类号： G09F9/33 , F21S2/00 , F21V19/00 , F21Y101/02 , G02F1/13357 , H01L33/04 , H01L33/06 , H01L33/16 , H01L33/24 , H01L33/30 , H01L33/38 , H01L33/56 , H01L33/62
CPC分类号： H01L24/75 , H01L24/95 , H01L2224/16245 , H01L2224/48091 , H01L2224/73204 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of producing an image display unit which enables high definition image display, which can be produced in a short period of time, and with which production cots can be reduced. SOLUTION: In the method of producing the image display unit, wherein a plurality of light emitting elements are arrayed and images are displayed in response to a required image signals, a substrate 290 for wiring on which required wiring 291, 292 are formed and an adhesive layer 293 to be a sealing agent is formed is provided on a main surface, the plurality of light emitting elements (271, 272, 273, 274, 277) in which occupation area of one element is ≥25μm 2 and ≤10,000μm 2 are formed on the substrate 290 for forming elements, light emitting elements after stripped from the substrate for forming elements are embedded in the adhesive layer of the substrate 290 for wiring and mounted so as to be connected to the wiring 291, 292. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在短时间内生产能够进行高清晰度图像显示的图像显示单元的制造方法，并且可以减少生产床。解决方案：在制造图像显示单元的方法中，其中排列多个发光元件并响应于所需图像信号显示图像;在其上形成所需布线291,292的布线用基板290 并且在主表面上形成作为密封剂的粘合层293，其中一个元件的占用面积≥25μm 2的多个发光元件（271,272,273,274,277）在用于形成元件的基板290上形成和≤10,000μm 2 ，从用于成形元件的基板剥离后的发光元件嵌入在用于布线的基板290的粘合剂层中，安装以连接到布线291,292。（C）2007年，JPO和INPIT

8. 发明专利

JP2005276879A Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2005276879A
公开(公告)日：2005-10-06
申请号：JP2004083947
申请日：2004-03-23
申请人： Sony Corp , ソニー株式会社
发明人： SASAKI NAOTO , ISHIKAWA NATSUYA , IWABUCHI TOSHIAKI , IMOTO KAZUNOBU
IPC分类号： H01L21/56
CPC分类号： H01L2224/16225 , H01L2224/26175 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce the size of the contour of a mounting substrate after securely preventing the effluence of an underfill material. SOLUTION: The semiconductor device includes the mounting substrate 1 wherein an electrode pad 4 is formed around a chip mounting region rectangular as viewed in a plane, and a dam 5 is provided between the chip mounting region and the formation region of the electrode pad 4; a semiconductor chip 2 flip-chip mounted on the chip mounting region of the mounting substrate 1; and the underfill material 6 filled between the mounting substrate 1 and the semiconductor chip 2. In the semiconductor device, a distance between the predetermined side of the chip mounting region onto which the underfill material 6 is dropped upon the manufacturing of the semiconductor device and the dam 5 corresponding to the side is set longer than a distance between another side of the chip mounting region and the dam 5 corresponding to the side. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在可靠地防止底部填充材料的流出之后，减小安装基板的轮廓尺寸。解决方案：半导体器件包括安装基板1，其中电极焊盘4形成在从平面观察的矩形矩形的芯片安装区域周围，并且在芯片安装区域和电极的形成区域之间设置有堤坝5 垫4; 安装在安装基板1的芯片安装区域上的半导体芯片2倒装芯片; 并且底部填充材料6填充在安装基板1和半导体芯片2之间。在半导体器件中，在制造半导体器件时，底部填充材料6掉下的芯片安装区域的预定侧之间的距离和相对于侧面的坝5被设定为比芯片安装区域的另一侧与对应于侧面的坝5之间的距离长。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2004273480A Wiring board, its manufacturing method, and semiconductor device 审中-公开
公开(公告)号：JP2004273480A
公开(公告)日：2004-09-30
申请号：JP2003057950
申请日：2003-03-05
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H05K1/11 , H05K3/40
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which the reliability of electrode connection is raised so as to prevent the occurrence of short-circuiting by filling in a conductive material in holes in a desired section and an insulating material in the other holes by using an anodically oxidized film. SOLUTION: This wiring board 10 is provided with a substrate composed of a porous metal oxide film 11 in which many through holes 12 are formed, a conductive material 13 filled in the through holes 12 formed at the positions at which the electrodes of the substrate are disposed, and an insulating material 14 filled in the other through holes 12 than the through holes 12 in which the conductive material 13 is filled in. COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2004047617A Mounting structure of electronic component and manufacturing method thereof 审中-公开
公开(公告)号：JP2004047617A
公开(公告)日：2004-02-12
申请号：JP2002201295
申请日：2002-07-10
申请人： Sony Corp , ソニー株式会社
发明人： IWABUCHI TOSHIAKI
IPC分类号： H05K1/18 , H01L21/60 , H01L25/16 , H01L33/56 , H01L33/00
CPC分类号： H01L24/82 , H01L2224/24 , H01L2224/24051 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component and its manufacturing method wherein a connection hole is easily formed and reliability in wiring is enhanced.
SOLUTION: The thickness of an insulating layer 2 is so controlled as to match a difference in thicknesses of a resin chip 5 and an IC chip 6 to be mounted. The insulating layers 2 and 3 are partially removed and mounted directly on a substrate 1. The resin chip 5 is mounted on an insulating layer 3. Thus, an electrode 9 of the IC chip 6 is formed to have the same height as that of an electrode 11b of the resin chip 5. Therefore, the connection holes for these electrodes are worked in batch under identical work conditions, and a connection hole 15a of bottom layer wiring can be made shallow with a low aspect ratio for proper wiring.
COPYRIGHT: (C)2004,JPO

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