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    • 4. 发明专利
    • Method of manufacturing electronic circuit board and electronic circuit board using the same
    • 使用该方法制造电子电路板和电子电路板
    • JP2009206443A
    • 2009-09-10
    • JP2008049931
    • 2008-02-29
    • Sinto Brator Co Ltd新東ブレーター株式会社
    • YAMAGUCHI EIJINIWA AKIRA
    • H05K3/40C23C24/04H05K1/03H05K1/09
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit board capable of definitely forming a conductor that is to be an electrode or interconnect by efficiently attaching and depositing conductive metal particles onto throughout holes or blind holes beforehand formed in the electronic circuit board.
      SOLUTION: The method of forming a conductor that is to be an electrode or interconnect by attaching and depositing conductive metal particles onto the throughout holes or blind holes beforehand formed in the electronic circuit board with cold spray process. The conductive metal particles and pressurized mixed gas of a temperature of 20 to 400°C are jetted into the throughout holes or blind holes, thereby plastically deforming the conductive metal particles with the solid state kept as it stand to be attached and deposited in the holes to fill them with the metal particles.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种制造电子电路板的方法,其能够通过有效地将导电金属颗粒附着并沉积到预先形成在 电子电路板。 解决方案:通过用冷喷涂方法将导电金属颗粒附着并沉积到预先形成在电子电路板中的整个孔或盲孔上,形成作为电极或互连的导体的方法。 将导电金属颗粒和温度为20-400℃的加压混合气体喷射到整个孔或盲孔中,从而使固态保持固态的导电金属颗粒塑性变形以附着和沉积在孔中 用金属颗粒填充它们。 版权所有(C)2009,JPO&INPIT