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1. 发明专利

JP2008308618A Adhesive composition and adhesive film 审中-公开
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2008308618A
公开(公告)日：2008-12-25
申请号：JP2007159341
申请日：2007-06-15
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOSAKAI SHOHEI , KOUCHI SATOSHI , ICHIROKU NOBUHIRO
IPC分类号： C09J179/08 , C08G59/40 , C09J7/00 , C09J163/00 , C09J183/04 , C09J183/10
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition providing a cured product having a low modulus and excellent adhesiveness, and to provide an adhesive film having the adhesive layer.
SOLUTION: The adhesive composition comprises (A) 100 pts.mass of a polyimide resin having a diorganopolysiloxane residue having a vinyl group and a phenyl group bound to silicon atoms, (B) 5-200 pts.mass of an epoxy resin, and (C) an epoxy resin-curing catalyst. The adhesive film is obtained by using the adhesive composition.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种提供具有低模量和优异粘附性的固化产物的粘合剂组合物，并提供具有粘合剂层的粘合剂膜。粘合剂组合物包含（A）100质量份具有乙烯基和与硅原子键合的苯基的二有机聚硅氧烷残基的聚酰亚胺树脂，（B）5-200重量份的环氧树脂，（C）环氧树脂固化催化剂。通过使用粘合剂组合物获得粘合膜。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005325283A Adhesive resin film, method for use thereof, and semiconductor device 审中-公开
标题翻译：粘合树脂膜，其使用方法和半导体器件
公开(公告)号：JP2005325283A
公开(公告)日：2005-11-24
申请号：JP2004146168
申请日：2004-05-17
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOUCHI SATOSHI , SUZUKI AKIHISA , SHIOBARA TOSHIO
IPC分类号： B32B27/00 , C09J7/02 , C09J183/04
摘要： PROBLEM TO BE SOLVED: To provide an adhesive resin film exerting excellent effect as a pressure-sensitive adhesive superior in tackiness and also a thermosetting adhesive sheet exhibiting a strong adhesive strength.
SOLUTION: In this pressure-sensitive thermosetting adhesive resin film, the inside of voids in a porous plastic film is impregnated with an adhesive organopolysiloxane composition, and further the adhesive layers comprising the above composition are formed on both sides of the porous plastic film. The organopolysiloxane composition contains (A) diorganopolysiloxane in which both terminals of the molecular chain are blocked by hydroxy groups, (B) organopolysiloxane resin containing a unit expressed by R
1
3 SiO
1/2 (R
1 is a univalent hydrocarbon group) and a unit expressed by SiO
2 in a mol ratio of the former to the latter of 0.6-1.7, (C) a hardening agent and (D) an adhesive auxiliary.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种粘合性树脂膜，其作为粘合性优异的粘合剂和具有强粘合强度的热固性粘合片具有优异的效果。解决方案：在这种压敏热固性粘合树脂膜中，多孔塑料膜中的空隙内部用粘合剂有机聚硅氧烷组合物浸渍，并且还包括上述组合物的粘合剂层在多孔塑料的两侧电影。有机聚硅氧烷组合物含有（A）分子链的两个末端被羟基封闭的二有机聚硅氧烷，（B）含有由R 1表示的单元的有机聚硅氧烷树脂 SiO 另一方面，前者与后者的摩尔比为1/2 SBS（R 1 为一价烃基），由SiO 2 表示的单元为0.6-1.7，（C）硬化剂和（D）粘合助剂。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2014139292A Curable silicone resin composition, cured product thereof, and optical semiconductor device 有权
标题翻译：可固化硅树脂组合物，固化产品和光学半导体器件
公开(公告)号：JP2014139292A
公开(公告)日：2014-07-31
申请号：JP2013190680
申请日：2013-09-13
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOBAYASHI YUKIHITO , IWATA MITSUHIRO , KOUCHI SATOSHI
IPC分类号： C08L83/07 , C08L83/04 , C08L83/05 , H01L23/29 , H01L23/31 , H01L33/56
CPC分类号： H01L33/56 , C08G77/12 , C08G77/20 , C08G77/24 , C08L83/08 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/12044 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a curable silicone resin composition which has high light extraction efficiency and is useful, for example, as a sealing material, and to provide a cured product thereof and an optical semiconductor device.SOLUTION: The curable silicone resin composition which is an addition-curable silicone composition contains: (A) (A-1) a compound represented by general formula (1) and having at least two aliphatic unsaturated groups per molecule; (B) an organosilicon compound having at least two hydrogen atoms bonded to a silicon atom per molecule and having no aliphatic unsaturated group; (C) a hydrosilylation catalyst containing a platinum group metal; and (D) a silicone powder having an average particle diameter of 0.5-100 μm. The silicon powder is contained in an amount of 0.1-500 pts.mass based on 100 pts.mass of the total of the components (A) and (B).
摘要翻译：要解决的问题：提供一种具有高光提取效率的可固化的有机硅树脂组合物，并且可用作例如密封材料，并提供其固化产物和光学半导体装置。溶液：可固化的有机硅树脂组合物其为可加成固化的有机硅组合物，其含有：（A）（A-1）由通式（1）表示的化合物，每分子具有至少两个脂族不饱和基团; （B）每分子具有至少两个与硅原子键合的氢原子并且不具有脂族不饱和基团的有机硅化合物; （C）含有铂族金属的氢化硅烷化催化剂; 和（D）平均粒径为0.5〜100μm的有机硅粉末。基于100份（A）和（B）组分的总和，硅粉的含量为0.1-500质量份。

4. 发明专利

JP2014005334A Curable resin composition, cured product thereof and optical semiconductor device using the same 有权
标题翻译：可固化树脂组合物，其固化产物和使用其的光学半导体器件
公开(公告)号：JP2014005334A
公开(公告)日：2014-01-16
申请号：JP2012140448
申请日：2012-06-22
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOUCHI SATOSHI , TABEI EIICHI , IKENO MASAYUKI
IPC分类号： C08L101/00 , C08K3/00 , C08L83/05 , C08L83/07
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition for an optical semiconductor device in which when a package substrate is filled with a sealant formed by dispersing inorganic phosphor particles with the use of a low-viscosity curable resin composition, a dispersion state of the inorganic phosphor particles shows no change in the initial stage of manufacture and the latter stage of the manufacture, specifically, the same quantity of the inorganic phosphor particles are contained in the initial stage of the manufacture and the latter stage of the manufacture, and color rendering properties can be stably kept, and to provide a cured product thereof and an optical semiconductor device.SOLUTION: A curable resin composition is formed by adding at least inorganic phosphor particles and nanoparticles with a primary size of 1 nm or more and less than 100 nm thereto. The nanoparticles are dispersed therein in a form of secondary aggregated particles of which an average particle size is 100 nm or more and 20 μm or less in terms of volume Q3.
摘要翻译：要解决的问题：提供一种光半导体装置用固化性树脂组合物，其中，当封装基板填充有通过使用低粘度固化性树脂组合物分散无机荧光体颗粒而形成的密封剂时，分散状态无机荧光体颗粒在制造的初始阶段和制造的后期阶段没有变化，具体地说，在制造的初始阶段和制造的后一阶段包含相同量的无机磷光体颗粒，并且显色可以稳定地保持其性能，并提供其固化产物和光学半导体器件。溶液：通过添加至少一种无机荧光体颗粒和主要尺寸为1nm以上且小于100nm的纳米颗粒来形成固化性树脂组合物于此。纳米颗粒以其体积Q3的平均粒径为100nm以上且20μm以下的二次凝集粒子的形式分散。

5. 发明专利

JP2008308552A Adhesive composition and adhesive film 审中-公开
标题翻译：胶粘组合物和粘合膜
公开(公告)号：JP2008308552A
公开(公告)日：2008-12-25
申请号：JP2007156614
申请日：2007-06-13
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOSAKAI SHOHEI , ICHIROKU NOBUHIRO , KOUCHI SATOSHI
IPC分类号： C09J179/08 , C08G59/40 , C09J7/00 , C09J11/00 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition having excellent gap-filling properties, and providing a cured product having a low modulus and excellent adhesiveness, and to provide an adhesive film having an adhesive layer comprising the composition. SOLUTION: The adhesive composition comprises (A) 100 pts.mass of a polyimide silicone resin obtained by reacting a diamine component with a carboxylic dianhydride component wherein the diamine component contains a diaminosiloxane, and the ratio of the total mol of the carboxylic dianhydride component to the total mol of the diamine component, or the ratio of the total mol of the diamine component to the total mol of the carboxylic dianhydride component in the reaction is 1.05 to 1.20, (B) 5-200 pts.mass of an epoxy resin and (C) a catalytic amount of an epoxy resin-curing catalyst. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异间隙填充性能的粘合剂组合物，并提供具有低模量和优异粘合性的固化产物，并提供具有包含该组合物的粘合剂层的粘合剂膜。粘合剂组合物包含（A）通过使二胺组分与羧酸二酐组分反应获得的聚酰亚胺硅树脂100质量份，其中二胺组分含有二氨基硅氧烷，并且羧酸的总摩尔比二酐组分相对于二胺组分的总摩尔量，或二胺组分的总摩尔数与羧酸二酐组分的总mol的比例为1.05至1.20，（B）5-200重量份环氧树脂和（C）催化量的环氧树脂固化催化剂。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2004352677A Method for producing branched tetrasiloxane 有权
公开(公告)号：JP2004352677A
公开(公告)日：2004-12-16
申请号：JP2003153931
申请日：2003-05-30
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KUBOTA YASUBUMI , KUBOTA TORU , KOUCHI SATOSHI , SAKUTA KOJI , YAMAMOTO AKIRA
IPC分类号： C07B61/00 , C07F7/08 , C07F7/18
CPC分类号： C07F7/0874
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a branched tetrasiloxane, particularly a high-purity methyltris(trimethylsiloxy)silane used as a oil solution for cosmetics in good yield.
SOLUTION: The method for producing the branched tetrasiloxane represented by general formula (3): R
2 Si(OSiR
1
3 )
3 (R
1 is a hydrogen atom or a 1-20C monovalent hydrocarbon group; R
2 is a 1-20C monovalent hydrocarbon group) comprises adding a trialkoxysilane compound represented by general formula (2): R
2 Si(OR
3 )
3 (R
2 and R
3 are each a 1-20C monovalent hydrocarbon group) to a mixed liquid of a disiloxane compound represented by general formula (1): R
1
3 SiOSiR
1
3 (R
1 and R
2 are each the same as mentioned above) with an alcohol and an acid catalyst and reacting the disiloxane compound with the alcohol and further adding water thereto to carry out hydrolysis.
COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2014031436A Curable resin composition, cured product of the same, and optical semiconductor device using the cured product 有权
标题翻译：可固化树脂组合物，其固化产物和使用固化产物的光学半导体器件
公开(公告)号：JP2014031436A
公开(公告)日：2014-02-20
申请号：JP2012172513
申请日：2012-08-03
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOUCHI SATOSHI , IKENO MASAYUKI , TABEI EIICHI
IPC分类号： C08L101/00 , C08L83/04 , C09K11/08 , H01L33/56
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition, a cured product of the composition and an optical semiconductor device, having high durability against repeated cold-heat shocks and consequently hardly causing cracks even in a severe temperature cycle, showing excellent color fastness, capable of preventing permeation of gas such as SOx, and capable of stably maintaining color rendering property.SOLUTION: The curable resin composition includes at least phosphor particles and nanoparticles having a primary particle diameter of 1 nm or more and less than 100 nm added to the composition. The nanoparticles are dispersed in a state of secondary aggregated particles having an average particle diameter of 100 nm or more and 20 μm or less in terms of volume Q3. In the resin composition, a silicone powder having an average particle diameter of 0.5 to 100 μm is further dispersed.
摘要翻译：要解决的问题：为了提供一种固化性树脂组合物，该组合物的固化物和光学半导体装置，对反复的冷热冲击具有高耐久性，因此即使在严酷的温度循环中也难以引起裂纹，显示出优异的耐色牢度，能够防止诸如SOx的气体渗透，并且能够稳定地保持着色性能。溶解性：固化性树脂组合物至少包含荧光体颗粒和初级粒径为1nm以上且小于100nm的纳米粒子组成。纳米颗粒以体积Q3计平均粒径为100nm以上且20μm以下的二次凝集粒子的状态分散。在树脂组合物中，平均粒径为0.5〜100μm的硅酮粉末进一步分散。

8. 发明专利

JP2013239540A Substrate for optical semiconductor device, manufacturing method of substrate for optical semiconductor device, optical semiconductor device, and manufacturing method of optical semiconductor device 审中-公开
标题翻译：用于光学半导体器件的衬底，用于光学半导体器件的衬底的制造方法，光学半导体器件以及光学半导体器件的制造方法
公开(公告)号：JP2013239540A
公开(公告)日：2013-11-28
申请号：JP2012110966
申请日：2012-05-14
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOUCHI SATOSHI , IWATA MITSUHIRO , HARADA YOSHIFUMI , KIMURA SHINJI
IPC分类号： H01L33/60 , B29C45/14 , B29C45/26
CPC分类号： H01L33/58 , H01L24/97 , H01L33/486 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12042 , H01L2924/181 , H05K1/0306 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a substrate for an optical semiconductor device, which inhibits the occurrence of flash burrs and achieves high light reflection efficiency, and a manufacturing method which manufactures the substrate for the optical semiconductor device at low costs, and to provide an optical semiconductor device using the substrate and a manufacturing method of the optical semiconductor device.SOLUTION: A substrate for an optical semiconductor device includes: first leads on which optical semiconductor elements are respectively mounted, each of the first leads electrically connected with a first electrode of the optical semiconductor element; second leads each of which is electrically connected with a second electrode of the optical semiconductor element; thermosetting resin composition moldings which are respectively molded in penetration gaps located between the first leads and the second leads which are disposed in parallel with each other; and reflectors molded around regions on which the optical semiconductor elements are mounted and formed by a thermosetting resin composition. The resin moldings and the reflectors are integrally molded with the first leads and the second leads by injection molding.
摘要翻译：要解决的问题：提供抑制闪光毛刺的发生并实现高的光反射效率的光半导体装置的基板，以及以低成本制造光半导体装置的基板的制造方法，使用该基板的光半导体器件和该光半导体器件的制造方法。解决方案：一种用于光学半导体器件的衬底，包括：第一引线，其上分别安装有光学半导体元件，每个第一引线与第一引线电连接光学半导体元件; 第二引线各自与光半导体元件的第二电极电连接; 热固性树脂组合物模制品分别模制在彼此平行设置的位于第一引线和第二引线之间的穿透间隙中; 以及在其上通过热固性树脂组合物安装和形成光学半导体元件的区域上模制的反射器。树脂模制品和反射器通过注射成型与第一引线和第二引线一体模制。

9. 发明专利

JP2013239539A Substrate for optical semiconductor device, manufacturing method of substrate for optical semiconductor device, optical semiconductor device, and manufacturing method of optical semiconductor device 审中-公开
标题翻译：用于光学半导体器件的衬底，用于光学半导体器件的衬底的制造方法，光学半导体器件以及光学半导体器件的制造方法
公开(公告)号：JP2013239539A
公开(公告)日：2013-11-28
申请号：JP2012110954
申请日：2012-05-14
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KOUCHI SATOSHI , IWATA MITSUHIRO , HARADA YOSHIFUMI , KIMURA SHINJI
IPC分类号： H01L33/62
CPC分类号： H01L33/56 , H01L24/97 , H01L33/0095 , H01L33/08 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a substrate for an optical semiconductor device, which adopts a structure using metal leads and achieving excellent heat radiation performance and enables the thickness reduction of the optical semiconductor device, and a manufacturing method which manufactures the substrate for the optical semiconductor device at low costs, and to provide the optical semiconductor device using the substrate and a manufacturing method of the optical semiconductor device.SOLUTION: A substrate for an optical semiconductor device includes: first leads on which optical semiconductor elements are respectively mounted, each of the first leads electrically connected with a first electrode of the optical semiconductor element; and second leads each of which is electrically connected with a second electrode of the optical semiconductor element. Thermosetting resin composition moldings are respectively molded by injection molding and are formed into plate shapes in penetration gaps located between the first leads and the second leads which are disposed in parallel with each other. Exposed front surfaces of the first leads, the second leads, and the resin moldings and exposed rear surfaces of the first leads, the second leads, and the resin moldings respectively lie on the same planes.
摘要翻译：要解决的问题：提供一种采用使用金属引线的结构并实现优异的散热性能并且能够使光半导体器件的厚度减小的光半导体器件用基板，以及制造光学用基板的制造方法半导体器件，并且提供使用该衬底的光学半导体器件和该光学半导体器件的制造方法。解决方案：一种用于光学半导体器件的衬底，包括：分别安装光学半导体元件的第一引线，所述第一引线与所述光半导体元件的第一电极电连接; 以及与光半导体元件的第二电极电连接的第二引线。热固性树脂组合物模制品分别通过注射成型模制，并且形成为位于彼此平行设置的第一引线和第二引线之间的穿透间隙中的板形。第一引线，第二引线，第一引线，第二引线和树脂模制品的树脂模制品和暴露的后表面的暴露的前表面分别位于相同的平面上。

10. 发明专利

JP2013179124A Surface modification method of optical element sealant and light-emitting semiconductor device 有权
标题翻译：光学元件密封件和发光半导体器件的表面改性方法
公开(公告)号：JP2013179124A
公开(公告)日：2013-09-09
申请号：JP2012041279
申请日：2012-02-28
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： IKENO MASAYUKI , AKEDA TAKASHI , KOUCHI SATOSHI , KOZAI TOSHIYUKI
IPC分类号： H01L33/52
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a surface modification method providing high luminous efficiency and sulfurization-resistance in optical uses and to provide a light-emitting semiconductor device.SOLUTION: There is provided a surface modification method of modifying a surface of an optical element sealant, in which the surface of the optical element sealant is modified by laminating a methane plasma coating layer formed by plasma polymerization using methane on the surface of the optical element sealant.
摘要翻译：要解决的问题：提供一种在光学用途中提供高发光效率和耐硫化性的表面改性方法，并提供一种发光半导体器件。解决方案：提供一种修饰光学元件密封剂表面的表面改性方法其中光学元件密封剂的表面通过在光学元件密封剂的表面层压通过使用甲烷的等离子体聚合形成的甲烷等离子体涂层而被改性。

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