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1. 发明专利

JP2005314604A Flame resistant adhesive composition and adhesive sheet using the same 有权
标题翻译：耐火粘合剂组合物和粘合片使用
公开(公告)号：JP2005314604A
公开(公告)日：2005-11-10
申请号：JP2004135697
申请日：2004-04-30
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： KONDO KAZUNORI , HOSHIDA SHIGEHIRO , AIZAWA MICHIO , AMANO TADASHI
IPC分类号： C09J7/02 , C09J11/04 , C09J11/06 , C09J133/00 , C09J161/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen-based flame resistant adhesive composition that has a high adhesiveness and is excellent in flame resistance, heat resistance, workability and handling property, and to provide an adhesive sheet using the same.
SOLUTION: The flame resistant adhesive composition comprises (A) a 100 pts.mass reactive functional group-containing acrylic polymer whose glass transition temperature is 5-30°C, (B) a 1-40 pts.mass non-halogen-based epoxy resin, (C) a 1-30 pts.mass curing agent, (D) a 0.1-5 pts.mass curing accelerator, (E) a 25-60 pts.mass phosphorus-based flame retarder and (F) a 10-40 pts.mass inorganic filler, and the adhesive sheet has an adhesive layer comprised of the composition.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有高粘合性和优异的耐火性，耐热性，可加工性和操作性能的非卤素类阻燃粘合剂组合物，并提供使用其的粘合片。阻燃粘合剂组合物包含（A）玻璃化转变温度为5-30℃的100质量份反应性官能团的丙烯酸类聚合物，（B）1-40质子毫升非卤素（C）1-30重量份固化剂，（D）0.1-5重量份固化促进剂，（E）25-60重量份磷系阻燃剂和（F） 10-40质量％的无机填料，并且粘合片具有由该组合物组成的粘合剂层。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006015681A Metallic foil-polyimide laminated flexible plate and its manufacturing process 审中-公开
标题翻译：金属箔 - 聚酰亚胺层压柔性板及其制造工艺
公开(公告)号：JP2006015681A
公开(公告)日：2006-01-19
申请号：JP2004197759
申请日：2004-07-05
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： USU MASAHIRO , FUJIWARA MAKOTO , HOSHIDA SHIGEHIRO , AIZAWA MICHIO , AMANO TADASHI
IPC分类号： B32B15/088
CPC分类号： B32B15/20 , B32B7/12 , B32B15/08 , B32B27/281 , B32B27/34 , B32B2250/02 , B32B2255/06 , B32B2255/26 , B32B2307/202 , B32B2307/306 , H05K1/0346 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31681
摘要： PROBLEM TO BE SOLVED: To provide a metallic foil-polyimide laminated plate of whole polyimides which sufficiently utilizes a characteristic of a heat-resistant polyimide film and has good smoothness of a surface of an adhesive layer without uneven thickness.
SOLUTION: In the metallic foil-polyimide laminated flexible plate made by laminating the metallic foil on one surface of the heat-resistant polyimde film via a heat resistant adhesive layer, the heat resistant adhesive layer is a polyimide adhesive layer made by heating and imidizing polyamic acid varnish containing 5 to 200 ppm of a leveling agent based on the solid component of the polyamic acid, and the polyimide adhesive layer of the obtained laminated plate shows a glass transition temperature of not lower than 400°C. The manufacturing method of the metallic foil-polyimide laminated flexible plate comprises applying a leveling agent-containing polyamic acid solution on the metallic foil and drying it; laminating the heat-resistant polyimide film on the polyamic acid solution with a heating roll; and heating and imidizing it in the temperature range of 200 to 400°C.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供充分利用耐热聚酰亚胺膜的特性的整个聚酰亚胺的金属箔 - 聚酰亚胺层压板，并且具有良好的粘合剂层表面的平滑度，而没有不均匀的厚度。解决方案：在通过耐热粘合剂层将金属箔层压在耐热聚酰亚胺膜的一个表面上的金属箔 - 聚酰亚胺层压柔性板中，耐热粘合剂层是通过加热制成的聚酰亚胺粘合剂层酰胺化聚酰胺酸清漆，含有聚酰胺酸固体成分为5〜200ppm的流平剂，所得层压板的聚酰亚胺粘合剂层的玻璃化转变温度为400℃以上。金属箔 - 聚酰亚胺层压柔性板的制造方法包括将均匀剂聚酰胺酸溶液涂覆在金属箔上并干燥; 用加热辊在聚酰胺酸溶液上层压耐热聚酰亚胺膜; 并在200〜400℃的温度范围内进行加热和酰亚胺化。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005271426A Flexible metal foil polyimide laminated sheet, and its manufacturing method 审中-公开
标题翻译：柔性金属箔聚酰亚胺层压板及其制造方法
公开(公告)号：JP2005271426A
公开(公告)日：2005-10-06
申请号：JP2004088824
申请日：2004-03-25
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： USU MASAHIRO , AIZAWA MICHIO , FUJIWARA MAKOTO , HOSHIDA SHIGEHIRO , AMANO TADASHI
IPC分类号： B32B15/088 , B05D7/14 , B05D7/24 , B32B5/00 , B32B7/12 , B32B15/08 , C08G69/26 , H05K1/00 , H05K1/03 , H05K3/38
CPC分类号： B32B15/08 , B32B7/12 , B32B15/02 , B32B15/18 , B32B15/20 , B32B27/281 , B32B2307/306 , B32B2307/3065 , B32B2435/00 , C09J179/08 , H05K1/0346 , H05K1/0393 , H05K3/386 , Y10T428/31681
摘要： PROBLEM TO BE SOLVED: To provide an all polyimide flexible metal foil polyimide laminated sheet for which the characteristics of a heat-resistant polyimide resin film having excellent heat-resistance/chemical-resistance/fire retardancy/electric characteristics and so forth are sufficiently utilized, and to provide its manufacturing method.
SOLUTION: For this fleexible metal foil polyimide laminated sheet, a metal foil is laminated through a heat-resistant adhesive layer on one surface of a heat-resistant polyimide film. The heat-resistant adhesive layer is a heat-resistant polyimide layer formed by dry-imidizing a polyamic acid while using a dimethylacetamide as a solvent. Also, the gas permeability of the dimethylacetamide at 5 torr and 200°C of the heat-resistant polyimide film to be used is 0.1 kg/m
2 ×h or higher.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有优异的耐热/耐化学性/阻燃性/电气特性等的耐热聚酰亚胺树脂膜的特征的全聚酰亚胺柔性金属箔聚酰亚胺层叠片是充分利用，并提供其制造方法。
解决方案：对于这种易熔金属箔聚酰亚胺层压片，通过耐热粘合剂层在耐热聚酰亚胺膜的一个表面上层压金属箔。耐热粘合剂层是通过使用二甲基乙酰胺作为溶剂使聚酰胺酸干燥酰亚胺而形成的耐热聚酰亚胺层。此外，耐热聚酰亚胺膜的5托和200℃下的二甲基乙酰胺的气体渗透性为0.1kg / m 2 / SP>×h以上。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005053991A Flame-retardant adhesive composition and substrate for flexible printed wiring obtained by using the same 审中-公开
标题翻译：阻燃胶粘剂组合物和使用它的柔性印刷线路基材
公开(公告)号：JP2005053991A
公开(公告)日：2005-03-03
申请号：JP2003206531
申请日：2003-08-07
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： ARAI HITOSHI , AIZAWA MICHIO
IPC分类号： C09J167/00 , C09J11/04 , C09J163/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a substrate for flexible printed wiring excellent in peeling characteristics, solvent resistance, flame retardancy, migration property and soldering heat resistance, and an adhesive composition used for the manufacture of the substrate.
SOLUTION: The adhesive composition comprises (A) a phosphorus-containing polyester resin, (B) a non-halogen epoxy resin, (C) a curing agent and (D) an inorganic filler, where the ratio of the phosphorus element to the whole organic resin component is 1.8-4.0 wt% and the ratio of the component (D), that is, the inorganic filler to the whole organic resin component is 10-60 wt%. The substrate for flexible printed wiring comprises an electric-insulating film layer and a metal foil layer glued on the film layer by the adhesive composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供剥离特性，耐溶剂性，阻燃性，迁移性和焊接耐热性优异的柔性印刷配线用基板和用于制造基板的粘合剂组合物。粘合剂组合物包含（A）含磷聚酯树脂，（B）非卤素环氧树脂，（C）固化剂和（D）无机填料，其中磷元素对于整个有机树脂组分为1.8-4.0重量％，组分（D），即无机填料与全部有机树脂组分的比例为10-60重量％。用于柔性印刷布线的基板包括电绝缘膜层和通过粘合剂组合物胶合在膜层上的金属箔层。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2006232984A Adhesive composition, and coverlay film and adhesive sheet obtained using the same 审中-公开
标题翻译：粘合剂组合物，以及使用其的覆盖膜和粘合片
公开(公告)号：JP2006232984A
公开(公告)日：2006-09-07
申请号：JP2005049067
申请日：2005-02-24
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： ARAI HITOSHI , AIZAWA MICHIO , AMANO TADASHI
IPC分类号： C09J163/00 , B32B25/14 , B32B27/00 , B32B27/38 , C09J7/00 , C09J11/04 , C09J11/06 , C09J109/02 , C09J171/10
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition giving a cured product excellent in glass transition temperature, peeling strength, soldering heat resistance and processability, and a coverlay film and an adhesive sheet each having an adhesive layer comprised of the composition.
SOLUTION: The adhesive composition comprises (A) a phenoxy resin having a molecular weight of at least 10,000, a glass transition temperature of 40°C or higher and bearing epoxy groups on the both ends of the molecular chain, (B) an epoxy resin, (C) a carboxy group-containing NBR having an acrylonitrile content of 20-50 mass% and a carboxy group content of 0.005-5 mass%, (D) a curing agent, (E) an inorganic filler, and (F) a vulcanizing agent, where the ratio of the component (C) to the total of the components (A)-(D) is 10-60 mass% and the ratio of the components having a glass transition temperature of 30°C or higher in the components (A)-(D) is 40-90 mass%. The adhesive sheet and the coverlay film are obtained using the composition.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供赋予玻璃化转变温度，剥离强度，焊接耐热性和加工性优异的固化产物的粘合剂组合物，以及各自具有由该组合物组成的粘合剂层的覆盖膜和粘合片。粘合剂组合物包含（A）分子量为至少10,000，玻璃化转变温度为40℃以上且在分子链两端具有环氧基的苯氧基树脂，（B）环氧树脂，（C）丙烯腈含量为20-50质量％，羧基含量为0.005-5质量％的含羧基的NBR，（D）固化剂，（E）无机填料，和（F）硫化剂，其中组分（C）与组分（A） - （D）的总量的比例为10-60质量％，玻璃化转变温度为30℃的组分的比例以上（A）〜（D）成分为40〜90质量％。使用该组合物获得粘合片和覆盖膜。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006142762A Manufacturing method of flexible metal foil polyimide laminate 有权
标题翻译：柔性金属箔聚酰胺层压板的制造方法
公开(公告)号：JP2006142762A
公开(公告)日：2006-06-08
申请号：JP2004339035
申请日：2004-11-24
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： FUJIWARA MAKOTO , USU MASAHIRO , ASAZUMA JUN , HOSHIDA SHIGEHIRO , AIZAWA MICHIO
IPC分类号： B32B15/088 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible metal foil polyimide laminate which has outstanding heat resistance, chemical resistance, fire retardancy, electrical property or the like, and which fully employs the profile of a heat-resistant polyimide resin film and has good flexibility. SOLUTION: The manufacturing method of a flexible metal foil polyimide laminate is as follows: a metal foil and a polyimide film are laminated by heating roll press through the intermediary of a heat-resistant adhesive. The residual solvent in an adhesive layer is removed by heat treatment. Thermosetting is carried out to manufacture the laminate. In addition, the polyimide film having the thickness of not more than 30 μm and the amount of gas permeation of dimethylacetamide at 5 torr and 200°C of at least 0.1 kg/m 2 ×hr is used. The polyimide film is laminated by the heating roll press at the temperature of not more than 150°C and the heat-treatment and the thermosetting of the film are carried out under the decompression of not more than 10 Pa of absolute pressure. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有优异的耐热性，耐化学性，阻燃性，电性能等的柔性金属箔聚酰亚胺层压体的制造方法，并且完全采用耐热聚酰亚胺的轮廓树脂膜，弹性好。解决方案：柔性金属箔聚酰亚胺层压体的制造方法如下：通过加热辊压机通过耐热粘合剂层压金属箔和聚酰亚胺膜。通过热处理除去粘合剂层中的残留溶剂。进行热固性以制造层压体。此外，使用厚度不大于30μm的聚酰亚胺膜和在5托和200℃下二甲基乙酰胺的气体渗透量为至少0.1kg / m 2 SP / 2×小时。通过加热辊压机在不高于150℃的温度下层压聚酰亚胺膜，并且在不超过10Pa绝对压力的减压下进行膜的热处理和热固化。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005248048A Flame retardant adhesive composition, and adhesive sheet, cover lay film and flexible copper clad laminate plate by using the same 审中-公开
标题翻译：阻燃粘合剂组合物，粘合片，覆盖膜和柔性铜箔层压板使用相同
公开(公告)号：JP2005248048A
公开(公告)日：2005-09-15
申请号：JP2004061670
申请日：2004-03-05
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： NAKANISHI NOBORU , ARAI HITOSHI , AIZAWA MICHIO , AMANO TADASHI
IPC分类号： C09J7/00 , B32B15/08 , B32B27/38 , C09D5/26 , C09J7/02 , C09J11/02 , C09J163/00 , C09J167/00 , C09J179/08 , C09K21/14 , H05K1/03 , H05K3/28 , H05K3/38
CPC分类号： B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/3065 , B32B2457/20 , C09K21/14 , H05K3/281 , H05K3/386 , H05K2201/012 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , Y10T428/31522
摘要： PROBLEM TO BE SOLVED: To provide an adhesive composition of which cured material obtained by curing is excellent in flame retardant property and electric characteristics (migration resistance) and without containing a halogen, and an adhesive sheet, cover lay film and flexible copper clad laminate plate by using the same.
SOLUTION: This flame retardant adhesive composition contains (A) a non-halogen-based epoxy resin, (B) a thermoplastic resin and/or synthetic rubber, (C) a curing agent, (D) a curing accelerator and (E) a phosphorus-containing filler. The adhesive sheet, cover lay film and flexible copper clad laminate plate by using the same are also provided.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种其固化所得到的固化物具有优异的阻燃性和电特性（耐迁移性）且不含卤素的粘合剂组合物，以及粘合片，覆盖膜和柔性铜使用它们的复合层压板。该阻燃性粘合剂组合物含有（A）非卤素系环氧树脂，（B）热塑性树脂和/或合成橡胶，（C）固化剂，（D）固化促进剂和（ E）含磷填料。还提供了粘合片，覆盖膜和使用它们的柔性覆铜层压板。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005053990A Flame-retardant adhesive composition and substrate for flexible printed wiring obtained by using the same 审中-公开
标题翻译：阻燃胶粘剂组合物和使用它的柔性印刷线路基材
公开(公告)号：JP2005053990A
公开(公告)日：2005-03-03
申请号：JP2003206530
申请日：2003-08-07
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： ARAI HITOSHI , AIZAWA MICHIO
IPC分类号： B32B7/12 , B32B15/08 , B32B15/092 , C09J11/02 , C09J163/00 , C09J167/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a substrate for flexible printed wiring excellent in peeling characteristics, solvent resistance, flame retardancy, migration property and soldering heat resistance, and an adhesive composition used for the manufacture of the substrate.
SOLUTION: The adhesive composition comprises (A) a polyester resin, (B) a non-halogen epoxy resin, (C) a curing agent, (D) a phosphazene compound and (E) an inorganic filler, where the ratio of the phosphorus element to the whole organic resin component is 1.8-5.0 wt% and the ratio of the component (E), that is, the inorganic filler to the whole organic resin component is 1-60 wt%. The substrate for flexible printed wiring comprises an electric-insulating film layer and a metal foil layer laminated on the film layer by the adhesive composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供剥离特性，耐溶剂性，阻燃性，迁移性和焊接耐热性优异的柔性印刷配线用基板和用于制造基板的粘合剂组合物。粘合剂组合物包含（A）聚酯树脂，（B）非卤素环氧树脂，（C）固化剂，（D）磷腈化合物和（E）无机填料，其中比例的磷成分相对于全部有机树脂成分为1.8〜5.0重量％，成分（E）即无机填料与全部有机树脂成分的比例为1-60重量％。用于柔性印刷布线的基板包括通过粘合剂组合物层压在膜层上的电绝缘膜层和金属箔层。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005015596A Polyimide-based precursor resin solution composition sheet 审中-公开
标题翻译：基于聚酰亚胺的前驱体树脂溶液组合物
公开(公告)号：JP2005015596A
公开(公告)日：2005-01-20
申请号：JP2003181289
申请日：2003-06-25
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： HOSHIDA SHIGEHIRO , USU MASAHIRO , AIZAWA MICHIO , AMANO TADASHI
IPC分类号： C08J5/18 , B32B15/04 , B32B15/08 , B32B27/00 , B32B27/06 , C08G79/08 , C08L79/08 , C09J7/02 , C09J179/08 , H05K1/03 , H05K3/38
CPC分类号： B32B15/08 , B32B15/20 , B32B27/281 , B32B2038/0076 , B32B2307/306 , C08J5/128 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0346 , H05K3/386 , H05K2201/0154 , H05K2201/0358 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： PROBLEM TO BE SOLVED: To prepare a polyimide-based precursor resin solution composition sheet good in adhesion, giving a highly heat-resistant polyimide layer when cured, and effectively usable in bonding a conductor and a plastic film to each other. SOLUTION: The polyimide-based precursor resin solution composition sheet contains 1-50 wt.% of a solvent and has a thickness of 1-10μm. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005014353A Method for manufacturing flexible metal foil/polyimide laminated sheet 有权
标题翻译：制造柔性金属箔/聚酰亚胺层压板的方法
公开(公告)号：JP2005014353A
公开(公告)日：2005-01-20
申请号：JP2003181236
申请日：2003-06-25
申请人： Shin Etsu Chem Co Ltd , 信越化学工業株式会社
发明人： USU MASAHIRO , AIZAWA MICHIO , HOSHIDA SHIGEHIRO , AMANO TADASHI
IPC分类号： B29C65/48 , B29L9/00 , B32B15/08 , B32B15/088 , B32B27/34 , C09J5/06 , H05K1/03 , H05K3/00 , H05K3/22 , H05K3/38
CPC分类号： B32B15/20 , B32B7/12 , B32B15/08 , B32B27/281 , B32B27/34 , B32B37/1207 , B32B2250/40 , B32B2255/06 , B32B2255/26 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2311/00 , B32B2379/08 , B32B2457/08 , C09J5/06 , C09J2400/163 , C09J2479/086 , H05K1/0346 , H05K3/227 , H05K3/386 , H05K2203/1105
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible metal foil/polyimide laminated sheet wherein the characteristics of a heat-resistant polyimide resin film having excellent heat resistance, chemical resistance, fire retardancy, electric characteristics and the like are sufficiently put to practical use. SOLUTION: This manufacturing method of the flexible metal foil/polyimide laminated sheet is characterized in that a metal foil and a polyimide film are laminated through a heat-resistant adhesive by a heating roll press and the residual solvent in the adhesive layer is removed by heat treatment to thermally cure the adhesive layer. By this manufacturing method, even in the production of the all-polyimide type flexible metal foil/polyimide laminated sheet using a heat-resistant polyimide adhesive, the flexible metal foil/polyimide laminated sheet enhanced in adhesive strength and having the thin adhesive layer can be manufactured under a lower drying temperature/lower laminating temperature condition. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种柔性金属箔/聚酰亚胺层压片的制造方法，其中耐热性，耐化学性，阻燃性，电特性等优异的耐热聚酰亚胺树脂膜的特性是充分投入实际使用。解决方案：柔性金属箔/聚酰亚胺层压片的制造方法的特征在于，通过加热辊压机通过耐热粘合剂层压金属箔和聚酰亚胺膜，并且粘合剂层中的残留溶剂为通过热处理去除热粘合剂层。通过该制造方法，即使在使用耐热性聚酰亚胺粘合剂的全聚酰亚胺类柔性金属箔/聚酰亚胺层压片的制造中，粘合强度提高并且具有薄粘合剂层的柔性金属箔/聚酰亚胺层叠片也可以是在较低的干燥温度/较低的层压温度条件下制造。版权所有（C）2005，JPO＆NCIPI

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