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    • 3. 发明专利
    • STRIPE STRUCTURE OF SEMICONDUCTOR LASER ELEMENT
    • JPS54125990A
    • 1979-09-29
    • JP3443078
    • 1978-03-23
    • SHARP KK
    • KOMURO AKIRAYANO MORICHIKAYAMAMOTO SABUROUKURATA YUKIOMATSUI KANEKI
    • H01S5/00
    • PURPOSE:To reduce the stripe width and thus to reduce occurrence of the strain, defect and other negative factors by introducing the diffusion technique to the mesa- type stripe structure. CONSTITUTION:The n-Ga1-XAlXAs layer 2, n-GaSa layer 3, p-Ga1-XAlXAs layer 4 and p-GaAs layer 5 are laminated in that order onto n-GaAs substrate 1. The mesa-type etching is given to both ends n-GaAs substrate 1. The mesa-type etching is given to both ends of layer 5, and the accumulation layer of stripe type is formed on layer 4. Then Zn is diffused from the surface of layer 4 to form Zn diffusion layer 13. The diffusion front of Zn is stopped inside layer 5 for the region to which the diffusion is given from the surface of layer 5, and reaches inside of layer 2 for the region to which the diffusion is given from the surface of layer 4 respectively. And the current flows with the region of layer 3 where no Zn diffusion is given used as the passage owing to the difference of the energy barrier to the electron. Thus, the current path is limited within the active layer, obtaining an extremely narrowed laser oscillation region.
    • 6. 发明专利
    • STRIPE STRUCTURE AND PRODUCTION OF SEMICONDUCTOR LASER ELEMENTS
    • JPS5471588A
    • 1979-06-08
    • JP13855177
    • 1977-11-17
    • SHARP KK
    • KURATA YUKIOYANO MORICHIKAYAMAMOTO SABUROUMATSUI KANEKIKOMURO AKIRA
    • H01S5/00
    • PURPOSE:To achieve the improvement in actual effciency of current conentration by making possible the oscillation of fundameutal transverse mode having a single intensity maximum point with a stripe structure of a narrow width without giving distortions to its active layer. CONSTITUTION:nGa1-XAlXAs 2, pGaAs active layer 3, pGa1-XAlXAs 4, p GaAs 5 are laminated on an n GaAs substrate 1 doped with Si. Etching is performed from the layer 5 surface down to the mid-portion of the layer 5 and layer 4 to form a strip structure. Following to this, a S-diffused layer 13 is created in the layers 5, 4 from the etching face, then the stripe part is narrowed of its current limiting path and the layer 4 of the other portions constituting a hetero junction interface is diffused with S down to the hetero junction interface in its longitudinal direction. When the S-diffused front face arrives at the layer 3, the transverse diffusion width in the layer 5 becomes half of the difference between the stripe width W1 and laser spot width WO. Electrodes 7, 8 are made to the layer 5 and substrate 1. This method enables the laser device of stable output characteristics to be obtained through one crystal growth and shallow diffusion without any impairment of the crystallinity of the element.