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1. 发明专利

JP2013058808A Solar battery and method for manufacturing solar battery 有权
标题翻译：太阳能电池和制造太阳能电池的方法
公开(公告)号：JP2013058808A
公开(公告)日：2013-03-28
申请号：JP2012280741
申请日：2012-12-25
申请人： Sharp Corp , シャープ株式会社
发明人： FUKUDA KOJI , IMATAKI TOMOO , SAINOO YASUSHI , NISHINA TOMOHIRO , NAITO SHINSUKE , TSUNEFUKA AKIKO , SHIRAKI TOMOYO , YAMADA TAKAYUKI , TANAHASHI MASATOMO
IPC分类号： H01L31/042 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a solar battery whose long-term reliability can be improved, and a method for manufacturing the solar battery.SOLUTION: A solar battery and a method for manufacturing the solar battery comprises: a solar cell including porous electrodes provided on at least one surface of a substrate; conducting wire electrically connected to the porous electrodes; and an adhesive provided between the porous electrodes and the conducting wire. In the solar battery and the method for manufacturing the solar battery, the adhesive has partially entered the porous electrodes.
摘要翻译：要解决的问题：提供可以提高其长期可靠性的太阳能电池及其制造方法。太阳能电池和太阳能电池的制造方法包括：太阳能电池，其包括设置在基板的至少一个表面上的多孔电极; 电连接到多孔电极的导线; 以及设置在多孔电极和导线之间的粘合剂。在太阳能电池和太阳能电池的制造方法中，粘合剂部分地进入多孔电极。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012099854A Manufacturing method of solar cell with wiring sheet, manufacturing method of solar cell module, solar cell with wiring sheet, and solar cell module 审中-公开
公开(公告)号：JP2012099854A
公开(公告)日：2012-05-24
申请号：JP2012021813
申请日：2012-02-03
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI , IMATAKI TOMOO , MARUYAMA TOMOYO , TSUNEFUKA AKIKO , NAITO SHINSUKE
IPC分类号： H01L31/042
CPC分类号： H01L31/0516 , Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a solar cell with a wiring sheet, a manufacturing method of a solar cell module, a solar cell with a wiring sheet, and a solar cell module, excellent in productivity, capable of improving stability of mechanical and electrical connections between a solar cell and a wiring sheet.SOLUTION: The manufacturing method of the solar cell with the wiring sheet, the manufacturing method of the solar cell module, the solar cell with the wiring sheet, and the solar cell module comprise processes of: installing a fixing resin onto at least one of a space between electrodes of a solar cell and a space between wirings of a wiring sheet; then making the fixing resin a first cured state; then installing a bonding member containing a conductive material; overlapping a solar cell and a wiring sheet; softening the fixing resin of the first cured state; and curing again to make the fixing resin a second cured state.

3. 发明专利

JP2008153499A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008153499A
公开(公告)日：2008-07-03
申请号：JP2006341119
申请日：2006-12-19
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI , MATSUBARA KOJI
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method with which a product defect rate can be reduced by accurately implementing a wafer-on-wafer mounting step.
SOLUTION: An alignment mask 30 is used to perform batch exposure on a plurality of semiconductor chip areas 5 of a first semiconductor wafer 1, and a first alignment mark 2 is formed in each of the plurality of semiconductor chip areas 5 of the first semiconductor wafer 1. The alignment mask 30 is used to perform batch exposure on semiconductor chip areas of a second semiconductor wafer to be stacked with the first semiconductor wafer 1, and a second alignment mark is formed in each of the plurality of semiconductor chip areas of the second semiconductor wafer. Thus, an interval between the first alignment marks 2 can be made equal with an interval between the second alignment marks.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件制造方法，通过精确地实现晶片晶片安装步骤，可以降低产品缺陷率。解决方案：使用对准掩模30在第一半导体晶片1的多个半导体芯片区域5上执行批量曝光，并且在第一半导体晶片1的多个半导体芯片区域5中的每一个中形成第一对准标记2 第一半导体晶片1.对准掩模30用于在与第一半导体晶片1堆叠的第二半导体晶片的半导体芯片区域上进行批量曝光，并且在多个半导体芯片区域中的每一个中形成第二对准标记的第二半导体晶片。因此，可以使第一对准标记2之间的间隔与第二对准标记之间的间隔相等。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2014091233A Screen printing plate, and jig for screen printing plate 有权
标题翻译：屏幕打印板，并用于屏幕打印板
公开(公告)号：JP2014091233A
公开(公告)日：2014-05-19
申请号：JP2012241674
申请日：2012-11-01
申请人： Sharp Corp , シャープ株式会社
发明人： MORII KOJIRO , NAITO SHINSUKE , YAMADA TAKAYUKI , MAEDA RYUTA
IPC分类号： B41N1/24 , B41F15/08 , B41F15/34 , B41F15/36 , B41F15/40 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a screen printing plate and a jig for a screen printing plate, in which a screen frame can be made to hardly bend inside, thereby adverse effect on printing accuracy can be suppressed, furthermore burden to a screen can be reduced when performing screen printing, thereby lowering in a life of a screen printing plate can be suppressed.SOLUTION: There is provided a screen printing plate including: a screen frame; a screen stuck to a screen frame and having a printing pattern; and paste guide members disposed on the screen by narrower interval than a screen width to sandwich a printing pattern. There is also provided a jig for the screen printing plate, the jig being disposed to the screen printing plate including the screen and the screen frame. The paste guide member is a tabular component that is formed by bending a metal plate, fixed to an opposite side face to the sticking side of the screen, of the screen frame to contact the screen, and that has a side wall surface in the printing pattern side and in an upper direction with respect to the screen.
摘要翻译：要解决的问题：为了提供丝网印刷板和丝网印刷用夹具，其中可以使丝网框架难以内弯，从而可以抑制对打印精度的不利影响，因此屏幕的负担可以是执行丝网印刷时减少，从而可以抑制丝网印刷版的寿命的降低。解决方案：提供一种丝网印刷版，包括：筛网; 屏幕粘贴到屏幕框架并具有打印图案; 以及通过比屏幕宽度更窄的间隔将布置在屏幕上的糊状引导构件夹持打印图案。还提供了一种用于丝网印刷板的夹具，夹具设置在包括筛网和筛网框架的丝网印刷板上。糊状引导构件是通过将屏幕框架的屏幕框架的屏幕固定到与屏幕的粘贴侧相对的侧面的金属板弯曲形成的平板状部件，并且在印刷中具有侧壁表面图案侧和相对于屏幕的上方。

5. 发明专利

JP2013089678A Inspection device of solar cell and inspection method 审中-公开
标题翻译：太阳能电池检测装置及检测方法
公开(公告)号：JP2013089678A
公开(公告)日：2013-05-13
申请号：JP2011226923
申请日：2011-10-14
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI , URANISHI KAZUO
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an inspection device that easily selects either of a solar cell or a substrate having a micro crack in a solar cell manufacturing line.SOLUTION: The inspection device of a solar cell equipped with a detection sensor, comprising: a holding part which holds a plate-like member which is either a semiconductor substrate or a semiconductor substrate formed with a solar cell and bend so that a surface expands and contracts; and a detection sensor which detects whether the plate-like member is broken down or not by the surface being bent by the holding part so as to expand and contract.
摘要翻译：要解决的问题：提供一种在太阳能电池制造线中容易地选择太阳能电池或具有微裂纹的基板中的任一个的检查装置。解决方案：装备有检测传感器的太阳能电池的检查装置，包括：保持部，其保持形成有太阳能电池的半导体基板或半导体基板的板状部件，并弯曲，表面膨胀和收缩; 以及检测传感器，其通过被保持部弯曲的表面来检测板状构件是否断裂，以便膨胀和收缩。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013028112A Screen printing method, screen printing apparatus, and method for manufacturing solar cell module with screen printing process 审中-公开
标题翻译：丝网印刷方法，丝网印刷装置以及使用丝网印刷工艺制造太阳能电池模块的方法
公开(公告)号：JP2013028112A
公开(公告)日：2013-02-07
申请号：JP2011166645
申请日：2011-07-29
申请人： Sharp Corp , シャープ株式会社
发明人： TSUNEFUKA AKIKO , YAMADA TAKAYUKI
IPC分类号： B41F15/42 , B41F15/08 , H01L31/04 , H05K3/34
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide an off-contact screen printing method that does not require a complicated apparatus, is superior in plate-releasing performance and hardly causes a stretch in a screen, and to provide a screen printing apparatus and a method for manufacturing a solar cell with a screen printing process.SOLUTION: The off-contact screen printing method includes: a step of moving up a screen 11 after the completion of movement of a squeegee 31; and a step of moving up the squeegee 31 after moving up the screen 11. This screen printing method prevents a failure in releasing the plate and obtains an advantage that the screen 11 is hardly deteriorated by stretches.
摘要翻译：要解决的问题：为了提供不需要复杂装置的脱离接触丝网印刷方法，具有优异的印版释放性能，并且几乎不引起屏幕拉伸，并且提供丝网印刷装置和利用丝网印刷方法制造太阳能电池的方法。脱离丝网印刷方法包括：在刮板31的移动完成之后向上移动屏幕11的步骤; 以及在向上移动屏幕11之后向上移动刮板31的步骤。该丝网印刷方法防止了释放板的失败，并获得了屏幕11几乎不被拉伸劣化的优点。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013018601A Substrate sorting device 审中-公开
标题翻译：基板分配设备
公开(公告)号：JP2013018601A
公开(公告)日：2013-01-31
申请号：JP2011152812
申请日：2011-07-11
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI , MORII KOJIRO , TSUNEFUKA AKIKO
IPC分类号： B65H29/60 , B65H31/26
摘要： PROBLEM TO BE SOLVED: To provide a substrate sorting device which rapidly and reliably conveys a substrate and which facilitates the recovery of the substrate in a storage stocker, because the substrate sorting device for housing the substrate in the storage stocker by tilting a tilting conveyer obliquely downward to move the substrate downward is sometimes brought into a state in which the storage leans against a sidewall of the storage stocker and requires a means for recovering the substrate in the storage stocker.SOLUTION: This device for sorting the substrate 31 includes the tilting conveyer 12', and the storage stocker 21 comprising an independent downslope part 211 and an independent storage part 212. The tilting conveyer 12' is tilted obliquely downward, and the substrate 31 is slid down into the storage part 212 through the downslope part 211. The device for sorting the substrate 31 is characterized in that the tilting conveyer 12' and the storage stocker 21 are disposed so that a leading end of the substrate 31 cannot abut on the downslope part 211 of the storage stocker 21 when the substrate 31 is partially placed on the tilting conveyer 12'.
摘要翻译：要解决的问题：为了提供一种基板分选装置，其快速且可靠地输送基板，并且有利于基板在存储储料器中的回收，因为基板分选装置通过倾斜倾斜输送机向下倾斜以向下移动基板有时进入存储倾斜抵靠存储储料器的侧壁的状态，并且需要用于在存储储料器中回收基板的装置。解决方案：用于分选基板31的装置包括倾斜输送器12'和包括独立下坡部分211和独立存储部分212的储存储料器21.倾斜输送机12'倾斜向下倾斜，并且基板 31通过下坡部分211向下滑入存储部分212.用于分选基板31的装置的特征在于，倾斜输送器12'和存储收容器21设置成使得基板31的前端不能抵靠当基板31部分地放置在倾斜传送器12'上时，存储储存器21的下坡部分211。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012234866A Holding container of substrate, holding method of substrate, and manufacturing method of solar cell module using holding container 审中-公开
标题翻译：基体保持容器，基体保持方法及使用储存容器的太阳能电池模块的制造方法
公开(公告)号：JP2012234866A
公开(公告)日：2012-11-29
申请号：JP2011100505
申请日：2011-04-28
申请人： Sharp Corp , シャープ株式会社
发明人： TSUNEFUKA AKIKO , YAMADA TAKAYUKI , MORII KOJIRO
IPC分类号： H01L21/673 , B65D85/86 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a holding container which holds a substrate including tolerance without causing pattern defects of a paste which is caused by contact between the paste and the holding container.SOLUTION: A holding container 10 of a substrate 20 has at least one pair of facing side surfaces 102, 103. The side surfaces 102, 103 are inclined so that a distance between the side surfaces is gradually reduced toward the lower sides of the side surfaces. The inner faces of the side surfaces contact with end sides 202 to 205, thereby holding the substrate. The use of the holding container enables a pattern, in which a paste 30 is placed to ends of the substrate including tolerance, to be used.
摘要翻译：要解决的问题：提供一种保持容器，其保持包含公差的基板，而不会引起由糊状物与保持容器之间的接触引起的糊状物的图案缺陷。解决方案：基板20的保持容器10具有至少一对相对的侧表面102,103。侧表面102,103是倾斜的，使得侧表面之间的距离朝向侧面。侧面的内表面与端侧202〜205接触，由此保持基板。使用保持容器能够使用将膏30放置在包括公差的基板的端部的图案。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2009164310A Electronic parts repair equipment and electronic parts repairing method 审中-公开
标题翻译：电子部件修理设备和电子部件修理方法
公开(公告)号：JP2009164310A
公开(公告)日：2009-07-23
申请号：JP2007341456
申请日：2007-12-28
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI
IPC分类号： H05K3/34 , B23K26/00 , B23K26/06 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide electronic parts repair equipment and an electronic parts repairing method that can easily repair minute electronic parts that are highly densely mounted using laser heating. SOLUTION: At an tip part of a heating and suction head 35 of the electronic parts repair equipment, there is prepared an optical waveguide 40 for setting an irradiation direction of a laser beam 21 transmitted from within an optical fiber 31 to surely irradiate the laser beam to a target part to be repaired. The optical waveguide 40 is constructed such that the laser beam is emitted from the tip surface 35a that is in contact with the target repaired part at the tip part. Further, there is prepared a suction hole 23 inside the optical waveguide 40 that extends in parallel with the transmission direction of the laser beam, and one opening of the suction hole 23 is prepared at the tip surface 35a. The other opening of the suction hole 23 is in contact with a vacuum suction hose 36, and it is so constructed that the internal cavity of the suction hole 23 becomes vacuum by a vacuum source. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供电子零件修理设备和电子零件修复方法，其可以容易地修复使用激光加热而密集安装的微小电子部件。解决方案：在电子零件修理设备的加热和吸头35的尖端部分，准备用于设置从光纤31内传输的激光束21的照射方向的光波导40，以确保照射激光束到要修复的目标部件。光波导40被构造为使得激光束从在尖端部分处与目标修复部分接触的尖端表面35a发射。此外，在光波导40内部准备与激光束的传播方向平行地延伸的吸孔23，并且在尖端面35a准备吸入孔23的一个开口。吸入孔23的另一个开口与真空抽吸软管36接触，并且其构造使得吸入孔23的内部腔由真空源变为真空。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008130697A Solder bonding structure and manufacturing method thereof 审中-公开
标题翻译：焊接结构及其制造方法
公开(公告)号：JP2008130697A
公开(公告)日：2008-06-05
申请号：JP2006312244
申请日：2006-11-17
申请人： Sharp Corp , シャープ株式会社
发明人： YAMADA TAKAYUKI
IPC分类号： H05K3/34 , B23K1/00 , B23K31/02 , B23K35/26 , B23K101/42 , C22C13/02
摘要： PROBLEM TO BE SOLVED: To improve the reliability of the connection between a mounted component and a board in a solder bonding structure containing Bi.
SOLUTION: The solder bonding structure of this invention comprises a solder bonding portion for bonding the board and the mounted component together, and the solder bonding portion consists of an alloy containing tin (Sn) and bismuth (Bi). In the solder bonding portion, the bismuth (Bi) is dispersed in the tin (Sn), and in the arbitrary cross-section of the solder bonding portion at ordinary temperatures, the area ratio of the bismuth (Bi) having a diameter of 2 μm to the whole dispersed and precipitated bismuth (Bi) is ≥70%, so that the reliability of the connection between the mounted component and the board can be improved.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提高含有Bi的焊接结构中的安装部件与基板之间的连接的可靠性。解决方案：本发明的焊料接合结构包括用于将板和安装部件接合在一起的焊接部分，焊接部分由含有锡（Sn）和铋（Bi）的合金构成。在焊料接合部中，铋（Bi）分散在锡（Sn）中，并且在常温下焊接接合部的任意截面中，直径为2的铋（Bi）的面积比分散和析出的铋（Bi）的μm为≥70％，从而可以提高安装部件与基板之间的连接的可靠性。版权所有（C）2008，JPO＆INPIT

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