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1. 发明专利

JP2006108512A Substrate treatment apparatus 审中-公开
标题翻译：基板处理设备
公开(公告)号：JP2006108512A
公开(公告)日：2006-04-20
申请号：JP2004295337
申请日：2004-10-07
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： KIZAWA HIROSHI , KOGA TAKAHIRO , NAKAMU KATSUYOSHI , OGASAWARA KAZUHISA , YAMAGUCHI HIROSHI
IPC分类号： H01L21/304 , G03F7/42 , H01L21/306
CPC分类号： H01L21/67057 , H01L21/67051
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus, in which uniform substrate treatment is enabled by eliminating stagnation of a treatment liquid inside a treatment tank, and further, facilitating easy removal of particles.
SOLUTION: In the substrate treatment apparatus, comprising a treatment tank 1 which is surrounded on four sides by side walls 2b-2e and comprising a bottomed container of which the upper portion is open, and first and second feed nozzle pipes 10a-10d for feeding the treatment liquid into the treatment tank 1, each of the first and second feed nozzle pipes 10a-10d comprises a feed nozzle pipe including a plurality of spout holes 11 arrayed in one line at predetermined intervals on the lateral side of a hollow tubular body in the lengthwise direction. Among these feed nozzle pipes in the first feed nozzle pipe (10b, 10d), its spout holes are inclined obliquely downwardly, at a predetermined angle to a horizontal direction and in the second feed nozzle pipe (10a, 10c), and its spout holes are inclined obliquely upwardly, at a predetermined angle with respect to the horizontal direction and provided approximately horizontally at predetermined intervals on one sidewall 2b of the treatment tank 1.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种基板处理装置，其中通过消除处理槽内的处理液的停滞而进行均匀的基板处理，并且进一步便于除去颗粒。解决方案：在基板处理装置中，包括处理槽1，该处理槽1由四边侧壁2b-2e包围，并且包括其上部开口的有底容器，以及第一和第二进料喷嘴管10a- 10d用于将处理液体供给到处理槽1中，第一和第二进料喷嘴管10a-10d中的每一个包括一个进料喷嘴管，该进料喷嘴管包括多个喷口孔11，其排列成一排，管状体沿长度方向。在第一给料喷嘴管（10b，10d）中的这些进料喷嘴管中，其喷口孔相对于水平方向以预定角度倾斜向下倾斜并且在第二进料喷嘴管（10a，10c）中倾斜，并且其喷口孔相对于水平方向以预定角度倾斜向上倾斜，并且以预定的间隔大致水平地设置在处理槽1的一个侧壁2b上。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005064482A Method and device for treating substrate 有权
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2005064482A
公开(公告)日：2005-03-10
申请号：JP2004208099
申请日：2004-07-15
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： NAKAMU KATSUYOSHI , OGASAWARA KAZUHISA , SAKAIHARA YOSHIAKI , HARUKI YOSHIHIRO , KAWATE MUNENORI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and device for treating substrate by which high-quality surface treatment is realized by using an organic solvent mist having an extremely small size, and, in addition, the substrate treating time is also shortened.
SOLUTION: The substrate treating device 10 is provided with: a vapor generator 37
1 which generates a mixed gas of the organic solvent mist and an inert gas by bubbling the inert gas in an organic solvent; a supporting means which supports a plurality of substrates to be treated in a state where the substrates are vertically arranged in parallel with each other at equivalent intervals; and a treating vessel 15 which houses the assemblage of the substrates supported by the supporting means. The device is also provided with: a cap body 30 which covers the top opening of the treating vessel 15; an injection nozzle 33 installed to the cap body 30; and first pipelines 37
12 , 34
2 , 34
21 , and 34
22 which communicate the vapor generator 37
1 and injection nozzle 33 with each other. Heaters are respectively installed to the first pipelines 37
12 , 34
2 , 34
21 , and 34
22 and injection nozzle 33 and controlled so that the submicron-sized organic solvent mist may be contained in a dry gas injected from the injection nozzle 33.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种处理基板的方法和装置，其通过使用具有极小尺寸的有机溶剂雾实现高质量的表面处理，并且另外基板处理时间也缩短。解决方案：基板处理装置10具有：通过使惰性气体在有机溶剂中鼓泡而产生有机溶剂雾和惰性气体的混合气体的蒸汽发生器37 1 支撑装置，其在基板以等间隔彼此平行地垂直布置的状态下支撑待处理的多个基板; 以及处理容器15，其容纳由支撑装置支撑的基板的组合。该装置还设置有盖体30，其覆盖处理容器15的顶部开口; 安装在盖主体30上的喷嘴33; 以及连通蒸汽发生器37的第一管道37 ，34 2 ，34 21 和34 SB> 1 和喷嘴33。加热器分别安装到第一管道37，第二管道34，第二管件34，第二管件34，第二管件34，和注射器喷嘴33并被控制，使得亚微米尺寸的有机溶剂雾可以包含在从注射嘴33注入的干燥气体中。（C）2005年，JPO和NCIPI

3. 发明专利

JP2005166958A Substrate processing method and apparatus 有权
标题翻译：基板加工方法和装置
公开(公告)号：JP2005166958A
公开(公告)日：2005-06-23
申请号：JP2003403847
申请日：2003-12-02
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： KANETAKA HIROAKI , NAKAMU KATSUYOSHI , KUMASAKA KYOJI , OTOKUNI KENJI , HAGIWARA AKIRA , EDO HIROKI
IPC分类号： G02F1/13 , G02F1/1333 , G11B7/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing method and an apparatus capable of safely carrying out surface treatment with high quality and processing even an outer circumferential edge of a substrate to be processed by decreasing the consumed amount of a hazardous dry fluid.
SOLUTION: The substrate processing method carries out surface processing by blowing out the dry fluid to a front side and / or a rear side of the substrate W to be processed that is turned in an almost horizontally kept state. The dry fluid contains mist of an organic solvent of a sub micro size and is blown out onto the front side and / or the rear side of the substrate W to be processed. Or the dry fluid is blown out onto the front side and / or the rear side and also onto the front side and / or the rear side from an outer circumferential edge of the substrate W to be processed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种基板处理方法和装置，其能够通过降低危险的干燥流体的消耗量而能够以高质量和甚至加工待处理的基板的外周边缘的方式安全地执行表面处理。解决方案：基板处理方法通过将干燥流体吹送到几乎水平保持状态的被处理基板W的前侧和/或后侧来进行表面处理。干燥液体含有微小的有机溶剂的雾，并被吹出到待处理的基板W的前侧和/或后侧。或者将干燥的流体从待处理的基板W的外周边缘吹出到前侧和/或后侧，并且吹出到前侧和/或后侧。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005166957A Method and device for treating substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2005166957A
公开(公告)日：2005-06-23
申请号：JP2003403846
申请日：2003-12-02
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： EDO HIROKI , NAKAMU KATSUYOSHI , KUMASAKA KYOJI , OTOKUNI KENJI , KANETAKA HIROAKI , HAGIWARA AKIRA
IPC分类号： G02F1/13 , G02F1/1333 , G11B7/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method of treating substrate by which efficiency of drying treatment performed on a substrate to be treated is improved by spraying a drying fluid upon the substrate by shaping the fluid into a horizontal flow which is parallel to the surface of the substrate.
SOLUTION: In the method of treating substrate, the surface of the substrate W to be treated is treated by spraying a treating liquid etc., upon the substrate W while the substrate W is rotated in a nearly horizontally held. At the time of drying the substrate W, a flat injection nozzle 50 composed of a flat tunnelled duct 51 having entrances at both ends and an opened bottom surface is set toward the portion of the substrate W from the central part c to the outer peripheral edge in parallel with the substrate W at a prescribed interval from the substrate W. Then the drying fluid is sprayed upon the substrate W by shaping the fluid into a horizontal flow which is parallel to the surface of the substrate from the entrance to the outlet of the tunnelled duct 51 when the fluid passes through the flat injection nozzle 50.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理基板的方法，通过将待处理的基板上的干燥处理的效率提高到通过将流体成形为平行于衬底的表面。解决方案：在处理基板的方法中，在基板W几乎水平地保持旋转的同时，通过在基板W上喷涂处理液等来处理待处理的基板W的表面。在干燥基板W时，由从中央部分c到外周边缘的基板W的一部分设置由平坦的隧道管51构成的平坦的注入喷嘴50，该扁平的隧道管51在两端具有入口和开放的底表面与基板W以规定的间隔平行于基板W.然后，通过将流体成形为从基板的入口到出口的平行于基板的表面的水平流动将干燥流体喷射到基板W上当流体通过扁平喷嘴50时，隧道管51。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2005166956A Method and device for treating substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2005166956A
公开(公告)日：2005-06-23
申请号：JP2003403845
申请日：2003-12-02
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： EDO HIROKI , NAKAMU KATSUYOSHI , KUMASAKA KYOJI , OTOKUNI KENJI , KANETAKA HIROAKI , HAGIWARA AKIRA
IPC分类号： G11B7/26 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for treating substrate by which the surfaces of various types of substrates is treated safely to high quality by improving efficiency of drying treatment and reducing a use amount of a dangerous drying fluid at the time of treating the substrates.
SOLUTION: In the method of treating substrate, a surface of a substrate W to be treated is treated by spraying a treating fluid upon the substrate W while the substrate W is rotated in a nearly horizontally held. At the time of drying the substrate, a flat injection nozzle 50 composed of a flat tunnelled duct 51 having a closed outlet and an opened bottom surface and an exhaust sucking duct 60 surrounding part of the outer periphery of the duct 51 are set toward the portion of the substrate W from the central part to the outer peripheral edge in a state where the nozzle 50 and duct 60 are set in parallel with each other at a prescribed interval from the substrate W. Then the drying fluid supplied from the entrance of the tunnel-like duct 51 is sprayed upon the substrate W by adjusting the pressure P
1 of the fluid in the duct 51 produced when the fluid is interrupted by the closed end 50 of the outlet of the duct 51 and stays temporarily in the duct 51 to P
1 >P
2 (wherein, P
1 is the pressure inside the tunnelled duct 51, and P
2 is the suction force of the exhaust sucking duct 60).
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理基板的方法和装置，其中通过提高干燥处理的效率并减少危险的干燥流体的使用量，各种基板的表面被安全地处理以获得高质量处理基材的时间。解决方案：在处理基板的方法中，通过在基板W几乎水平地保持旋转的同时将处理流体喷涂在基板W上来处理待处理的基板W的表面。在干燥基板时，由具有封闭出口的扁平隧道管51和开口底面构成的扁平喷射口50和围绕管道51的外周的一部分的排气吸引管道60朝向该部分在从基板W以规定的间隔将喷嘴50和导管60彼此平行设置的状态下，从中央部到外周缘的基板W的位置。然后，从隧道入口供给的干燥流体通过调节流体被导管51的出口的封闭端50中断而产生的管道51中的流体的压力P 1 而喷射到衬底W上，并保持临时管道51至P 1 > P 2 （其中，P 1 是隧道管51内的压力，P 2 是排气吸管60的吸力）。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2007327669A Drying gas supply method, drying gas supply device, and substrate treatment device using the same 审中-公开
标题翻译：干燥气体供给方法，干燥气体供给装置和使用该气体供给装置的基板处理装置
公开(公告)号：JP2007327669A
公开(公告)日：2007-12-20
申请号：JP2006157858
申请日：2006-06-06
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： TAJIMA NAGAYOSHI , NAKAMU KATSUYOSHI , YAMAGUCHI HIROSHI , NAITO TAKESHI
IPC分类号： F26B21/12 , H01L21/027 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a drying gas supply method, a drying gas supply device and a substrate treatment device capable of setting a drying gas concentration of a wide range, and stably supplying the drying gas with a set concentration.
SOLUTION: In this drying gas supply device 6 where one end portions of a first supply line LC
1 for supplying the drying gas and a second supply line LC
2 for supplying a drying fluid are joined and connected to a third supply line LC
3 , and the drying gas and the drying fluid are mixed in the third supply line LC
3 to be supplied, the second supply line LC
2 is provided with a tank 11 for storing the drying fluid, a pressurizing means for pressurizing the tank 11 for allowing the prescribed drying fluid to flow out, a flow meter 12 for measuring a flow rate of the drying fluid flowing out from the tank 11, an adjusting valve 13 for adjusting the flow rate on the basis of a measured value of the flow meter, and a control means 15 for measuring the drying fluid flowing out from the tank by the flow meter, and controlling the adjusting valve on the basis of a result of the measurement to supply a certain amount of drying fluid to the third supply line LC
3 .
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供干燥气体供给方法，干燥气体供给装置和能够设定宽范围的干燥气体浓度并稳定地供给干燥气体的设定浓度的基板处理装置。解决方案：在用于供应干燥气体的第一供应管线LC 1 的一个端部和用于供应干燥气体的第二供应管线LC 2 的干燥气体供应装置6中，供应干燥流体被连接并连接到第三供应线LC <3>，并且干燥气体和干燥流体在供应的第三供应管线LC 3 中混合第二供应线LC 2 设置有用于储存干燥流体的罐11，用于加压罐11以允许规定的干燥流体流出的加压装置，用于测量的流量计12 从罐11流出的干燥流体的流量，用于基于流量计的测量值调节流量的调节阀13以及用于测量从罐流出的干燥流体的控制装置15 通过流量计，并且基于测量结果控制调节阀，以将一定量的干燥流体供应到第三供应单元 ne LC 3 。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007281311A Substrate processing apparatus 有权
标题翻译：基板加工设备
公开(公告)号：JP2007281311A
公开(公告)日：2007-10-25
申请号：JP2006108133
申请日：2006-04-10
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： EDO HIROKI , MIKAMOTO TAKEHIKO , YAMAGUCHI HIROSHI , NAKAMU KATSUYOSHI
IPC分类号： H01L21/304 , B08B3/04 , F26B3/04 , F26B9/06 , F26B21/00 , F26B21/14
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that substantially-uniformly supplies a drying fluid to a substrate to be processed so as to prevent defective drying. SOLUTION: The substrate processing apparatus includes: a cleaning bath 3 where processing fluids such as chemicals and a deionized water are stored, and the substrate to be processed is immersed into the stored processing fluids to process the substrate; and a drying chamber 6 arranged on the upper of the cleaning bath 3, which pulls out the cleaned substrate from the cleaning bath, and subjects the cleaned substrate to drying treatment. A shutter member 8 for partitioning therebetween, which has an exhaust hole for discharging the drying fluid, is slidably and movably provided between cleaning bath 3 and drying chamber 6. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种将干燥流体基本均匀地供给到待处理基板以防止有缺陷的干燥的基板处理装置。基板处理装置包括：存储处理流体如化学品和去离子水的清洗槽3，将待处理的基板浸入所存储的处理流体中以处理基板; 以及布置在清洗槽3的上部的干燥室6，其将清洁的基板从清洗槽中拉出，并对经过清洁的基板进行干燥处理。其间具有用于排出干燥流体的排气孔的挡板部件8可滑动地且可移动地设置在清洗槽3和干燥室6之间。（C）2008，JPO＆INPIT

8. 发明专利

JP2007059832A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2007059832A
公开(公告)日：2007-03-08
申请号：JP2005246645
申请日：2005-08-26
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： KOGA TAKAHIRO , KIZAWA HIROSHI , NAKAMU KATSUYOSHI , YAMAGUCHI HIROSHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus whereby the amount of use of processing liquid can be reduced by causing a strong water stream change in a processing tank and the processing with high quality can be attained. SOLUTION: In the substrate processing apparatus 1 for applying surface treatment to a wafer W immersed in the processing tank 11 with the processing liquid stored therein, first and second processing liquid supply pipes 16a, 16b and third and fourth processing liquid supply pipes 16c, 16d are provided to the inside of side wall faces in the processing tank opposed to each other in two upper/lower stages, ejection ports 17 provided to side walls of the first to fourth processing liquid supply pipes 16a to 16d are arranged toward the wafer immersed in the processing tank while being tilted by prescribed angles θ1, θ2 with respect to the horizontal direction, and the surface treatment is applied to the wafer by alternately switching the processing liquid supply pipes for supplying the processing liquid by each prescribed time with a control means that applies switching control between the supply from the first and fourth processing liquid supply pipes located on a diagonal line and the supply from the second and third processing liquid supply pipes located on another diagonal line in crossing with the diagonal line above. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板处理装置，由此可以通过在处理槽中引起强烈的水流变化来降低处理液的使用量，并且可以获得高质量的处理。解决方案在第一和第二处理液供给管16a，16b和第三和第四处理液供给管中，在浸没在处理槽11中的晶片W上进行表面处理的基板处理装置1中，在第二至第四处理液供给管16a至16d的侧壁上设置有设置在处理槽中的两个上/下级相对的侧壁面内侧的16c，16d朝向在相对于水平方向倾斜规定角度θ1，θ2的同时将晶片浸入处理槽中，并且通过将规定时间内供给处理液的处理液供给管交替地切换到规定时间，对晶片进行表面处理控制装置在位于对角线上的第一和第四处理液供应管的供应与t之间施加切换控制他从位于另一个对角线上的第二和第三处理液体供应管道与上面的对角线交叉。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006294762A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2006294762A
公开(公告)日：2006-10-26
申请号：JP2005111457
申请日：2005-04-07
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： SHIBAGAKI YOSHIZO , NAKAMU KATSUYOSHI
IPC分类号： H01L21/304 , B05B7/26 , B05B7/32
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having a drying processing system which equalize the particle size of an organic solvent mist, in which the amount of supply and concentration are broadly controllable and which is applicable to various devices.
SOLUTION: The substrate processing apparatus 1 has a mixing vessel 21 which is connected to an organic solvent supply source and an inert gas supply source 16, and mixes an organic solvent and inert gas supplied from these supply sources, and a substrate processing tub 2 which carries out the drying treatment of the processed substrate W by the mixed gas mixed with the mixing vessel 21. A mist formation unit 22 is coupled between the mixing vessel 21 and the substrate processing tub 2, mist straightening vanes 26 and 30 are provided to this mist formation unit 22, the liquid drop of the organic solvent supplied from the mixing vessel 21 by these mist straightening vanes 26 and 30 is made into gas containing the mist of uniform particle size, and it is supplied to the substrate processing tub 2.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种具有使供给浓度可广泛地控制并适用于各种装置的有机溶剂雾的粒径相等的干燥处理系统的基板处理装置。解决方案：基板处理装置1具有与有机溶剂供给源和惰性气体供给源16连接的混合容器21，混合有机溶剂和从这些供给源供给的惰性气体，以及基板处理桶2，其通过与混合容器21混合的混合气体进行处理的基板W的干燥处理。雾形成单元22连接在混合容器21和基板处理槽2之间，雾化矫直叶片26和30是在该雾化单元22中，通过这些雾化矫直叶片26,30从混合容器21供给的有机溶剂的液滴被制成含有均匀粒径的雾的气体，并被供给到基板处理槽 2.版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006093334A Substrate processing device 审中-公开
标题翻译：基板处理装置
公开(公告)号：JP2006093334A
公开(公告)日：2006-04-06
申请号：JP2004275679
申请日：2004-09-22
申请人： Ses Co Ltd , エス・イー・エス株式会社
发明人： NAKAMU KATSUYOSHI , YAMAGUCHI HIROSHI , OGASAWARA KAZUHISA , KIZAWA HIROSHI
IPC分类号： H01L21/304 , B08B3/02 , B08B3/08 , B08B3/12 , B08B9/08
CPC分类号： H01L21/02052 , H01L21/67028 , H01L21/67034
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing device capable of various kinds of chemical processing, water washing and dry processing in the same processing tub. SOLUTION: The substrate processing device is provided with a box type processing tub 11 having an opening in the upper part, and a lid body 21 for covering the opening of the processing tub in a free way of opening and closing. The lid body 21 comprises a drying room 23 for accommodating and drying a substrate W to be processed in the inside. As for the processing tub 11 on each side wall at facing surfaces constituting the box shape, respectively at least three processing liquid supply nozzle pipes 14a-14c and 14a'-14c' are horizontally arranged at a prescribed interval. These supply nozzle pipes 14a-14c and 14a'-14c' are connected with a switching mechanism and switched alternately from the side wall sides which are counterposed so as to supply processing liquid. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够在相同处理槽中进行各种化学处理，水洗和干燥处理的基板处理装置。解决方案：基板处理装置设置有在上部具有开口的盒式处理槽11和用于以自由开闭方式覆盖处理槽的开口的盖体21。盖体21包括用于容纳和干燥内部要处理的基板W的干燥室23。对于构成盒形状的面对面的各侧壁上的处理槽11，至少三个处理液供给喷嘴管14a-14c和14a'-14c'以规定的间隔水平配置。这些供给喷嘴管14a-14c和14a'-14c'与切换机构连接，并从相反的侧壁侧交替切换，以供应处理液体。版权所有（C）2006，JPO＆NCIPI

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