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1. 发明专利

JP2006262435A Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for the same 有权
标题翻译：表面声波芯片，表面声波装置及其制造方法
公开(公告)号：JP2006262435A
公开(公告)日：2006-09-28
申请号：JP2005266718
申请日：2005-09-14
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA , AKAHA KAZUHIKO , MAEDA YOSHIO
IPC分类号： H03H9/145 , H03H3/08 , H03H9/25
CPC分类号： H03H9/059 , H03H3/08 , H03H9/1092
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave chip with structure suitable for miniaturization, surface acoustic wave device, and manufacturing method for the same including an efficient protecting film forming means.
SOLUTION: In the surface acoustic wave chip, surface acoustic wave device and manufacturing method for the same, the surface acoustic wave chip 31 is provided which is formed with an inter-digital transducer 33 entirely over a piezoelectric substrate, wherein the inter-digital transducer is extended to a rim of the piezoelectric substrate 32, including an embodiment where a pattern 71 for protecting film formation constituted of at least a part of an extended electrode pattern is provided, and in the rim of the piezoelectric substrate, a partition section 35 for partitioning the electrode pattern is provided so as to reach the rim of the piezoelectric substrate so that the inter-digital electrodes form a pair.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有适合于小型化的结构的表面声波芯片，表面声波器件及其制造方法，其包括有效的保护膜形成装置。解决方案：在表面声波芯片，表面声波器件及其制造方法中，提供在整个压电基片上形成有数字式换能器33的表面声波芯片31，其中，数字换能器延伸到压电基板32的边缘，包括设置用于保护由至少一部分延伸的电极图案构成的成膜的图案71的实施例，并且在压电基板的边缘中，提供用于分隔电极图案的部分35以到达压电基板的边缘，使得数字间电极形成一对。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006042154A Surface acoustic wave device 审中-公开
标题翻译：表面声波设备
公开(公告)号：JP2006042154A
公开(公告)日：2006-02-09
申请号：JP2004221839
申请日：2004-07-29
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a SAW device capable of being more downsized while preventing vibration characteristics from being deteriorated owing to the hanging of bonding wires.
SOLUTION: A SAW resonator 1 is provided with a SAW element having: a pair of IDTs 8 formed on the main surface of a piezoelectric board 6; reflectors 9a, 9b placed at both sides of the IDTs in its length direction; and bonding pads 10a, 10b placed at one side 6a in the length direction. The SAW element is fixed to the cavity of a package 5. In the cavity, connection terminals 11a, 11b oppositely arranged on both the length direction sides of the SAW element are connected to the corresponding bonding pads of the SAW element through the use of the bonding wires 10a, 10b. The bonding wire for connecting the connection terminal of the package facing the other length direction side 6b of the SAW element to the corresponding bonding pad of the SAW element is wired over the reflector.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够更小型化的SAW器件，同时防止由于接合线的悬挂而引起的振动特性劣化。解决方案：SAW谐振器1设置有SAW元件，其具有：形成在压电基板6的主表面上的一对IDT8; 放置在IDT的长度方向两侧的反射器9a，9b; 以及沿长度方向配置在一侧6a的接合焊盘10a，10b。 SAW元件固定在封装5的空腔上。在空腔中，与SAW元件的两个长度方向侧相对布置的连接端子11a，11b通过使用该元件连接到SAW元件的相应接合焊盘接合线10a，10b。用于将面向SAW元件的另一长度方向侧6b的封装的连接端子连接到SAW元件的对应焊盘的接合线被布线在反射器上。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2011082870A Piezoelectric device 审中-公开
标题翻译：压电器件
公开(公告)号：JP2011082870A
公开(公告)日：2011-04-21
申请号：JP2009234522
申请日：2009-10-08
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H03H9/19 , H03H9/10
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric device in which a CI value or a frequency is prevented from being varied, by preventing a brazing filler metal from getting wet and spread when bonding a piezoelectric device in a layered structure. SOLUTION: The piezoelectric device includes: a piezoelectric element which is electrically connected with an exciting electrode 26A formed in a vibrating area and has a connecting electrode 25A for leading out an electrode to the outside; and a base body having external electrodes 44A, 44B to which the connecting electrode 25A is electrically connected with a metallic brazing filler metal. On a piezoelectric substrate of the piezoelectric element, a lead-out electrode 27A is formed for connecting the exciting electrode 26A and the connecting electrode 25A and on a surface of the lead-out electrode 27A, a material having wettability lower than that of the lead-out electrode 27A is formed so as to space the exciting electrode 26A and the connecting electrode 25A from each other. The material on the surface of the lead-out electrode 27A is formed while extending to a background of the piezoelectric substrate. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了提供一种抑制CI值或频率变化的压电装置，通过防止在分层结构中将压电装置接合时钎焊填料金属变湿和膨胀。解决方案：压电装置包括：压电元件，其与形成在振动区域中的激励电极26A电连接，并具有用于将电极引导到外部的连接电极25A; 以及具有外部电极44A，44B的基体，连接电极25A与金属钎料电连接。在压电元件的压电基板上形成有引出电极27A，用于将激发电极26A和连接电极25A以及引出电极27A的表面，具有低于引线的润湿性的材料形成电极27A以使激励电极26A和连接电极25A彼此间隔开。引出电极27A的表面上的材料形成为延伸到压电基板的背景。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2007081867A Method for forming conduction hole, process for fabricating piezoelectric device, and piezoelectric device 有权
标题翻译：形成导电孔的方法，制造压电装置的方法和压电装置
公开(公告)号：JP2007081867A
公开(公告)日：2007-03-29
申请号：JP2005267455
申请日：2005-09-14
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H03H9/25 , H03H3/08
CPC分类号： H03H9/1071 , H03H9/0547 , H03H9/1092 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a process for fabricating a piezoelectric device in which an exciting space sustains high airtightness and conduction between an external packaging electrode and a lead-out electrode in the exciting space can be contemplated easily. SOLUTION: In the process for fabricating an SAW element 10 comprising a piezoelectric substrate 12 having an exciting electrode and a lead-out electrode formed of a metal thin film on one major surface, and a lid 42 covering the electrode forming surface of the piezoelectric substrate 12, the piezoelectric substrate 12 and the lid 42 are pasted together, a preliminary hole is formed by blasting at a position on the other major surface of the piezoelectric substrate 12 corresponding to the lead-out electrode 26, a through hole 30 is formed in the piezoelectric substrate 12 while leaving the metal thin film by etching the position for forming the preliminary hole, and then conduction processing is performed by forming a metal film 32 for the through hole 30. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种制造压电装置的方法，其中可以容易地设想其中在激发空间内保持高气密性的激发空间和外部包装电极和引出电极之间的传导。解决方案：在制造SAW器件10的过程中，该SAW元件10包括具有激发电极的压电基片12和在一个主表面上由金属薄膜形成的引出电极，以及覆盖电极形成表面的盖42 将压电基板12，压电基板12和盖42粘贴在一起，通过在对应于引出电极26的压电基板12的另一个主表面上的位置上进行喷砂而形成预备孔，通孔30 形成在压电基板12中，同时通过蚀刻用于形成预备孔的位置留下金属薄膜，然后通过形成用于通孔30的金属膜32进行导通处理。版权所有（C）2007 ，JPO＆INPIT

5. 发明专利

JP2007019132A Method of manufacturing piezoelectric vibrating device 审中-公开
标题翻译：制造压电振动器件的方法
公开(公告)号：JP2007019132A
公开(公告)日：2007-01-25
申请号：JP2005197081
申请日：2005-07-06
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H01L23/02 , H03H3/08 , H03H9/25
CPC分类号： H03H9/1092 , H03H9/02992 , Y10T29/42 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/49798
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibrating device which is capable of improving the reliability of airtightness inside a sealed member, and of a conduction between an extraction electrode and an external electrode without causing a short circuit to the extraction electrode and the metal of an anode joint. SOLUTION: A junction electrode 25 and an extraction electrode 23 are connected together with an inter-electrode joint 27, the junction electrode 25 and a peripheral glass film 33 are bonded together by anodic bonding, the extraction electrode 23 and a through-hole glass film 34 are bonded together by anodic bonding, and the inter-electrode joint 27 is cut off after an anodic bonding step is finished. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案：提供一种压电振动装置的制造方法，其能够提高密封部件内的气密性的可靠性，以及提取电极与外部电极之间的导通性，而不会导致短路提取电极和阳极接头的金属。解决方案：接合电极25和引出电极23与电极间接合部27连接，接合电极25和周边玻璃膜33通过阳极接合而接合在一起，提取电极23和通孔通过阳极接合将空穴玻璃膜34接合在一起，在阳极结合工序结束后切断电极间接合部27。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006333289A Surface acoustic wave element 审中-公开
标题翻译：表面声波元件
公开(公告)号：JP2006333289A
公开(公告)日：2006-12-07
申请号：JP2005156716
申请日：2005-05-30
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H03H9/145
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave element which can be miniaturized and by which productivity of an inspection is enhanced and cost reduction is realized.
SOLUTION: A SAW resonant element 100 is provided with a piezoelectric substrate 120, an IDT electrode 130 formed on the surface of the piezoelectric substrate 120 and constituted by intersection between a first comb electrode 140 and a second comb electrode 150, a first reflector 160 and a second reflector 170 provided on both side of the direction that surface waves of the IDT electrode 130 are propagated. A first leading electrode 143 is extended and formed by continuing a power supply conductor 142 of the first comb electrode 140 and a power supply conductor 172 of the second reflector 172 adjacent to each other. A second drawing electrode 153 is extended and formed by continuing a power supply conductor 152 of the second comb electrode 150 and a power supply conductor 163 of the first reflector 160 adjacent to each other. The first leading electrode 143 and the second leading electrode 153 are set so that each of which includes probe contact areas and distance between the first leading electrode 143 and the second leading electrode 153 has distance A between terminals of a standard probe.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供能够小型化的声表面波元件，提高检查的生产率，实现成本降低。解决方案：SAW谐振元件100设置有压电基板120，形成在压电基板120的表面上并由第一梳状电极140和第二梳状电极150之间的交叉构成的IDT电极130，第一反射器160和设置在传播IDT电极130的表面波的方向的两侧的第二反射器170。第一引出电极143通过连续地连接第一梳状电极140的电源导体142和第二反射器172的电源导体172而延伸和形成。第二牵引电极153通过使第二梳状电极150的电源导体152和第一反射器160的电源导体163彼此相邻地延伸并形成。第一引出电极143和第二引出电极153被设置为使得每个包括探针接触区域，并且第一引出电极143和第二引出电极153之间的距离在标准探针的端子之间具有距离A. 版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006270170A Elastic surface acoustic wave element and manufacturing method of elastic surface acoustic wave element 审中-公开
标题翻译：弹性表面声波元件和弹性表面声波元件的制造方法
公开(公告)号：JP2006270170A
公开(公告)日：2006-10-05
申请号：JP2005081340
申请日：2005-03-22
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H03H9/25 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To provide an SAW element exhibiting good mechanical strength such as a sticking tendency or bending strength after it is mounted on a printed board even in the case of a small and thin SAW element.
SOLUTION: In an SAW element formed by bonding an elastic surface acoustic element piece having at least an interdigital electrode, a lead out electrode connected with the interdigital electrode, and a bonding film of a metal pattern surrounding these electrodes formed on one major surface of a piezoelectric substrate to a cover substrate formed with a through hole at a position on the major surface thereof corresponding to the lead out electrode, and having one major surface arranged with a metal pattern at a position around the through hole overlapping the lead out electrode and a position corresponding to the bonding film and the other major surface arranged with an external electrode where the through hole is coated with a metal film for conduction, a recess is formed on the other major surface of the cover substrate such that at least a part thereof overlaps a position for arranging the external electrode.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在小型和薄型SAW元件的情况下，也可以在安装在印刷电路板上之后提供表现出良好的机械强度（例如粘着倾向或弯曲强度）的SAW元件。解决方案：在通过粘合形成有至少一个指状电极的弹性表面声学元件件，与指状电极连接的引出电极和围绕这些电极的金属图案的接合膜形成的SAW元件中，形成在一个主体上压电基板的表面形成在与引出电极对应的主表面上的通孔处形成有通孔的盖基板，并且在通孔周围的位置处布置有金属图案的一个主表面与引出线重叠电极和对应于接合膜的位置，而另一个主表面布置有外部电极，其中通孔涂覆有用于导电的金属膜，在盖基板的另一主表面上形成凹部，使得至少一个其一部分与用于布置外部电极的位置重叠。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2014107317A Method of manufacturing package for electronic device, electronic device, electronic apparatus, and mobile 审中-公开
标题翻译：电子设备制造方法，电子设备，电子设备和手机
公开(公告)号：JP2014107317A
公开(公告)日：2014-06-09
申请号：JP2012257164
申请日：2012-11-26
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H01L23/02 , G01C19/5628
CPC分类号： H01L2924/16195
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a package for electronic device which allows for facilitation of degassing and sealing in a cavity.SOLUTION: A method of manufacturing a package for electronic device comprises a bonding step of bonding a planar lid 92 having an outer peripheral surface 92c connecting the front and back surfaces 92a, 92b, and a base 91 provided with a housing space 14 for housing a gyroscope element 2. The bonding step includes a first bonding step of forming a groove 94, interconnecting the housing space 14 and the outside, in the surface of the lid 92 on the side bonded to the base 91, and bonding a portion excepting the portion corresponding to the groove 94, out of the scheduled bonding part of the base 91 and lid 92, by seam welding, and a second bonding step of bonding the portion corresponding to the groove 94, out of the scheduled bonding part, by energy beam (laser light 98) welding.
摘要翻译：要解决的问题：提供制造用于电子设备的包装的方法，其允许促进空腔中的脱气和密封。解决方案：一种制造用于电子设备的包装的方法包括：接合步骤，其结合具有连接前表面92a和后表面92b的外周表面92c和设置有用于容纳陀螺仪元件2的容纳空间14的基座91.接合步骤包括形成沟槽94的第一接合步骤，将沟槽94互连， 14和外侧，在与基座91接合的一侧的盖92的表面中，将与槽94相对应的部分以外的部分从基座91和盖92的预定接合部分接合到接缝以及通过能量束（激光98）焊接将与对应于槽94的部分对准预定接合部分的第二接合步骤。

9. 发明专利

JP2014107316A Lid, package, electronic device, mobile, and manufacturing method for mobile 审中-公开
标题翻译： LID，PACKAGE，电子设备，手机，以及手机制造方法
公开(公告)号：JP2014107316A
公开(公告)日：2014-06-09
申请号：JP2012257159
申请日：2012-11-26
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA
IPC分类号： H01L23/02
CPC分类号： H01L2924/16195
摘要： PROBLEM TO BE SOLVED: To provide a lid which can facilitate degassing and sealing in a cavity while reducing the cost, and to provide a package and an electronic device using the same.SOLUTION: A lid 92 as a cover comprises: a first surface 92a and a second surface 92b having a relation of the front and back; an outer peripheral surface 92c connecting the first and second surfaces 92a, 92b; first bottomed grooves 94a, 94b provided in the first surface 92a from the outer peripheral surface 92c toward the central part, in the plan view; and second bottomed grooves 94a', 94b' provided in the second surface 92b from the outer peripheral surface 92c toward the central part, in the plan view.
摘要翻译：要解决的问题：提供一种能够有助于减少空腔中的脱气和密封的盖，并且提供一种包装和使用其的电子装置。解决方案：作为盖的盖92包括：第一表面92a 以及具有前后关系的第二表面92b; 连接第一表面92a和第二表面92b的外周表面92c; 在平面图中，从外周面92c朝向中央部设置在第一面92a中的第一有底槽94a，94b; 以及在平面图中从外周面92c朝向中央部设置在第二面92b上的第二有底槽94a'，94b'。

10. 发明专利

JP2014106016A Package manufacturing method for electronic device, electronic device, electronic apparatus, and moving body 有权
标题翻译：电子设备，电子设备，电子设备和移动体的包装制造方法
公开(公告)号：JP2014106016A
公开(公告)日：2014-06-09
申请号：JP2012257160
申请日：2012-11-26
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： AOKI SHINYA , SHIMURA TADASHI
IPC分类号： G01C19/5628 , H01L23/02
CPC分类号： H01L2924/16195
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a package for an electronic device, which is able to facilitate deaeration and seal of a cavity.SOLUTION: A manufacturing method for a package for an electronic device, in which a base 91 and a rid 92 are joined while an internal space for accommodating therein a gyro element 2, which is an electronic part, is formed between the base 91 and the lid 92, as a cover, comprises: a first joining step in which the base 91 and rid 92 are joined such that a groove 94 for communication between the internal space and outside is formed on the back 92b of the rid 92, which back is jointed to the base 91, the parts of the base 91 and rid 92 to be joined, except a portion corresponding to the groove 94, are joined by a seam weld; and a second joining step in which a portion including the outside end of the groove 94 of the parts to be joined are joined by weld using a laser beam 98.
摘要翻译：要解决的问题：提供一种能够促进空腔的脱气和密封的用于电子设备的包装的制造方法。解决方案：一种用于电子设备的包装的制造方法，其中基底91和连接件92的内部空间用于容纳其中作为电子部件的陀螺元件2的内部空间形成在基座91和盖92之间，作为盖，包括：第一接合步骤，其中基座91和摆动 92接合，使得用于在内部空间和外部之间连通的槽94形成在摆动件92的后部92b上，该后部92b连接到基座91，基座91和摆动件92的待接合部分，除了对应于凹槽94的部分通过缝焊接合; 以及第二接合步骤，其中包括待接合部件的凹槽94的外端的部分使用激光束98通过焊接而接合。

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