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    • 3. 发明专利
    • Substrate processing device and substrate processing method
    • 基板处理装置和基板处理方法
    • JP2007096299A
    • 2007-04-12
    • JP2006249980
    • 2006-09-14
    • Samsung Electronics Co Ltd三星電子株式会社Samsung Electronics Co.,Ltd.
    • JEON YUN-KWANGLEE YUNG-HEELEE JIN-SEOK
    • H01L21/302H01J37/305H05H1/46
    • H01J37/321H01J37/32357
    • PROBLEM TO BE SOLVED: To provide a substrate processing device having a simple structure in which dielectric breakdown of an insulating film to be processed is reduced. SOLUTION: This device comprises: a substrate mounting part on which a substrate to be processed is mounted; a first plasma space and a second plasma space sequentially provided above the substrate mounting part; a first extraction electrode positioned between the first plasma space and the second plasma space for selectively extracting one from a positive ion and an electron of a plasma generated in the second plasma space; a second extraction electrode positioned between the first plasma space and the substrate mounting part for extracting the positive ion and the electron from the plasma of the first plasma space; and a vacuum chamber housing the substrate mounting part, the first plasma space and the second plasma space. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种具有简单结构的基板处理装置,其中要处理的绝缘膜的绝缘击穿减小。 解决方案:该装置包括:基板安装部,其上安装有待加工的基板; 依次设置在所述基板安装部的上方的第一等离子体空间和第二等离子体空间; 位于第一等离子体空间和第二等离子体空间之间的第一提取电极,用于从第二等离子体空间中产生的等离子体的正离子和电子中选择性地提取一个; 位于第一等离子体空间和基板安装部之间的第二提取电极,用于从第一等离子体空间的等离子体中提取正离子和电子; 以及容纳基板安装部,第一等离子体空间和第二等离子体空间的真空室。 版权所有(C)2007,JPO&INPIT